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7368810 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7321160 Multi-part lead frame  
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame....
7288441 Method for two-stage transfer molding device to encapsulate MMC module  
A method for fabricating a semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages....
7285442 Stackable ceramic FBGA for high thermal applications  
An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.
7279781 Two-stage transfer molding device to encapsulate MMC module  
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the...
7268059 Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components  
A method for securing a semiconductor device component to another element is provided. An adhesive material includes a pressure-sensitive component and a curable component is used to at least...
7259451 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7244637 Chip on board and heat sink attachment methods  
A process for forming a thermally enhanced Chip On Board semiconductor device with a heat sink is described. In one aspect, a thermally conductive-filled gel elastomer or a silicon elastomeric...
7220616 Methods for epoxy loc die attachment  
A plurality of lead frames is supplied in a lead frame-by-lead frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an...
7220615 Alternative method used to package multimedia card by transfer molding  
A semiconductor card is made by a disclosed method which, in one molding step, forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a...
7195957 Packaged microelectronic components  
A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral...
7115976 Method and apparatus for epoxy LOC die attachment  
A plurality of lead frames is supplied in a lead frame-by-lead frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an...
7112252 Assembly method for semiconductor die and lead frame  
A LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements...
7105380 Method of temporarily securing a die to a burn-in carrier  
A method of using adhesive tape to temporarily retain a die being temporarily held in a fixture during testing and burn-in. The method of the present invention uses a die cut piece of adhesively...
7087133 Methods for application of adhesive tape to semiconductor devices  
A method and apparatus for application of adhesive tape to semiconductor devices are discolsed. A first adhesively coated tape material length is supplied to a first die associated with a cutting...
7087116 Apparatus for modifying the configuration of an exposed surface of a viscous fluid  
A method and apparatus for achieving a level exposed surface of a viscous material pool for applying viscous material to at least one semiconductor component by contacting at least a portion of the...
7071078 Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials  
A method for securing two or more semiconductor device components to one another is provided. A hybrid adhesive material, including a pressure-sensitive component and a curable component, is used...
7061119 Tape attachment chip-on-board assemblies  
An apparatus and method for preventing damage to tape attachment semiconductor assemblies due to encapsulation filler particles causing damage to a semiconductor die active surface and/or to a...
7061082 Semiconductor die with attached heat sink and transfer mold  
A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First,...
6979888 LOC semiconductor assembled with room temperature adhesive  
A semiconductor device assembly having a lead frame and a semiconductor die configured to be attached to each other is disclosed. An adhesive is applied at room temperature through a stencil to the...
6979598 Method of attaching a leadframe to singulated semiconductor dice  
The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die,...
6979596 Method of fabricating a tape having apertures under a lead frame for conventional IC packages  
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
6975021 Carrier for substrate film  
The invention relates to a carrier for supporting a substrate film during the chip-substrate assembly and bonding process. The carrier provides enhanced rigidity to the substrate film. The degree...
6951982 Packaged microelectronic component assemblies  
Various aspects of the invention provide microelectronic component assemblies, memory modules, computer systems, and methods of assembling microelectronic component assemblies. In one particular...
6946722 Multi-part lead frame with dissimilar materials  
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame....
6943450 Packaged microelectronic devices and methods of forming same  
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
6921966 Tape under frame for lead frame IC package assembly  
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
6921860 Microelectronic component assemblies having exposed contacts  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
6919622 Semiconductor device  
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there...
6919229 Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid  
A method and apparatus for achieving a consistent depth of immersion of a semiconductor element into an exposed surface of an adhesive material pool when applying the adhesive material, conductive...
6902956 Method and structure for manufacturing improved yield semiconductor packaged devices  
A semiconductor package structure for a ball grid array type package using a plurality of pieces of adhesive elastomer film to attach a semiconductor die to a substrate having conductive traces in...
6902952 Multi-part lead frame with dissimilar materials and method of manufacturing  
A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is...
6894521 Burn-in carrier for a semiconductor die  
A method of using adhesive tape to temporarily retain a die being temporarily held in a fixture during testing and burn-in. The method of the present invention uses a die cut piece of adhesively...
6894372 Tape under frame for lead frame IC package assembly  
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a...
6890384 Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid  
A method and apparatus for achieving a level exposed surface of a viscous material pool for applying viscous material to at least one semiconductor component by contacting at least a portion of the...
6885087 Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part  
A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas...
6883574 Apparatus for application of adhesive tape to semiconductor devices  
A method and apparatus for application of adhesive tape to semiconductor devices are disclosed. A first adhesively coated tape material length is supplied to a first die associated with a cutting...
6878172 Systems employing elevated temperatures to enhance quality control in microelectronic component manufacture  
Aspects of the invention provide various methods and apparatus for delivering more reliable packaged microelectronic components. One embodiment provides a method in which packaged microelectronic...
6876066 Packaged microelectronic devices and methods of forming same  
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of...
6869811 Methods for transfer molding encapsulation of a semiconductor die with attached heat sink  
A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First,...
6864153 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another  
A method for securing two or more semiconductor device components to one another. A hybrid adhesive material, including a pressure sensitive component and a thermoset component, is used to at least...
6858926 Stackable ceramic FBGA for high thermal applications  
An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.
6858469 Method and apparatus for epoxy loc die attachment  
A plurality of lead frames is supplied in lead frame by lead frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an...
6841423 Methods for formation of recessed encapsulated microelectronic devices  
A method for manufacturing microelectronic device packages. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first...
6835604 Methods for transverse hybrid LOC package  
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
6819003 Recessed encapsulated microelectronic devices and methods for formation  
A microelectronic device package and method for manufacture. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first...
6818460 Method for applying adhesives to a lead frame  
A method for applying a viscous material to a lead frame element. A method of the invention includes positioning the lead frame facing downward and bringing the lead fingers into contact with a...
6806567 Chip on board with heat sink attachment and assembly  
A process for forming a thermally enhanced Chip On Board semiconductor device with a heat sink is described. In one aspect, a thermally conducting filled gel elastomer material or a silicon...
6794224 SEMICONDUCTOR DEVICE INCLUDING LEADS IN COMMUNICATION WITH CONTACT PADS THEREOF AND A STEREOLITHOGRAPHICALLY FABRICATED PACKAGE SUBSTANTIALLY ENCAPSULATING THE LEADS AND METHODS FOR FABRICATING THE SAME  
A method for forming semiconductor device packages that include one or more semiconductor dice, leads in communication with bond pads of each die, and a protective layer, or package, over at least...
6787396 Method of manufacturing LOC semiconductor assembled with room temperature adhesive  
A method of making a semiconductor device assembly having a lead frame and a semiconductor device configured to be attached to each other is disclosed. An adhesive is applied at room temperature...
Matches 1 - 50 out of 196 1 2 3 4 >