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7425470 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
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7405487 |
Method and apparatus for removing encapsulating material from a packaged microelectronic device
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
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7368810 |
Invertible microfeature device packages
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
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7365424 |
Microelectronic component assemblies with recessed wire bonds and methods of making same
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
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7332376 |
Method of encapsulating packaged microelectronic devices with a barrier
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
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7306974 |
Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies
Packaged microelectronic devices, methods for packaging microelectronic devices, and methods of operating microelectronic devices. In one embodiment, a packaged microelectronic device comprises a...
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7273769 |
Method and apparatus for removing encapsulating material from a packaged microelectronic device
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
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7259451 |
Invertible microfeature device packages
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
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7250328 |
Microelectronic component assemblies with recessed wire bonds and methods of making same
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
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7218001 |
Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
The present disclosure describes microfeature workpieces, microelectronic component packages, and methods of forming microelectronic components and microelectronic component packages. In one...
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7195957 |
Packaged microelectronic components
A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral...
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7157310 |
Methods for packaging microfeature devices and microfeature devices formed by such methods
Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one...
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7122905 |
Microelectronic devices and methods for mounting microelectronic packages to circuit boards
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can...
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7109588 |
Method and apparatus for attaching microelectronic substrates and support members
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
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7101737 |
Method of encapsulating interconnecting units in packaged microelectronic devices
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
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7091064 |
Method and apparatus for attaching microelectronic substrates and support members
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite...
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7067905 |
Packaged microelectronic devices including first and second casings
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
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7057281 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
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7049685 |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In...
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6983551 |
Interconnecting substrates for electrical coupling of microelectronic components
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
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6982386 |
Interconnecting substrates for electrical coupling of microelectronic components
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
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6979595 |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In...
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6951982 |
Packaged microelectronic component assemblies
Various aspects of the invention provide microelectronic component assemblies, memory modules, computer systems, and methods of assembling microelectronic component assemblies. In one particular...
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6943450 |
Packaged microelectronic devices and methods of forming same
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
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6933170 |
Packaged microelectronic component assemblies
Various aspects of the present invention provide microelectronic component assemblies and methods for packaging such assemblies. In one example, a microelectronic component assembly includes a...
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6924550 |
Packaged microelectronic devices and methods for assembling microelectronic devices
Packaged microelectronic devices and methods for assembling microelectronic devices are disclosed herein. In one embodiment, a method of assembling a microelectronic device having a die and an...
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6921860 |
Microelectronic component assemblies having exposed contacts
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
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6879050 |
Packaged microelectronic devices and methods for packaging microelectronic devices
Methods and apparatuses for packaging a microelectronic device. One embodiment can include a packaged microelectronic device comprising a microelectronic die, an interposer substrate, and a casing...
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D503691 |
Conductive clip for a semiconductor package
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6876066 |
Packaged microelectronic devices and methods of forming same
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
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6841423 |
Methods for formation of recessed encapsulated microelectronic devices
A method for manufacturing microelectronic device packages. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first...
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6838760 |
Packaged microelectronic devices with interconnecting units
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
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6836009 |
Packaged microelectronic components
A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral...
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6819003 |
Recessed encapsulated microelectronic devices and methods for formation
A microelectronic device package and method for manufacture. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first...
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6796028 |
Method of Interconnecting substrates for electrical coupling of microelectronic components
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
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6781066 |
Packaged microelectronic component assemblies
Various aspects of the present invention provide microelectronic component assemblies and methods for packaging such assemblies. In one example, a microelectronic component assembly includes a...
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6740546 |
Packaged microelectronic devices and methods for assembling microelectronic devices
Packaged microelectronic devices and methods for assembling microelectronic devices are disclosed herein. In one embodiment, a method of assembling a microelectronic device having a die and an...
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6683388 |
Method and apparatus for packaging a microelectronic die
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
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6677675 |
Microelectronic devices and microelectronic die packages
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
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6664139 |
Method and apparatus for packaging a microelectronic die
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
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6656769 |
Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
A method and apparatus for distributing a mold material in a mold for packaging microelectronic devices. In one embodiment, the microelectronic devices are placed on a substrate and the substrate...
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6653173 |
Method and apparatus for packaging a microelectronic die
The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed...
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6644949 |
Apparatus for reduced flash encapsulation of microelectronic devices
A method and apparatus for encapsulating microelectronic devices. In one embodiment, a microelectronic device is engaged with a support member having a first edge, a second edge opposite the first...
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6638595 |
Method and apparatus for reduced flash encapsulation of microelectronic devices
A method and apparatus for encapsulating microelectronic devices. In one embodiment, a microelectronic device is engaged with a support member having a first edge, a second edge opposite the first...
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6631807 |
Chip tray
A chip tray includes a first member ( 11 ) having an adhesive ( 13 ) on an upper face thereof and a second member ( 12 ) having upper and lower faces and at least one chip carrying section ( 14 )...
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6622380 |
Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can...
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6576494 |
Recessed encapsulated microelectronic devices and methods for formation
A microelectronic device package and method for manufacture. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first...
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6564979 |
Method and apparatus for dispensing adhesive on microelectronic substrate supports
A method and apparatus for dispensing adhesive on a support substrate for carrying microelectronic substrates. In one embodiment, the apparatus can include at least one dispense nozzle having at...
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6558600 |
Method for packaging microelectronic substrates
A method and apparatus for encapsulating a microelectronic substrate. In one embodiment, the apparatus can include a mold having an internal volume with a first portion configured to receive the...
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6472728 |
Condition sensitive adhesive tape for singulated die transport devices
The transport of singulated die devices ( 110 ) is improved by utilizing condition sensitive adhesive tape ( 102 ) in a die transport system ( 100 ). Condition sensitive adhesive tape ( 102 ) is...
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