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7425470 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7405487 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7368810 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7365424 Microelectronic component assemblies with recessed wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7332376 Method of encapsulating packaged microelectronic devices with a barrier  
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
7306974 Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies  
Packaged microelectronic devices, methods for packaging microelectronic devices, and methods of operating microelectronic devices. In one embodiment, a packaged microelectronic device comprises a...
7273769 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7259451 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7250328 Microelectronic component assemblies with recessed wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7218001 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components  
The present disclosure describes microfeature workpieces, microelectronic component packages, and methods of forming microelectronic components and microelectronic component packages. In one...
7202111 Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device  
A microelectronic package and a method of forming the same comprising a microelectronic device attached by an active surface to a substrate. A heat dissipation device having a base portion is...
7195957 Packaged microelectronic components  
A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral...
7157310 Methods for packaging microfeature devices and microfeature devices formed by such methods  
Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one...
7122905 Microelectronic devices and methods for mounting microelectronic packages to circuit boards  
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can...
7109588 Method and apparatus for attaching microelectronic substrates and support members  
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
7101737 Method of encapsulating interconnecting units in packaged microelectronic devices  
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
7091064 Method and apparatus for attaching microelectronic substrates and support members  
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
7067905 Packaged microelectronic devices including first and second casings  
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
7057281 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7049685 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices  
Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In...
7022533 Substrate mapping  
A method for fabricating semiconductor die packages including a mounting substrate and dice attached thereto. The mounting substrate includes multiple die attach sites and a designator having...
6989121 Method for encasing plastic array packages  
The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array...
6988882 Transfer molding of integrated circuit packages  
A method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly. The mold has a first portion and a second portion with the first portion having first and second...
6983551 Interconnecting substrates for electrical coupling of microelectronic components  
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
6982386 Interconnecting substrates for electrical coupling of microelectronic components  
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
6979595 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices  
Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In...
6951982 Packaged microelectronic component assemblies  
Various aspects of the invention provide microelectronic component assemblies, memory modules, computer systems, and methods of assembling microelectronic component assemblies. In one particular...
6943450 Packaged microelectronic devices and methods of forming same  
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
6933170 Packaged microelectronic component assemblies  
Various aspects of the present invention provide microelectronic component assemblies and methods for packaging such assemblies. In one example, a microelectronic component assembly includes a...
6924550 Packaged microelectronic devices and methods for assembling microelectronic devices  
Packaged microelectronic devices and methods for assembling microelectronic devices are disclosed herein. In one embodiment, a method of assembling a microelectronic device having a die and an...
6921860 Microelectronic component assemblies having exposed contacts  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
6893244 Apparatus for encasing array packages  
The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array...
6888159 Substrate mapping  
A method and apparatus relating to fabricating semiconductor die packages including a mounting substrate and dice attached thereto. The mounting substrate includes multiple die attach sites and a...
6879050 Packaged microelectronic devices and methods for packaging microelectronic devices  
Methods and apparatuses for packaging a microelectronic device. One embodiment can include a packaged microelectronic device comprising a microelectronic die, an interposer substrate, and a casing...
6876066 Packaged microelectronic devices and methods of forming same  
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
6841796 Substrate mapping  
A method and apparatus relating to fabricating semiconductor die packages including a mounting substrate and dice attached thereto. The mounting substrate includes multiple die attach sites and a...
6841423 Methods for formation of recessed encapsulated microelectronic devices  
A method for manufacturing microelectronic device packages. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first...
6838760 Packaged microelectronic devices with interconnecting units  
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
6836009 Packaged microelectronic components  
A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral...
6819003 Recessed encapsulated microelectronic devices and methods for formation  
A microelectronic device package and method for manufacture. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first...
6815261 Encapsulation method in a molding machine for an electronic device  
A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member...
6808947 Substrate mapping  
A method for fabricating semiconductor die packages including a mounting substrate and dice attached thereto. The mounting substrate includes multiple die attach sites and a designator having...
6796028 Method of Interconnecting substrates for electrical coupling of microelectronic components  
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
6781066 Packaged microelectronic component assemblies  
Various aspects of the present invention provide microelectronic component assemblies and methods for packaging such assemblies. In one example, a microelectronic component assembly includes a...
6767765 Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device  
A microelectronic package and a method of forming the same comprising a microelectronic device attached by an active surface to a substrate. A heat dissipation device having a base portion is...
6743389 Resin molding machine and method of resin molding  
The resin molding machine and a method of resin molding of the present invention are capable of securely and efficiently mold a work piece, on which a plurality of elements are arranged. The resin...
6740546 Packaged microelectronic devices and methods for assembling microelectronic devices  
Packaged microelectronic devices and methods for assembling microelectronic devices are disclosed herein. In one embodiment, a method of assembling a microelectronic device having a die and an...
6683388 Method and apparatus for packaging a microelectronic die  
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
6677675 Microelectronic devices and microelectronic die packages  
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
6664139 Method and apparatus for packaging a microelectronic die  
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
Matches 1 - 50 out of 64 1 2 >