Matches 1 - 28 out of 28
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7402516 Method for making integrated circuits  
Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or...
EP0989914B1 MULTILAYER METALIZED COMPOSITE ON POLYMER FILM PRODUCT AND PROCESS  
7394157 Integrated circuit and seed layers  
Structures are provided which improve performance in integrated circuits. The structures include a diffusion barrier and a seed layer in an integrated circuit both formed using a low energy ion...
7378737 Structures and methods to enhance copper metallization  
Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary...
7368378 Methods for making integrated-circuit wiring from copper, silver, gold, and other metals  
Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or...
7301190 Structures and methods to enhance copper metallization  
Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary...
7285196 Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals  
In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at...
7262505 Selective electroless-plated copper metallization  
Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including...
7262130 Methods for making integrated-circuit wiring from copper, silver, gold, and other metals  
Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or...
7253521 Methods for making integrated-circuit wiring from copper, silver, gold, and other metals  
Integrated circuits include networks of electrical components that are typically wired, or interconnected, together with aluminum wires. In recent years, researchers have begun using copper in...
7220665 H2 plasma treatment  
Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive...
7211512 Selective electroless-plated copper metallization  
Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate. This...
7105914 Integrated circuit and seed layers  
Structures are provided which improve performance in integrated circuits. The structures include a diffusion barrier and a seed layer in an integrated circuit both formed using a low energy ion...
7091611 Multilevel copper interconnects with low-k dielectrics and air gaps  
Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by...
7067421 Multilevel copper interconnect with double passivation  
Structures and methods provide multilevel wiring interconnects in an integrated circuit assembly which alleviate problems associated with integrated circuit size and performance and include methods...
6995470 Multilevel copper interconnects with low-k dielectrics and air gaps  
Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by...
6849927 Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals  
A typical integrated circuit interconnects millions of microscopic transistors and resistors with aluminum wires buried in silicon-dioxide insulation. Yet, aluminum wires and silicon-dioxide...
6756298 Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals  
In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at...
6743716 Structures and methods to enhance copper metallization  
Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary...
6614099 Copper metallurgy in integrated circuits  
A typical integrated circuit interconnects millions of microscopic transistors and resistors with aluminum wires buried in silicon-dioxide insulation. Yet, aluminum wires and silicon-dioxide...
6559593 Sputter deposition  
A method of sputter deposition onto an organic material, wherein the discharge gas of the sputtering operation is a gas having a spectrum of light emission of a lower energy than that of argon.
6432822 Method of improving electromigration resistance of capped Cu  
The electromigration resistance of capped Cu or Cu alloy interconnects is significantly improved by treating the exposed planarized surface of the Cu or Cu alloy with a plasma containing NH 3 and...
6429128 Method of forming nitride capped Cu lines with reduced electromigration along the Cu/nitride interface  
The electromigration resistance of nitride capped Cu lines is significantly improved by controlling the nitride deposition conditions to reduce the compressive stress of the deposited nitride...
6429120 Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals  
Integrated circuits, the key components in thousands of electronic and computer products, include interconnected networks of electrical components. The components are typically wired, or...
6420262 Structures and methods to enhance copper metallization  
Structures and methods are described that inhibit atomic migration which otherwise creates an undesired capacitive-resistive effect arising from a relationship between a metallization layer and an...
6372284 Fluoropolymer coating of lithium niobate integrated optical devices  
An integrated optical device is made starting with a substrate of lithium niobate. A fluoropolymer solution is applied to coat at least part of the substrate. The substrate having fluoropolymer...
6153523 Method of forming high density capping layers for copper interconnects with improved adhesion  
The adhesion of a barrier or capping layer to a Cu or Cu alloy interconnect member is significantly enhanced by treating the exposed surface of the Cu or Cu alloy interconnect member, after CMP,...
6042929 Multilayer metalized composite on polymer film product and process  
A composite substrate material useful for fabricating printed circuits is provided comprising a polymeric film having at least one surface modified by plasma etching, a first thin metal nitride...
Matches 1 - 28 out of 28