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7411785 |
Heat-spreading devices for cooling computer systems and associated methods of use
Cooling systems for use with computer systems are disclosed herein. In one embodiment, a computer system includes a first computer module spaced apart from a second computer module to define a...
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7369413 |
Electronic control enclosure
The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and...
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7367384 |
Integrated heat exchangers in a rack for vertical board style computer systems
A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and...
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7362571 |
Inlet flow conditioners for computer cabinet air conditioning systems
Flow conditioners for use with air inlets on computer cabinets are disclosed herein. In one embodiment, a large computer system includes a plurality of computer cabinets arranged in close proximity...
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7349210 |
Grease cover for heat dissipating apparatus
A grease cover ( 50 ) for protecting grease spread on a bottom surface of a heat sink ( 20 ) includes a base wall ( 51 ), a plurality of sidewalls ( 52 a , 52 b , 52 c , 52 d ), a protecting space...
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7336491 |
Heat sink
A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the...
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7330350 |
Systems and methods for cooling computer modules in computer cabinets
Systems and methods for cooling computer components in large computer systems are disclosed herein. In one embodiment, a computer system configured in accordance with aspects of the invention can...
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7304842 |
Apparatuses and methods for cooling electronic devices in computer systems
Apparatuses and methods for cooling processors and other electronic components in computers and other systems are disclosed herein. A heat sink configured in accordance with one embodiment of the...
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7193851 |
Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
Structures and methods for holding heat sinks in contact with electronic devices are described herein. In one embodiment, an assembly for holding a heat sink in contact with an electronic device...
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7190589 |
Electronic control enclosure
The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and...
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7177156 |
Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
Structures and methods for positioning heat sinks in contact with electronic devices are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic...
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7120027 |
Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures
Structures and methods for mounting electronic devices and associated heat sinks to computer modules and other structures are described herein. In one embodiment, a structure for holding a heat...
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6881077 |
Automotive control module housing
An automotive control module includes a plastic housing with a snap-fit metal cover. A printed circuit board is positioned within a cavity formed in the housing, and is attached to the housing with...
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6870738 |
Power semiconductor module
The invention provides a power semiconductor module including a power converter module with an improved configuration technology that minimizes or eliminates the need for a positive bonding...
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6416330 |
Canted coil spring conductor electrical circuit connector
A canted coiled spring is used as a highly conductive, high current electrode between a printed circuit board and a conductive strip connected to a selected voltage. A conductive channel member has...
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6215663 |
Printed circuit board assembly with improved thermal performance
A printed circuit board assembly comprises a printed circuit board and a heat sink that has two surface planes. One surface plane of the heat sink is raised, and provides a surface area for contact...
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6185100 |
Control device consisting of at least two housing sections
In a control device the printed circuit board (10) rests on a rim (28) of the housing bottom (26). The power components (14) to be cooled are arranged in the area where the printed circuit board...
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6154367 |
Heat sink for printed circuit board
An electronic component and heat sink assembly comprising at least one printed circuit board and a first heat transfer member sandwiched between portions of the at least one printed circuit board....
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EP1037517A2 |
Electronic component heat sink assembly
Abstract not available
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6055158 |
Electronic component heat sink assembly
An electronic component heat sink assembly comprising a printed circuit board having electronic components; and a box surrounding the printed circuit board. The box has a first box member with a...
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6043981 |
Heat sink assembly for electrical components
A heat sink assembly to remove heat from electrical components mounted on a circuit board is disclosed. The assembly contains a housing that is formed from a suitable heat sinking material and is...
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5930116 |
Integrated clamping mechanism
A heat sink for heat-generating electronic packages wherein the multiple heat-generating circuit packages are mounted on at least one surface of a heat sink and wherein the covers for the heat sink...
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5896269 |
Positive pressure heat sink conduit
A heat sink conduit, for use in cooling electronic devices, made of an elongate strip of thermally conductive material that is repeatedly folded onto itself in an accordion, sinusoidal or...
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5812375 |
Electronic assembly for selective heat sinking and two-sided component attachment
An electronic assembly includes a flex-rigid circuit board having a flexible polyimide layer disposed on the upper side of a rigid substrate, conductive circuit paths formed within the substrate...
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5771155 |
Spring clamp assembly for improving thermal contact between stacked electronic components
A spring clamp device providing a compressive stress to a stack of components includes a spring member and a bracket having attachment structure for engaging mating structure near the bottom of the...
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5500784 |
Electrical device, in particular switching or controlling device for motor vehicle
An electrical device for a motor vehicle comprises a housing, a printed board carrying an electric circuit and arranged in the housing, the housing being provided with a plurality of webs for...
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