Matches 1 - 32 out of 32
Match Document Document Title
7340872 Method of and device for packaging electronic components thus packaged  
The invention relates to a method of packaging an electronic component such as semiconductor device, where by the component is positioned in a cavity of a foil by tweezers and is supported by means...
7318307 Method and device for packaging and transporting electronic components  
The invention relates to an apparatus and a method for packaging and for transporting electronic devices. The devices include coverings made of a material that shrinks under the action of...
7238543 Methods for marking a bare semiconductor die including applying a tape having energy-markable properties  
A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including...
7204068 Packaging system with a tool for enclosing electronic components and method of populating a carrier tape  
The invention relates to a packaging system having a tool for inserting electronic components into a carrier tape, which has passage openings. The tool has a pick-up device to pick up the...
EP1326266B1 Protective tape applying and separating method  
Abstract of EP1326266 A protective tape is applied by a tape applying mechanism to a surface of a wafer suction-supported by a chuck table. The protective tape is cut to the shape of the wafer by...
7169685 Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive  
A method for balancing layer-caused compressive or tensile stress in a semiconductor die, die wafer or similar substrate uses a stress-balancing layer (SBL) attached to the opposite side from the...
7096648 Apparatus and method for storing an electronic component, method for packaging electronic components and method for mounting an electronic component  
A method for packaging electronic components wherein each of the electronic components having a first surface and an opposite second surface is placed in each of a plurality of pockets of a first...
7094618 Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape  
The present invention provides a method and apparatus for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been...
7069647 Method for populating a substrate with electronic components  
A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer...
6938783 Carrier tape  
A carrier structure comprises a carrier base which is not thermally deformable and a portion of which is also transparent to electromagnetic radiation. An adhesive layer is disposed on a surface of...
6681937 Packing tape composition and packing method using the packing tape composition  
Receiving pockets are formed by folding open-top box-like structures from paper. The structures are affixed in registration with holes in a tape substrate to receive objects to be packed therein....
EP1326266A2 Protective tape applying and separating method  
A protective tape is applied by a tape applying mechanism to a surface of a wafer suction-supported by a chuck table. The protective tape is cut to the shape of the wafer by a cutter unit. Then, a...
6568535 Apparatus and methods for improving uniform cover tape adhesion on a carrier tape  
Apparatus and methods are presented herein for uniformly sealing and peeling a cover tape to/from a carrier tape. The carrier tapes of the present invention include surface transitions that...
EP1300873A2 Methods of applying and separating protective tapes  
A protective tape (T1) is applied by a tape applying mechanism on a surface of a wafer (W) suction-supported by a chuck table (7). The protective tape is cut to the shape of the wafer by a cutter...
EP0876745B1 COMPONENT CARRIER TAPE  
Abstract not available for EP0876745 Abstract of corresponding document: US5747139 A flexible carrier tape used for protecting components while they are being transported, wherein the carrier tape...
6412641 Packaging for encapsulated dice employing EMR-sensitive adhesives  
A structure and method for protecting encapsulated semiconductor integrated microcircuit dice during shipping. The structure secures the position of the encapsulated die or dice atop an...
6357594 Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes  
A carrier tape system for receiving, retaining and quickly releasing small components, such as singulated bare die or integrated circuit (IC) chips for automated assembly processing. The carrier...
6205745 High speed flip-chip dispensing  
The specification describes a method for dispensing IC chips from a chip carrier tape for a flip-chip assembly operation. In a conventional assembly operation, the solder bumped side of the chip is...
EP1073325A2 Testing and transporting semiconductor chips  
An apertured, punched plastic carrier tape with a pressure sensitive adhesive backing is loaded with ICs. The tape is wound on supply and take-up reels of a cassette. The cassette is adapted to be...
6107680 Packaging for bare dice employing EMR-sensitive adhesives  
A structure and method for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die or dice atop an EMR-penetrable element using an...
EP0981152A2 High speed flip-chip dispensing  
The specification describes a method for dispensing IC chips from a chip carrier tape for a flip-chip assembly operation. In a conventional assembly operation, the solder bumped side of the chip is...
EP0962960A2 High speed flip-chip dispensing  
The specification describes a method for dispensing IC chips from a chip carrier tape for a flip-chip assembly operation. In a conventional assembly operation, the solder bumped side of the chip is...
5976955 Packaging for bare dice employing EMR-sensitive adhesives  
A structure and method for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die or dice atop an EMR-penetrable element using an...
5966903 High speed flip-chip dispensing  
The specification describes a method for dispensing IC chips from a chip carrier tape for a flip-chip assembly operation. In a conventional assembly operation, the solder bumped side of the chip is...
5857572 Component carrier tape  
A component carrier tape used for storing and transporting components, wherein the carrier tape comprises a single layer elongated flexible strip portion having properties suitable for storing and...
5833073 Tacky film frame for electronic device  
A device for storing and transporting electronic devices such as semiconductor chips, comprising: a frame having a top side, a bottom side, a periphery, and a window within the periphery, a thin...
5767433 Component holder for cartridge reloading  
A holder for feeding components, such as primers or bullets, into a reloading machine is disclosed. The component holder is an elongate strip having notched longitudinal margins for indexing the...
5765692 Carrier tape with adhesive and protective walls  
A flexible carrier tape used for protecting components while they are being transported, wherein the carrier tape comprises a strip portion having a component-receiving surface and first and second...
5747139 Component carrier tape  
A flexible carrier tape used for protecting components while they are being transported, wherein the carrier tape comprise a strip portion having a component-receiving surface and first and second...
5729963 Component carrier tape  
A flexible carrier tape for storage and delivery of components by an advancement mechanism, comprises a strip portion, a plurality of aligned pockets spaced along the strip portion for carrying the...
5719348 Component holder for cartridge reloading  
A holder for feeding components, such as primers or bullets, into a reloading machine is disclosed. The component holder is an elongate strip having notched longitudinal margins for indexing the...
5648136 Component carrier tape  
A flexible carrier tape for storage and delivery of components by an advancement mechanism, comprises a strip portion, a plurality of aligned pockets spaced along the strip portion for carrying the...
Matches 1 - 32 out of 32