Matches 1 - 50 out of 112 1 2 3 >
Match Document Document Title
7408249 Packaged integrated circuits and methods of producing thereof  
A packaged integrated circuit and method for producing thereof, including an integrated circuit substrate lying in a substrate plane and having electrical circuitry formed thereon, a package...
7371612 Method of fabrication of stacked semiconductor devices  
A method for increasing integrated circuit density is disclosed comprising stacking an upper wafer and a lower wafer, each of which having fabricated circuitry in specific areas on their respective...
7367845 Modular sockets using flexible interconnects  
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
7304375 Castellation wafer level packaging of integrated circuit chips  
Systems and methods for packaging integrated circuit chips in castellation wafer level packaging are provided. The active circuit areas of the chips are coupled to castellation blocks and,...
7285850 Support elements for semiconductor devices with peripherally located bond pads  
A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding from the support substrate. The at...
7276387 Castellation wafer level packaging of integrated circuit chips  
Systems and methods for packaging integrated circuit chips in castellation wafer level packaging are provided. The active circuit areas of the chips are coupled to castellation blocks and,...
7271027 Castellation wafer level packaging of integrated circuit chips  
Systems and methods for packaging integrated circuit chips in castellation wafer level packaging are provided. The active circuit areas of the chips are coupled to castellation blocks and,...
7265440 Methods and apparatus for packaging integrated circuit devices  
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an...
7227261 Vertical surface mount assembly and methods  
A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has...
7226809 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods  
A multichip assembly includes semiconductor devices or semiconductor device components with outer connectors on peripheral edges thereof. The outer connectors are formed by creating via holes along...
7224070 Plurality of semiconductor die in an assembly  
The present invention provides methods and apparatus related to preventing adhesive contamination of the electrical contacts of a semiconductor device in a stacked semiconductor device package. The...
7224056 Back-face and edge interconnects for lidded package  
A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion...
7208335 Castellated chip-scale packages and methods for fabricating the same  
A method for fabricating a chip-scale package includes securing a device substrate that carries at least two adjacent semiconductor devices to a sacrificial substrate. The sacrificial substrate may...
7192796 Methods and apparatus for packaging integrated circuit devices  
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and...
7192311 Apparatus for forming modular sockets using flexible interconnects and resulting structures  
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
7176063 High density 3-D integrated circuit package  
A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the...
7153164 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures  
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
7115984 Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices  
A semiconductor device package is disclosed which is substantially die-sized with respect to each of the X, Y and Z axes. The package includes outer connectors that are located along at least one...
7094108 Apparatus for forming modular sockets using flexible interconnects and resulting structures  
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
7078264 Stacked semiconductor die  
The present invention provides methods and apparatus related to preventing adhesive contamination of the electrical contacts of a semiconductor device in a stacked semiconductor device package. The...
7040930 Modular sockets using flexible interconnects  
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor die to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
7033664 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby  
A crystalline substrate based device including a crystalline substrate having formed thereon a microstructure and at least one packaging layer which is formed over the microstructure and defines...
6989285 Method of fabrication of stacked semiconductor devices  
A method for increasing integrated circuit density is disclosed comprising stacking an upper wafer and a lower wafer, each of which having fabricated circuitry in specific areas on their respective...
6972480 Methods and apparatus for packaging integrated circuit devices  
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an...
6958533 High density 3-D integrated circuit package  
A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the...
6828173 Semiconductor device including edge bond pads and methods  
A vertically mountable semiconductor device including at least one bond pad disposed on an edge thereof. The bond pad includes a conductive bump disposed thereon. The semiconductor device may also...
6825547 Semiconductor device including edge bond pads  
A vertically mountable semiconductor device including at least one bond pad disposed on an edge thereof. The bond pad includes a conductive bump disposed thereon. The semiconductor device may also...
6818977 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages  
A multichip assembly includes semiconductor devices or semiconductor device components with outer connectors on peripheral edges thereof. The outer connectors are formed by creating via holes along...
6800505 Semiconductor device including edge bond pads and related methods  
A semiconductor device including at least one contact pad disposed on an edge thereof. The semiconductor device may also include a protective overcoat layer. The present invention also includes a...
6784023 Method of fabrication of stacked semiconductor devices  
A method for increasing integrated circuit density comprising stacking an upper wafer and a lower wafer, each of which have fabricated circuitry in specific areas on their respective face surfaces....
6760970 Method for forming modular sockets using flexible interconnects and resulting structures  
Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of...
6759307 Method to prevent die attach adhesive contamination in stacked chips  
The present invention provides methods and apparatus related to preventing adhesive contamination of the electrical contacts of a semiconductor device in a stacked semiconductor device package. The...
6758696 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures  
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in...
6751859 Method for forming modular sockets using flexible interconnects and resulting structures  
Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor die 18 to a substrate. The socket assembly 10 is comprised of a plurality of...
6734529 Vertically mountable interposer and assembly  
A support assembly for mounting a semiconductor device vertically relative to a carrier substrate. The support assembly includes an interposer to which the semiconductor device is attached. The...
6727116 Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods  
A semiconductor device package is disclosed which is substantially die-sized with respect to each of the X, Y and Z axes. The package includes outer connectors that are located along at least one...
6684493 Vertically mountable interposer, assembly and method  
A support assembly for mounting a semiconductor device vertically relative to a carrier substrate is disclosed. The support assembly includes an interposer to which the semiconductor device is...
6673650 Multi chip semiconductor package and method of construction  
A multi-chip semiconductor package using a lead-on-chip lead frame. The lead-on-chip package places two or more lead-on-chip dice into one package that are either attached to their own lead-on-chip...
6624505 Packaged integrated circuits and methods of producing thereof  
This invention discloses a packaged integrated circuit including an integrated circuit substrate lying in a substrate plane and having electrical circuitry formed thereon, a package enclosing the...
6612872 Apparatus for forming modular sockets using flexible interconnects and resulting structures  
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in...
6611058 Vertical surface mount assembly and methods  
A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has...
6601125 Minimizing signal stub length for high speed busses  
An integrated circuit package for electrically interconnecting a first bus signal path disposed on a printed circuit board and a second bus signal path disposed on the printed circuit board. The...
6537100 Apparatus and method for packaging circuits  
The invention relates to a circuit package comprising a module and a socket which cooperate to provide quick and easy insertion of the module into the socket using a small insertion force, accurate...
6506981 Interconnect structure having fuse or anti-fuse links between profiled apertures  
An interconnect structure with an interconnect stack consisting of a number of alternating conductive planes and insulating planes. The stack has a number of conductive elements such as conductive...
6492728 Vertical surface mount assembly  
A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has...
6478627 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures  
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in...
6458625 Multi chip semiconductor package and method of construction  
A multi-chip semiconductor package using a lead-on-chip lead frame. The lead-on-chip package places two or more lead-on-chip dice into one package that are either attached to their own lead-on-chip...
6455351 Vertical surface mount assembly and methods  
A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has...
6453550 Method for forming modular sockets using flexible interconnects and resulting structures  
Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of...
6437435 Vertically mountable interposer, assembly and method  
A support assembly for mounting a semiconductor device vertically relative to a carrier substrate. The support assembly includes an interposer to which the semiconductor device is attached. The...
Matches 1 - 50 out of 112 1 2 3 >