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7402489 |
Capacitor compatible with high dielectric constant materials having a low contact resistance layer and the method for forming same
A storage cell capacitor and a method for forming the storage cell capacitor having a storage node electrode including a barrier layer interposed between a conductive plug and an oxidation...
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7393753 |
Method for forming a storage cell capacitor compatible with high dielectric constant materials
Described are integrated circuit electrodes and method for fabricating an electrode, which include, in an embodiment forming a silicon, first portion of the electrode in a lower region of a...
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7385240 |
Storage cell capacitor compatible with high dielectric constant materials
An integrated circuit structure includes a digit line and an electrode adapted to be part of a storage cell capacitor and includes a barrier layer interposed between a conductive plug and an...
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7378719 |
Low leakage MIM capacitor
Capacitor structures for use in integrated circuits and methods of their manufacture. The capacitor structures include a bottom electrode, a top electrode and a dielectric layer interposed between...
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7368343 |
Low leakage MIM capacitor
Capacitor structures for use in integrated circuits and methods of their manufacture. The capacitor structures include a bottom electrode, a top electrode and a dielectric layer interposed between...
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EP1145279B1 |
SEMICONDUCTOR ELEMENT WITH A TUNGSTEN OXIDE LAYER AND METHOD FOR ITS PRODUCTION
Abstract not available for EP1145279 Abstract of corresponding document: DE19901210 The invention relates to a semiconductor element with at least one layer of tungsten oxide (WOx), optionally in...
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7335570 |
Method of forming insulating films, capacitances, and semiconductor devices
Insulating metal oxide or nitride films are deposited by RF magnetron sputtering. During sputtering, the atmospheric gas comprises an oxygen or nitride compound gas and an inert gas. The proportion...
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7319270 |
Multi-layer electrode and method of forming the same
An interconnect includes an opening formed in a dielectric layer. A conductive barrier is deposited in the opening, over which a first conductive layer is deposited. A conductive oxide is deposited...
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7253052 |
Method for forming a storage cell capacitor compatible with high dielectric constant materials
Described are integrated circuit electrodes and method for fabricating an electrode, which include, in an embodiment forming a silicon, first portion of the electrode in a lower region of a...
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7205599 |
Devices having improved capacitance
A capacitor formed by a process using only two deposition steps and a dielectric formed by oxidizing a metal layer in an electrolytic solution. The capacitor has first and second conductive plates...
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7153707 |
Method for forming a storage cell capacitor compatible with high dielectric constant materials
An integrated circuit structure includes a digit line and an electrode adapted to be part of a storage cell capacitor and includes a barrier layer interposed between a conductive plug and an...
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7126205 |
Devices having improved capacitance and methods of their fabrication
A capacitor formed by a process using only two deposition steps and a dielectric formed by oxidizing a metal layer in an electrolytic solution. The capacitor has first and second conductive plates...
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7084482 |
Capacitor of a semiconductor device and memory device using the same
A capacitor of a semiconductor device includes a lower electrode, a dielectric layer, including a plurality of band gaps, formed on the lower electrode, and an upper electrode formed on the...
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7042033 |
ULSI MOS with high dielectric constant gate insulator
MOS transistor formed on a semiconductor substrate of a first conductivity type and method of fabrication are provided. The device includes (a) an interfacial layer formed on the substrate; (b) a...
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7015532 |
Capacitor compatible with high dielectric constant materials having a low contact resistance layer and the method for forming same
A storage cell capacitor and a method for forming the storage cell capacitor having a storage node electrode including a barrier layer interposed between a conductive plug and an oxidation...
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7012292 |
Oxidative top electrode deposition process, and microelectronic device structure
A method of preventing oxygen deficiency in a ferroelectric or high ε film material having a top electrode layer deposited thereon. Process conditions are employed that either enable the top...
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6960541 |
Process for fabrication of a semiconductor component having a tungsten oxide layer
A semiconductor element with at least one layer of tungsten oxide, optionally in a structured tungsten oxide layer, is described. The semiconductor element is characterized in that the relative...
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6958257 |
Tantalum sputtering target and method of manufacture
Described is a method for producing high purity tantalum, the high purity tantalum so produced and sputtering targets of high purity tantalum. The method involves purifying starting materials...
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6896969 |
Oxidative conditioning compositions for metal oxide layer and applications thereof
A metal oxide layer may made more highly oxidized by exposing the layer to sulfur trioxide. The leakage current of the layer may thereby be decreased, providing a capacitor containing such a layer...
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6887579 |
Oxidative conditioning compositions for metal oxide layer and applications thereof
A metal oxide layer may made more highly oxidized by exposing the layer to sulfur trioxide. The leakage current of the layer may thereby be decreased, providing a capacitor containing such a layer...
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6861695 |
High-k dielectric materials and processes for manufacturing them
High dielectric films of mixed transition metal oxides of titanium and tungsten, or titanium and tantalum, are formed by sequential chemical vapor deposition (CVD) of the respective nitrides and...
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6838367 |
Method for simultaneous formation of fuse and capacitor plate and resulting structure
An improved method for forming a fuse element is disclosed. During the formation of the upper capacitor plate in a capacitor structure, metals or their alloys are simultaneously patterned as an...
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6838353 |
Devices having improved capacitance and methods of their fabrication
A capacitor formed by a person using only two deposition steps and a dielectric formed by oxidizing a metal layer in an electrolytic solution. The capacitor has first and second conductive plates...
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6794705 |
Multi-layer Pt electrode for DRAM and FRAM with high K dielectric materials
A multi-layer electrode ( 246 ) and method of fabrication thereof in which a conductive region ( 244 ) is separated from a barrier layer ( 222 ) by a first conductive liner ( 240 ) and a second...
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6791131 |
Method for forming a storage cell capacitor compatible with high dielectric constant materials
The invention is a storage cell capacitor having a storage node electrode comprising a barrier layer interposed between a conductive plug and an oxidation resistant layer. A thick insulative layer...
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6787429 |
High-K dielectric materials and processes for manufacturing them
High dielectric films of mixed transition metal oxides of titanium and tungsten, or titanium and tantalum, are formed by sequential chemical vapor deposition (CVD) of the respective nitrides and...
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6781180 |
Trench capacitor and method for fabricating the same
A trench capacitor for use in a semiconductor memory cell is formed in a substrate and includes a trench having an upper region and a lower region. An insulation collar is formed in the upper...
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6762924 |
Capacitor compatible with high dielectric constant materials having two independent insulative layers and the method for forming same
The invention is a storage cell capacitor and a method for forming the storage cell capacitor having a storage node electrode having a barrier layer interposed between a conductive plug and an...
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6727148 |
ULSI MOS with high dielectric constant gate insulator
MOS transistor formed on a semiconductor substrate of a first conductivity type and method of fabrication are provided. The device includes (a) an interfacial layer formed on the substrate; (b) a...
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6596596 |
Methods of forming a field effect transistors
A method of forming a field effect transistor includes forming a tungsten nitride comprising layer proximate at least one of a semiconductive channel region or a conductive gate layer. The tungsten...
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6566161 |
Tantalum sputtering target and method of manufacture
Described is a method for producing high purity tantalum, the high purity tantalum so produced and sputtering targets of high purity tantalum. The method involves purifying starting materials...
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6555473 |
Field effect transistors and methods of forming a field effect transistor
The invention includes capacitors, capacitor forming methods, field effect transistors, and field effect transistor forming methods. In one aspect, a method of forming a layer including tungsten...
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6531730 |
Capacitor compatible with high dielectric constant materials having a low contact resistance layer and the method for forming same
The invention is a storage cell capacitor and a method for forming the storage cell capacitor having a storage node electrode comprising a barrier layer interposed between a conductive plug and an...
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6495427 |
Method for forming a capacitor compatible with high dielectric constant materials having two independent insulative layers
The invention is a storage cell capacitor and a method for forming the storage cell capacitor having a storage node electrode comprising a barrier layer interposed between a conductive plug and an...
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6475856 |
Capacitors and capacitor forming methods
The invention includes capacitors, capacitor forming methods, field effect transistors, and field effect transistor forming methods. In one aspect, a method of forming a layer including tungsten...
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6432793 |
Oxidative conditioning method for metal oxide layer and applications thereof
A metal oxide layer may made more highly oxidized by exposing the layer to sulfur trioxide. The leakage current of the layer may thereby be decreased, providing a capacitor containing such a layer...
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6391801 |
Method of forming a layer comprising tungsten oxide
The invention includes capacitors, capacitor forming methods, field effect transistors, and field effect transistor forming methods. In one aspect, a method of forming a layer including tungsten...
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6387749 |
Method of manufacturing a capacitor in a semiconductor device
The present invention relates generally to a method of manufacturing a semiconductor device. There is disclosed a method of manufacturing a semiconductor device capable of obtaining a higher static...
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6380028 |
Semiconductor device and a method of manufacturing thereof
This invention discloses a semiconductor device which comprises a thin semiconductor substrate; first and second word lines formed on the thin semiconductor substrate; a first source, a common...
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6365486 |
Method of fabricating semiconductor devices utilizing in situ passivation of dielectric thin films
A capacitor for a semiconductor device is fabricated by a method which reduces the interaction of a capacitor electrode and a dielectric layer in the capacitor. One or more passivation layers are...
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6355516 |
Method of manufacturing a capacitor with a bi-layer Ta2O5 capacitor dielectric in a semiconductor device including performing a plasma treatment on the first Ta2O5 layer
There is disclosed a method of manufacturing a capacitor in a semiconductor device capable of effectively removing the organic impurity of a Ta 2 O 5 film by performing an in-situ plasma process...
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EP1145279A2 |
SEMICONDUCTOR ELEMENT AND METHOD FOR ITS PRODUCTION
Abstract not available for EP1145279 Abstract of corresponding document: DE19901210 The invention relates to a semiconductor element with at least one layer of tungsten oxide (WOx), optionally in...
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6303427 |
Method of manufacturing a capacitor in a semiconductor device
The present invention relates to a method of manufacturing a capacitor in a semiconductor device. It is designed to solve the problem due to oxidization of the surface of the underlying tungsten...
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6268620 |
Method of forming capacitors on integrated circuit
A method of making a semiconductor device, comprises the steps of providing an insulating layer, forming a series of holes in the insulating layer, depositing a first layer of a metal, or a...
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6201276 |
Method of fabricating semiconductor devices utilizing in situ passivation of dielectric thin films
A capacitor for a semiconductor device is fabricated by a method which reduces the interaction of a capacitor electrode and a dielectric layer in the capacitor. One or more passivation layers are...
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6144057 |
Semiconductor memory device including a field effect transistor
A semiconductor memory device including a field effect transistor associated with a semiconductor substrate and a capacitor. The capacitor is connected to a drain region of the transistor....
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6066528 |
Method for forming a capacitor compatible with high dielectric constant materials having two independent insulative layers
The invention is a storage cell capacitor and a method for forming the storage cell capacitor having a storage node electrode comprising a barrier layer interposed between a conductive plug and an...
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6030847 |
Method for forming a storage cell capacitor compatible with high dielectric constant materials
The invention is a storage cell capacitor having a storage node electrode comprising a barrier layer interposed between a conductive plug and an oxidation resistant layer. A thick insulative layer...
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6027966 |
Isolated sidewall capacitor
A capacitor structure is provided, with a first conductor on top of a substrate, a first non-conductor on top of and substantially in register with the first conductor, the first conductor and...
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5959327 |
Capacitor compatible with high dielectric constant materials having a low contact resistance layer and the method for forming same
The invention is a storage cell capacitor and a method for forming the storage cell capacitor having a storage node electrode comprising a barrier layer interposed between a conductive plug and an...
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