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7422635 |
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
The present disclosure suggests several systems and methods for batch processing of microfeature workpieces, e.g., semiconductor wafers or the like. One exemplary implementation provides a method...
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7387685 |
Apparatus and method for depositing materials onto microelectronic workpieces
Reactors for vapor deposition of materials onto a microelectronic workpiece, systems that include such reactors, and methods for depositing materials onto microelectronic workpieces. In one...
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7378719 |
Low leakage MIM capacitor
Capacitor structures for use in integrated circuits and methods of their manufacture. The capacitor structures include a bottom electrode, a top electrode and a dielectric layer interposed between...
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7368343 |
Low leakage MIM capacitor
Capacitor structures for use in integrated circuits and methods of their manufacture. The capacitor structures include a bottom electrode, a top electrode and a dielectric layer interposed between...
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7344755 |
Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
The present disclosure provides methods and apparatus that may be used to process microfeature workpieces, e.g., semiconductor wafers. Some aspects have particular utility in depositing TiN in a...
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7335396 |
Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
Methods, apparatuses, and systems for controlling mass flow rates and pressures in passageways coupled to reaction chambers are disclosed herein. In one embodiment, a method includes controlling a...
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7323231 |
Apparatus and methods for plasma vapor deposition processes
One aspect of the invention is directed toward a method of forming a conductive layer on a microfeature workpiece. In one embodiment, the method comprises placing a microfeature workpiece in a...
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7282239 |
Systems and methods for depositing material onto microfeature workpieces in reaction chambers
In one embodiment, the system includes a gas supply assembly having a first gas source, a first gas conduit coupled to the first gas source, a first valve assembly, a reaction chamber, and a gas...
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7279398 |
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
The present disclosure provides methods and apparatus useful in depositing materials on batches of microfeature workpieces. One implementation provides a method in which a quantity of a first...
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7258892 |
Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
The present disclosure provides methods and systems for controlling temperature. The method has particular utility in connection with controlling temperature in a deposition process, e.g., in...
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7235138 |
Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
The present disclosure describes apparatus and methods for processing microfeature workpieces, e.g., by depositing material on a microelectronic semiconductor using atomic layer deposition. Some of...
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7220670 |
Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by same
A method for depositing a rough polysilicon film on a substrate is disclosed. The method includes introducing the reactant gases argon and silane into a deposition chamber and enabling and...
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7056806 |
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
The present disclosure provides methods and apparatus useful in depositing materials on batches of microfeature workpieces. One implementation provides a method in which a quantity of a first...
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6861330 |
Structures and methods for enhancing capacitors in integrated circuits
Systems, devices, structures, and methods are described that inhibit dielectric degradation in the presence of contaminants. An enhanced capacitor in a dynamic random access memory cell is...
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6831324 |
Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by the same
A method for depositing a rough polysilicon film on a substrate is disclosed. The method includes introducing the reactant gases argon and silane into a deposition chamber and enabling and...
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6696716 |
Structures and methods for enhancing capacitors in integrated ciruits
Systems, devices, structures, and methods are described that inhibit dielectric degradation in the presence of contaminants. An enhanced capacitor in a dynamic random access memory cell is...
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6476432 |
Structures and methods for enhancing capacitors in integrated circuits
Systems, devices, structures, and methods are described that inhibit dielectric degradation in the presence of contaminants. An enhanced capacitor in a dynamic random access memory cell is...
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6468856 |
High charge storage density integrated circuit capacitor
An integrated circuit capacitor comprising a high permittivity dielectric and a method of forming the same are disclosed herein. In one embodiment, this capacitor may be used as a DRAM storage...
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6461931 |
Thin dielectric films for DRAM storage capacitors
Methods for forming multiple dielectric layers at low temperatures include forming a number of metallic layers on a substrate and oxidizing the metallic layers to different dielectric oxides....
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6268299 |
Variable stoichiometry silicon nitride barrier films for tunable etch selectivity and enhanced hyrogen permeability
A low-temperature process for forming a highly conformal barrier film during integrated circuit manufacture by low pressure chemical vapor deposition (LPCVD). The process includes the following...
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