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7427535 Semiconductor/printed circuit board assembly, and computer system  
A method of forming a computer system and a printed circuit board assembly, are provided comprising first and second semiconductor dies and an intermediate substrate. The intermediate substrate is...
7425470 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7419851 Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal  
A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a metal containment wall and a solder layer in which the metal containment wall includes a cavity...
7414319 Semiconductor chip assembly with metal containment wall and solder terminal  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a...
7413979 Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices  
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and dies are disclosed herein. In one...
7411297 Microfeature devices and methods for manufacturing microfeature devices  
Microfeature devices, microfeature workpieces, and methods for manufacturing microfeature devices and microfeature workpieces are disclosed herein. The microfeature workpieces have an integrated...
7408255 Assembly for stacked BGA packages  
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid...
7405487 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7400032 Module assembly for stacked BGA packages  
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid...
7399657 Ball grid array packages with thermally conductive containers  
Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the...
7396702 Module assembly and method for stacked BGA packages  
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid...
7385298 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7381591 Flip-chip adaptor package for bare die  
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead...
7378736 Ball grid array structures having tape-based circuitry  
Semiconductor device packages formed in accordance with methods of packaging semiconductor dice in grid array-type semiconductor device packages using conventional lead frame or lead lock tape...
7378723 Method and apparatus for decoupling conductive portions of a microelectronic device package  
A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member...
7368810 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7365424 Microelectronic component assemblies with recessed wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7347348 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece  
Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a...
7344061 Multi-functional solder and articles made therewith, such as microelectronic components  
Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation...
7335995 Microelectronic assembly having array including passive elements and interconnects  
A microelectronic assembly and a fabrication method are provided which includes a microelectronic element such as a chip or element of a package. A plurality of surface-mountable contacts are...
7335988 Use of palladium in IC manufacturing with conductive polymer bump  
An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a...
7332376 Method of encapsulating packaged microelectronic devices with a barrier  
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
7329945 Flip-chip adaptor package for bare die  
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead...
7323772 Ball grid array structures and tape-based method of manufacturing same  
Semiconductor device packages formed in accordance with methods of packaging semiconductor dice in grid array-type semiconductor device packages using conventional lead frame or lead lock tape...
7319265 Semiconductor chip assembly with precision-formed metal pillar  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically...
7306974 Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies  
Packaged microelectronic devices, methods for packaging microelectronic devices, and methods of operating microelectronic devices. In one embodiment, a packaged microelectronic device comprises a...
7304382 Managed memory component  
The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry to reduce footprint for the combination. A leaded IC package is...
7298025 Microelectronic component assemblies and microelectronic component lead frame structures  
The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of...
7279797 Module assembly and method for stacked BGA packages  
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The...
7279364 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Flip-chip adaptor package for bare die  
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead...
7273769 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7259451 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7253089 Microfeature devices and methods for manufacturing microfeature devices  
Microfeature devices, microfeature workpieces, and methods for manufacturing microfeature devices and microfeature workpieces are disclosed herein. The microfeature workpieces have an integrated...
7250328 Microelectronic component assemblies with recessed wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7247520 Microelectronic component assemblies and microelectronic component lead frame structures  
The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of...
7239029 Packages for semiconductor die  
A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the...
7232707 Method of making a semiconductor chip assembly with an interlocked contact terminal  
A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to...
7232706 Method of making a semiconductor chip assembly with a precision-formed metal pillar  
A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to...
7218001 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components  
The present disclosure describes microfeature workpieces, microelectronic component packages, and methods of forming microelectronic components and microelectronic component packages. In one...
7217597 Die stacking scheme  
An improved semiconductor die stacking scheme is provided. In accordance with one embodiment of the present invention, a method of stacking a plurality of semiconductor die is provided. In...
7201304 Multi-functional solder and articles made therewith, such as microelectronic components  
Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation...
7199037 Microfeature devices and methods for manufacturing microfeature devices  
Microfeature devices, microfeature workpieces, and methods for manufacturing microfeature devices and microfeature workpieces are disclosed herein. The microfeature workpieces have an integrated...
7195957 Packaged microelectronic components  
A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral...
7190060 Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same  
A three-dimensional stacked semiconductor package device includes first and second semiconductor package devices and a conductive bond. The first device includes a first insulative housing, a first...
7183645 Semiconductor device with external terminal joined to concave portion of wiring layer  
A semiconductor device includes a semiconductor chip provided with an integrated circuit and a pad that is electrically connected to the integrated circuit. A wiring layer has a concave portion and...
7183485 Microelectronic component assemblies having lead frames adapted to reduce package bow  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the...
7183138 Method and apparatus for decoupling conductive portions of a microelectronic device package  
A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member...
7176655 Battery pack with built in communication port  
A system and method for providing a communication port integral with a battery pack assembly is disclosed. The system provides a pathway between an external unit and a host unit via a printed...
7170161 In-process semiconductor packages with leadframe grid arrays  
Methods of forming a semiconductor assembly are described which include a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An...
7157310 Methods for packaging microfeature devices and microfeature devices formed by such methods  
Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one...
Matches 1 - 50 out of 253 1 2 3 4 5 6 >