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7432583 Leadless leadframe package substitute and stack package  
A semiconductor package is provided with an internal package formed in the cavity of the external leadless leadframe package (LLP). The internal package is a leadless leadframe package and provides...
7427819 Film-bulk acoustic wave resonator with motion plate and method  
An apparatus and method for measuring a target environmental variable (TEV) that employs a film-bulk acoustic resonator with motion plate. The film-bulk acoustic resonator (FBAR) includes an...
7425787 Acoustic galvanic isolator incorporating single insulated decoupled stacked bulk acoustic resonator with acoustically-resonant electrical insulator  
Embodiments of the acoustic galvanic isolator comprise a carrier signal source, a modulator connected to receive an information signal and the carrier signal, a demodulator, and an...
7425763 Electronic circuit package  
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor...
7425467 Web process interconnect in electronic assemblies  
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having...
7424772 Stacked bulk acoustic resonator band-pass filter with controllable pass bandwidth  
The band-pass filter has a stacked pair of film bulk acoustic resonators (FBARs) and an acoustic decoupler between the FBARs. Each of the FBARs has opposed planar electrodes and a layer of...
7423885 Die module system  
A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a...
7423503 Acoustic galvanic isolator incorporating film acoustically-coupled transformer  
Embodiments of the acoustic galvanic isolator comprise a carrier signal source, a modulator connected to receive an information signal and the carrier signal, a demodulator, and, connected between...
7420268 Semiconductor chip package and application device thereof  
A semiconductor chip package has a pillar body including at least three conductors insulated from each other by an insulating layer. The pillar body has a periphery that includes a plurality of...
7408428 Temperature-compensated film bulk acoustic resonator (FBAR) devices  
The temperature-compensated film bulk acoustic resonator (FBAR) device comprises an FBAR stack. The FBAR stack comprises an FBAR and a temperature-compensating element. The FBAR is characterized by...
7405471 Carrier-based electronic module  
An improved multi-chip module includes a circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes...
7400217 Decoupled stacked bulk acoustic resonator band-pass filter with controllable pass bandwith  
The band-pass filter has an upper film bulk acoustic resonator (FBAR), an upper FBAR stacked on the lower FBAR, and, between the FBARs, an acoustic decoupler comprising a layer of acoustic...
7391286 Impedance matching and parasitic capacitor resonance of FBAR resonators and coupled filters  
A film acoustically-coupled transformer (FACT) has a first and a second stacked bulk acoustic resonator (SBAR 1 , SBAR 2 ). Each SBAR has a stacked pair of film bulk acoustic resonators (FBARs)...
7391285 Film acoustically-coupled transformer  
One embodiment of the film acoustically-coupled transformer (FACT) includes a decoupled stacked bulk acoustic resonator (DSBAR) having a lower film bulk acoustic resonator (FBAR) an upper FBAR...
7388455 Film acoustically-coupled transformer with increased common mode rejection  
The film acoustically-coupled transformer (FACT) has a first and second decoupled stacked bulk acoustic resonators (DSBARs). Each DSBAR has a lower film bulk acoustic resonator (FBAR), an upper...
7388454 Acoustic resonator performance enhancement using alternating frame structure  
Disclosed is an acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and an alternating frame region. The first electrode is...
7369013 Acoustic resonator performance enhancement using filled recessed region  
An acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and a fill region. The first electrode is adjacent the substrate, and the...
7367095 Method of making an acoustically coupled transformer  
Embodiments of an acoustically-coupled transformer have a first stacked bulk acoustic resonator (SBAR) and a second SBAR. Each of the SBARs has a lower film bulk acoustic resonator (FBAR) and an...
7362198 Pass bandwidth control in decoupled stacked bulk acoustic resonator devices  
The decoupled stacked bulk acoustic resonator (DSBAR) device has a lower film bulk acoustic resonator (FBAR), an upper FBAR stacked on the lower FBAR, and an acoustic decoupler between the FBARs....
7358831 Film bulk acoustic resonator (FBAR) devices with simplified packaging  
The encapsulated film bulk acoustic resonator (FBAR) device comprises a substrate, an FBAR stack over the substrate, an element for acoustically isolating the FBAR stack from the substrate,...
7337522 Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips  
A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of...
7332985 Cavity-less film bulk acoustic resonator (FBAR) devices  
The film bulk acoustic resonator (FBAR) device comprises a substrate, an acoustic Bragg reflector over the substrate, a piezoelectric element over the acoustic Bragg reflector, and a remote-side...
7324352 High capacity thin module system and method  
Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers,...
7316060 System for populating a circuit board with semiconductor chips  
A system for populating a three dimensional array of semiconductor chips is disclosed. The system facilitates the surface mounting of semiconductor chips with chip carriers to achieve the three...
7304382 Managed memory component  
The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry to reduce footprint for the combination. A leaded IC package is...
7289327 Active cooling methods and apparatus for modules  
A circuit module that includes a system for reducing thermal variation and cooling the circuit module. In preferred embodiments, the module includes a thermally-conductive rigid substrate having...
7288432 Electronic devices with small functional elements supported on a carrier  
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having...
7285442 Stackable ceramic FBGA for high thermal applications  
An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.
7260882 Methods for making electronic devices with small functional elements supported on a carriers  
Methods for making electronic devices with small functional elements supported on a carrier are presented. One method of making an electronic assembly is by first providing the following: a web of...
7253735 RFID tags and processes for producing RFID tags  
A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit...
7233534 Electronic circuit package  
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor...
7230330 Semiconductor die packages with recessed interconnecting structures  
Apparatus and methods relating to semiconductor assemblies. A semiconductor assembly includes an interposer which may be constructed from a flexible material, such as a polyimide tape. A pattern of...
7214569 Apparatus incorporating small-feature-size and large-feature-size components and method for making same  
An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated...
7202560 Wafer bonding of micro-electro mechanical systems to active circuitry  
A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS...
7202555 Pitch change and chip scale stacking system and method  
The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present...
7193310 Stacking system and method  
A chip stack comprising a flex circuit including a flex substrate having a first conductive pattern disposed thereon and a plurality of leads extending therefrom. Also included in the chip stack...
7120069 Electronic circuit package  
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor...
7112520 Semiconductor die packages with recessed interconnecting structures and methods for assembling the same  
Apparatus and methods relating to semiconductor assemblies. A semiconductor assembly includes an interposer which may be constructed from a flexible material, such as a polyimide tape. A pattern of...
7103970 Method for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips  
A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of...
7102892 Modular integrated circuit chip carrier  
An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can...
7070851 Web process interconnect in electronic assemblies  
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having...
7067910 Method and apparatus for using capacitively coupled communication within stacks of laminated chips  
One embodiment of the present invention provides a technique for assembling semiconductor chips. First, multiple semiconductor chips are permanently laminated together into a plurality of laminated...
7033861 Stacked module systems and method  
A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second...
7018866 Circuit component built-in module with embedded semiconductor chip and method of manufacturing  
A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns...
7018219 Interconnect structure and method for connecting buried signal lines to electrical devices  
An electrical component, such as a trace, signal line, or contact pad connected to the trace or signal line, is covered by one or more layers. The electrical component is connected directly to an...
7012811 Method of tuning a multi-path circuit  
An improved method for reducing timing skew for signals, for example clock signals, that propagate along a circuit board, for example, a memory module, is disclosed. At least one signal trace of a...
6982478 Semiconductor device and method of fabricating the same  
A semiconductor device comprises a semiconductor IC chip provided with bond pads on its first surface, a wiring substrate provided with a through hole extending between the opposite surfaces...
6894373 Surface-mounting type of electronic circuit unit suitable for miniaturization and a method for fabricating the unit  
Thin film circuit elements including capacitors, resistors, and inductance elements are formed on a large substrate, and semiconductor chips are wire bonded to the substrate. The elements and chips...
6858926 Stackable ceramic FBGA for high thermal applications  
An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.
6787916 Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity  
Semiconductor dies are bonded to contact pads formed in a substrate's cavity. Vias through the substrate open into the cavity. Conductive lines passing through the vias connect the contact pads in...
Matches 1 - 50 out of 109 1 2 3 >