Matches 1 - 50 out of 76 1 2 >
Match Document Document Title
7425499 Methods for forming interconnects in vias and microelectronic workpieces including such interconnects  
Methods for forming interconnects in blind vias or other types of holes, and microelectronic workpieces having such interconnects. The blind vias can be formed by first removing the bulk of the...
7423336 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices  
A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations...
7413979 Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices  
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and dies are disclosed herein. In one...
7375009 Method of forming a conductive via through a wafer  
Through vias in a substrate are formed by creating a trench in a top side of the substrate and at least one trench in the back side of the substrate. The sum of the depths of the trenches at least...
7368812 Interposers for chip-scale packages and intermediates thereof  
A carrier substrate, or interposer, for use in a chip-scale package includes a material, such as a semiconductive material, that has a coefficient of thermal expansion that is the same or similar...
7368810 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7358154 Method for fabricating packaged die  
Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the...
7347348 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece  
Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a...
7336091 Assembly for simultaneously testing multiple electronic components  
An assembly for simultaneously electrically testing a plurality of electronic components. There is a test fixture, and a lead frame carrying a plurality of electronic components to be tested, each...
7332376 Method of encapsulating packaged microelectronic devices with a barrier  
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
7329949 Packaged microelectronic devices and methods for packaging microelectronic devices  
Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a...
7316063 Methods of fabricating substrates including at least one conductive via  
A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures....
7312101 Packaged microelectronic devices and methods for packaging microelectronic devices  
Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a...
7282805 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element  
A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that...
7282397 Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices  
A rerouting element for a semiconductor device includes a substantially planar member that carries at least one contact location, at least one conductive, at least one rerouted bond pad. The...
7271491 Carrier for wafer-scale package and wafer-scale package including the carrier  
A carrier for use in a chip-scale package, including a semiconductor substrate, such as a semiconductor wafer, with a plurality of apertures formed therethrough. The present invention also includes...
7271086 Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces  
Methods for forming a redistribution layer on microfeature workpieces, and microfeature workpieces having such a redistribution layer are disclosed herein. In one embodiment, a method includes...
7259451 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7256074 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods  
Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices are disclosed herein. One aspect of the invention is directed toward a...
7256069 Wafer-level package and methods of fabricating  
A carrier for use in a chip-scale package, including a polymeric film with apertures defined therethrough. The apertures, which are alignable with corresponding bond pads of a semiconductor device,...
7218003 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods  
Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices. One aspect of the invention is directed toward a microelectronic...
7215015 Imaging system  
A semiconductor package includes a substrate, and a semiconductor die flip chip mounted to the substrate. The package also includes substrate circuitry on a circuit side of the substrate, die...
7195957 Packaged microelectronic components  
A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral...
7173330 Multiple chip semiconductor package  
A semiconductor device package and method of fabricating the same. The semiconductor device package may include a variety of semiconductor dice, thereby providing a system on a chip solution. The...
7148578 Semiconductor multi-chip package  
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is...
7145228 Microelectronic devices  
Methods for packaging microelectronic devices and microelectronic devices formed by such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of microelectronic...
7135780 Semiconductor substrate for build-up packages  
The present invention provides techniques to fabricate build-up single or multichip modules. In one embodiment, this is accomplished by dispensing die-attach material in one or more pre-etched...
7122905 Microelectronic devices and methods for mounting microelectronic packages to circuit boards  
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can...
7109063 Semiconductor substrate for build-up packages  
The present invention provides techniques to fabricate build-up single or multichip modules. In one embodiment, this is accomplished by dispensing die-attach material in one or more pre-etched...
7101737 Method of encapsulating interconnecting units in packaged microelectronic devices  
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
7094631 Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices  
A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations...
7087992 Multichip wafer level packages and computing systems incorporating same  
The present invention defines a packaging implementation providing a multichip multilayer system on a chip solution. Greater integration of a plurality and variety of known good die contained...
7049685 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices  
Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In...
7018869 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods  
Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices. One aspect of the invention is directed toward a microelectronic...
6987325 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element  
A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations...
6987031 Multiple chip semiconductor package and method of fabricating same  
A semiconductor device package and method of fabricating the same. The semiconductor device package may include a variety of semiconductor dice, thereby providing a system on a chip solution. The...
6983551 Interconnecting substrates for electrical coupling of microelectronic components  
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
6982386 Interconnecting substrates for electrical coupling of microelectronic components  
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
6979595 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices  
Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In...
6969632 Method for fabricating image sensor semiconductor package  
A semiconductor package includes a substrate, and a semiconductor die flip chip mounted to the substrate. The package also includes substrate circuitry on a circuit side of the substrate, die...
6964881 Multi-chip wafer level system packages and methods of forming same  
The present invention defines a packaging implementation providing a multichip multilayer system on a chip solution. Greater integration of a plurality and variety of known good die are contained...
6958537 Multiple chip semiconductor package  
A semiconductor device package is disclosed. The semiconductor device package may include a variety of semiconductor dice, thereby providing a system on a chip solution. The semiconductor dice are...
6951982 Packaged microelectronic component assemblies  
Various aspects of the invention provide microelectronic component assemblies, memory modules, computer systems, and methods of assembling microelectronic component assemblies. In one particular...
6946325 Methods for packaging microelectronic devices  
Methods for packaging microelectronic devices and microelectronic devices formed by such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of microelectronic...
6943450 Packaged microelectronic devices and methods of forming same  
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
6933170 Packaged microelectronic component assemblies  
Various aspects of the present invention provide microelectronic component assemblies and methods for packaging such assemblies. In one example, a microelectronic component assembly includes a...
6894386 Apparatus and method for packaging circuits  
Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the...
6885101 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods  
Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices. One aspect of the invention is directed toward a microelectronic...
6882036 Apparatuses for forming thin microelectronic dies  
Methods and apparatuses for forming thin microelectronic dies. A method in accordance with one embodiment of the invention includes releasably attaching a microelectronic substrate to a support...
6876066 Packaged microelectronic devices and methods of forming same  
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
Matches 1 - 50 out of 76 1 2 >