Matches 1 - 50 out of 160 1 2 3 4 >
Match Document Document Title
7417314 Semiconductor chip assembly with laterally aligned bumped terminal and filler  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that...
7414319 Semiconductor chip assembly with metal containment wall and solder terminal  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a...
7396703 Method of making a semiconductor chip assembly with a bumped terminal and a filler  
A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the...
7368391 Methods for designing carrier substrates with raised terminals  
A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent...
7335988 Use of palladium in IC manufacturing with conductive polymer bump  
An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a...
7319265 Semiconductor chip assembly with precision-formed metal pillar  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically...
7312533 Electronic component with flexible contacting pads and method for producing the electronic component  
An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the...
7276400 Methods of making microelectronic packages with conductive elastomeric posts  
A method of making a microelectronic assembly includes providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; providing a second...
7275925 Apparatus for stereolithographic processing of components and assemblies  
An apparatus for providing gross location, planarization, and mechanical restraint to one or more electronic components such as semiconductor dice to be subjected to stereolithographic processing....
7268421 Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically...
7264991 Method of connecting a conductive trace to a semiconductor chip using conductive adhesive  
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive...
7262082 Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture  
A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first...
7232707 Method of making a semiconductor chip assembly with an interlocked contact terminal  
A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to...
7232706 Method of making a semiconductor chip assembly with a precision-formed metal pillar  
A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to...
7190080 Semiconductor chip assembly with embedded metal pillar  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically...
7138724 Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask  
A solder mask includes an opening through which intermediate conductive elements may be positioned to connect bond pads of a semiconductor die exposed through an aligned opening in a carrier...
7132741 Semiconductor chip assembly with carved bumped terminal  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint...
7129575 Semiconductor chip assembly with bumped metal pillar  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint...
7129113 Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture  
A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first...
7125748 Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask  
A solder mask includes an opening through which intermediate conductive elements may be positioned to connect bond pads of a semiconductor die exposed through an aligned opening in a carrier...
7112521 Method of making a semiconductor chip assembly with a bumped metal pillar  
A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a bumped terminal, then mechanically attaching a semiconductor chip to the metal base, the...
7094676 Semiconductor chip assembly with embedded metal pillar  
A method of making a semiconductor chip assembly includes forming a routing line on a metal base, etching the metal base wherein an unetched portion of the metal base forms a pillar, mechanically...
7075186 Semiconductor chip assembly with interlocked contact terminal  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and a contact terminal, a connection...
7071573 Semiconductor chip assembly with welded metal pillar  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically...
7071089 Method of making a semiconductor chip assembly with a carved bumped terminal  
A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a metal filler, then mechanically attaching a semiconductor chip to the metal...
7067911 Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture  
A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies. The first semiconductor chip assembly includes a first chip, a first conductive trace and...
7043830 Method of forming conductive bumps  
A sealing layer is provided on the surface of a substrate such as a semiconductor wafer. The sealing layer includes apertures which expose external contact locations for semiconductor dice formed...
7018871 Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods  
A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating...
7015128 Method of making a semiconductor chip assembly with an embedded metal particle  
A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip that includes a conductive pad to a routing line, mechanically attaching and electrically...
7009297 Semiconductor chip assembly with embedded metal particle  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal particle, a connection joint that...
6998334 Semiconductor devices with permanent polymer stencil and method for manufacturing the same  
Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.
6984576 Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip  
A method of connecting a conductive trace and an insulative base to a semiconductor chip includes providing a semiconductor chip, a metal base, an insulative base, a routing line and an...
6972495 Compliant package with conductive elastomeric posts  
An assembly including a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; a second microelectronic element having a top surface and a...
6949408 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps  
A method of making a semiconductor chip assembly includes providing a semiconductor chip, a metal base, an insulative base and a conductive trace, wherein the chip includes a conductive pad, the...
6939744 Use of palladium in IC manufacturing with conductive polymer bump  
An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a...
6911173 Methods for stereolithographic processing of components and assemblies  
An apparatus and method for providing gross location, planarization, and mechanical restraint to one or more electronic components such as semiconductor dice to be subjected to stereolithographic...
6908788 Method of connecting a conductive trace to a semiconductor chip using a metal base  
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a metal base, wherein the chip includes a conductive pad, and the...
6906928 Electronic component with a semiconductor chip, and method of producing the electronic component  
The electronic component has a semiconductor chip mounted to a wiring board. The chip is bonded to the wiring board with adhesive strips that leave free a through-cutout, an additional cutout, and...
6897568 Electronic component with flexible contacting pads and method for producing the electronic component  
An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the...
6876072 Semiconductor chip assembly with chip in substrate cavity  
A semiconductor chip assembly includes a semiconductor chip that includes first and second opposing major surfaces, wherein the first surface of the chip includes a conductive pad, a substrate that...
6872591 Method of making a semiconductor chip assembly with a conductive trace and a substrate  
A method of making a semiconductor chip assembly includes providing a semiconductor chip, a conductive trace and a substrate, wherein the chip includes first and second opposing major surfaces and...
6841022 Adhesive-coated electronic parts on a connection sheet  
An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer....
6809414 Semiconductor chip assembly with bumped conductive trace  
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a base, wherein the chip includes a conductive pad, the base...
6800506 Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly  
A method of making a semiconductor chip assembly includes providing a semiconductor chip and a laminated structure, wherein the chip includes a conductive pad, the laminated structure includes a...
6774306 Microelectronic connections with liquid conductive elements  
A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible...
6740576 Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly  
A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace and a metal base, wherein the conductive trace...
6709899 Methods of making microelectronic assemblies having conductive elastomeric posts  
A method of manufacturing a microelectronic assembly includes providing a first microelectronic element having a first surface and a plurality of terminals exposed at the first surface, providing a...
6699780 Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching  
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip with upper and lower surfaces, wherein the upper surface includes a conductive pad,...
6695200 Method of producing electronic part with bumps and method of producing electronic part  
Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the...
6689635 Apparatus and method for face-to-face connection of a die to a substrate with polymer electrodes  
An apparatus and method for face-down connection of a die to a substrate with polymer electrodes, the method comprising forming a plurality of conductive polymer electrodes on a substrate assembly:...
Matches 1 - 50 out of 160 1 2 3 4 >