Matches 1 - 48 out of 48
Match Document Document Title
7427819 Film-bulk acoustic wave resonator with motion plate and method  
An apparatus and method for measuring a target environmental variable (TEV) that employs a film-bulk acoustic resonator with motion plate. The film-bulk acoustic resonator (FBAR) includes an...
7425787 Acoustic galvanic isolator incorporating single insulated decoupled stacked bulk acoustic resonator with acoustically-resonant electrical insulator  
Embodiments of the acoustic galvanic isolator comprise a carrier signal source, a modulator connected to receive an information signal and the carrier signal, a demodulator, and an...
7424772 Stacked bulk acoustic resonator band-pass filter with controllable pass bandwidth  
The band-pass filter has a stacked pair of film bulk acoustic resonators (FBARs) and an acoustic decoupler between the FBARs. Each of the FBARs has opposed planar electrodes and a layer of...
7423503 Acoustic galvanic isolator incorporating film acoustically-coupled transformer  
Embodiments of the acoustic galvanic isolator comprise a carrier signal source, a modulator connected to receive an information signal and the carrier signal, a demodulator, and, connected between...
7408428 Temperature-compensated film bulk acoustic resonator (FBAR) devices  
The temperature-compensated film bulk acoustic resonator (FBAR) device comprises an FBAR stack. The FBAR stack comprises an FBAR and a temperature-compensating element. The FBAR is characterized by...
7400217 Decoupled stacked bulk acoustic resonator band-pass filter with controllable pass bandwith  
The band-pass filter has an upper film bulk acoustic resonator (FBAR), an upper FBAR stacked on the lower FBAR, and, between the FBARs, an acoustic decoupler comprising a layer of acoustic...
7391286 Impedance matching and parasitic capacitor resonance of FBAR resonators and coupled filters  
A film acoustically-coupled transformer (FACT) has a first and a second stacked bulk acoustic resonator (SBAR 1 , SBAR 2 ). Each SBAR has a stacked pair of film bulk acoustic resonators (FBARs)...
7391285 Film acoustically-coupled transformer  
One embodiment of the film acoustically-coupled transformer (FACT) includes a decoupled stacked bulk acoustic resonator (DSBAR) having a lower film bulk acoustic resonator (FBAR) an upper FBAR...
7388455 Film acoustically-coupled transformer with increased common mode rejection  
The film acoustically-coupled transformer (FACT) has a first and second decoupled stacked bulk acoustic resonators (DSBARs). Each DSBAR has a lower film bulk acoustic resonator (FBAR), an upper...
7388454 Acoustic resonator performance enhancement using alternating frame structure  
Disclosed is an acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and an alternating frame region. The first electrode is...
7378646 Optical device package having optical feedthrough  
An optical microbench configured to facilitate wafer-level testing of opto-electronic devices is provided. The optical microbench includes an optoelectronic device mounted to a wafer in which the...
7369013 Acoustic resonator performance enhancement using filled recessed region  
An acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and a fill region. The first electrode is adjacent the substrate, and the...
7367095 Method of making an acoustically coupled transformer  
Embodiments of an acoustically-coupled transformer have a first stacked bulk acoustic resonator (SBAR) and a second SBAR. Each of the SBARs has a lower film bulk acoustic resonator (FBAR) and an...
7362198 Pass bandwidth control in decoupled stacked bulk acoustic resonator devices  
The decoupled stacked bulk acoustic resonator (DSBAR) device has a lower film bulk acoustic resonator (FBAR), an upper FBAR stacked on the lower FBAR, and an acoustic decoupler between the FBARs....
7358831 Film bulk acoustic resonator (FBAR) devices with simplified packaging  
The encapsulated film bulk acoustic resonator (FBAR) device comprises a substrate, an FBAR stack over the substrate, an element for acoustically isolating the FBAR stack from the substrate,...
7345316 Wafer level packaging for optoelectronic devices  
An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A...
7332985 Cavity-less film bulk acoustic resonator (FBAR) devices  
The film bulk acoustic resonator (FBAR) device comprises a substrate, an acoustic Bragg reflector over the substrate, a piezoelectric element over the acoustic Bragg reflector, and a remote-side...
7329056 Device package and methods for the fabrication and testing thereof  
Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An...
7298030 Structure and method of making sealed capped chips  
A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly...
7265440 Methods and apparatus for packaging integrated circuit devices  
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an...
7246953 Optical device package  
An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber....
7224056 Back-face and edge interconnects for lidded package  
A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion...
7202560 Wafer bonding of micro-electro mechanical systems to active circuitry  
A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS...
7129576 Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps  
A capped chip is provided which includes a chip and a cap member, the chip having a front surface and a plurality of bond pads exposed at the front surface, the cap member having a bottom surface...
7098072 Fluxless assembly of chip size semiconductor packages  
A method for assembling semiconductor packages ( 10 ) includes forming corresponding pairs of conductive pads ( 14, 16, 20, 22 ) on respective surfaces of a die ( 12 ) and an interconnective...
7067397 Method of fabricating high yield wafer level packages integrating MMIC and MEMS components  
Monolithic microwave integrated circuit (MMIC) components and micro electromechanical systems (MEMS) components are integrated onto a single substrate at a wafer scale, by first performing MMIC and...
7042056 Chip-size package piezoelectric component  
A surface acoustic wave device includes a SAW having an IDT disposed on a piezoelectric substrate, a conductive pad connected to the IDT, and a bonding substrate, wherein the SAW is bonded to the...
6965107 Semiconductor-based encapsulated infrared sensor and electronic device  
An Al film is formed on a cap wafer and the Al film is patterned into a ring-shaped film. Dry etching is performed by using the ring-shaped film as a mask to form a drum portion enclosing a recess...
6956291 Apparatus and method for forming solder seals for semiconductor flip chip packages  
An apparatus and method for forming a substantially continuous solder bump around the periphery of each dice on a flip chip wafer is disclosed. The solder bump is provided on each die so that when...
6939784 Wafer scale package and method of assembly  
A plurality of electronic circuits and associated signal lines are positioned at respective locations on a base wafer. A cover wafer, which fits over the base wafer, includes a corresponding like...
6932519 Optical device package  
An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber....
6883977 Optical device package for flip-chip mounting  
An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive visa...
6846725 Wafer-level package for micro-electro-mechanical systems  
A method for forming wafers having through-wafer vias for wafer-level packaging of devices, the method comprising the steps of depositing metal on one of two wafers; bonding the two wafers using...
6825910 Sealing method of liquid crystal display panel and sealing apparatus for liquid crystal display panel  
First, a plurality of liquid crystal display panels having filling ports for filling liquid crystal are arranged. Next, a ultraviolet ray curing sealing agent in a wet state is transferred to each...
6677187 Process for encapsulating an electrical or electronic component in a sealed manner  
An electrical or electronic component with sealed encapsulation includes a support for housing one or more electrical or electronic components from which electrically conducting tracks radiate...
6590283 Method for hermetic leadless device interconnect using a submount  
In accordance with the invention, a semiconductor device having an electrical input/output contact surface is hermetically sealed and provided with connections via a submount such as a two-level...
6498422 Electronic component such as an saw device and method for producing the same  
An electronic component comprises a substrate having a surface on which an electrode is formed and an SAW circuit element having a surface on which a circuit is formed. The circuit element is held...
6429511 Microcap wafer-level package  
A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro...
6376280 Microcap wafer-level package  
A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro...
6357818 Trailer wiring retention and protection system  
This invention relates to a trailer body including a wiring protection system wherein a trailer body is supported at least in part on a plurality of wheels and has at least a floor associated...
6352195 Method of forming an electronic package with a solder seal  
A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide...
6287894 Acoustic device packaged at wafer level  
Acoustic wave devices are fabricated and packaged together while in wafer form. The devices are formed as dies on a first wafer, which may be quartz crystal. A second wafer, e.g., of alumina or...
6265246 Microcap wafer-level package  
A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro...
6234378 Solid liquid inter-diffusion bonding for ring laser gyroscopes  
A method for bonding a gyroscope component to a gyroscope body using the solid liquid Inter Diffusion (SLID) process. The resulting bond structure has a larger operating range than the...
6228675 Microcap wafer-level package with vias  
A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro...
6182342 Method of encapsulating a saw device  
A bi-layer encapsulation system for a planar acoustic wave device, e.g., a SAW device, employs a layer of controlled particles to contact the active surface of the SAW device, and another layer to...
6119920 Method of forming an electronic package with a solder seal  
A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide...
6027957 Controlled solder interdiffusion for high power semiconductor laser diode die bonding  
A method and a resulting device for mounting a semiconductor to a submount by depositing a first layer of a first metal solder having a selected first melting point and corresponding thickness onto...
Matches 1 - 48 out of 48