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7368810 |
Invertible microfeature device packages
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
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7259451 |
Invertible microfeature device packages
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
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7195957 |
Packaged microelectronic components
A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral...
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6979596 |
Method of fabricating a tape having apertures under a lead frame for conventional IC packages
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
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6951982 |
Packaged microelectronic component assemblies
Various aspects of the invention provide microelectronic component assemblies, memory modules, computer systems, and methods of assembling microelectronic component assemblies. In one particular...
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6943450 |
Packaged microelectronic devices and methods of forming same
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
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6929485 |
Lead frame with interdigitated pins
A lead frame includes pins for a plurality of parts. The pins for the plurality of the parts include first pins for a first part and first pins for a second part. The first pins for the first part...
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6921966 |
Tape under frame for lead frame IC package assembly
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
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6894372 |
Tape under frame for lead frame IC package assembly
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
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6876066 |
Packaged microelectronic devices and methods of forming same
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
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6858927 |
Semiconductor packages and methods for making the same
Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making...
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6841423 |
Methods for formation of recessed encapsulated microelectronic devices
A method for manufacturing microelectronic device packages. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first...
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6835604 |
Methods for transverse hybrid LOC package
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
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6819003 |
Recessed encapsulated microelectronic devices and methods for formation
A microelectronic device package and method for manufacture. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first...
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6779258 |
Semiconductor packages and methods for making the same
Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making...
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6756689 |
Power device having multi-chip package structure
A power device having a multi-chip package structure and a manufacturing method therefor are provided. In the power device, a transistor, which is a switching device, and a control integrated...
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6753598 |
Transverse hybrid LOC package
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
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6749711 |
Apparatus and methods for coverlay removal and adhesive application
Apparatus and methods for synchronously removing coverlay film from an adhesive film and applying an adhesive strip cut from the adhesive film to cover one or more reject die sites and/or...
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6737734 |
Structure and method for securing bussing leads
A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads...
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6576494 |
Recessed encapsulated microelectronic devices and methods for formation
A microelectronic device package and method for manufacture. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first...
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6548764 |
Semiconductor packages and methods for making the same
Semiconductor package support elements including cover members attached to one or more reject die sites are provided. Methods for making the support elements of the present invention and for making...
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6545343 |
Hybrid frame with lead-lock tape
A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads...
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6531342 |
Method for transverse hybrid loc package
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
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6518650 |
Tape under frame for lead frame IC package assembly
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
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6476468 |
Transverse hybrid LOC package
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
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6406943 |
Transverse hybrid LOC package
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
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6259153 |
Transverse hybrid LOC package
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
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6251708 |
Hybrid frame with lead-lock tape
A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads...
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6218216 |
Transverse hybrid LOC package
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
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6215177 |
Tape under frame for conventional-type IC package assembly
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
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6150710 |
Transverse hybrid LOC package
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
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6146922 |
Hybrid frame with lead-lock tape
A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die is provided where the leads...
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6143589 |
Tape under frame for conventional-type IC package assembly
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
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6124150 |
Transverse hybrid LOC package
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
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6091133 |
Assembly of a semiconductor device and paddleless lead frame having tape extending between the lead fingers
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
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6008531 |
Hybrid frame with lead-lock tape
A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads...
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5915166 |
Tape under frame for conventional-type IC package assembly
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
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5900582 |
Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
A leadframe for producing a semiconductor device having a lead-on chip (LOC) structure with leads extending across a semiconductor chip, the leadframe includes a frame for a die pad having an outer...
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5897340 |
Hybrid frame with lead-lock tape
A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads...
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5763829 |
Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe
A high-reliability semiconductor device and a method of producing the device. Absorption of moisture into a semiconductor device is effectively avoided by using a hard solder material, such as...
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5729049 |
Tape under frame for conventional-type IC package assembly
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
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5717246 |
Hybrid frame with lead-lock tape
A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extends over a surface of the semiconductor die are provided where the leads...
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