Matches 1 - 50 out of 169 1 2 3 4 >
Match Document Document Title
7417325 Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts  
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit...
7417310 Circuit module having force resistant construction  
Impact resistant circuit modules are disclosed for enclosing a die having a sensor area. Preferred modules include a flexible circuit and a die coupled thereto. The flexible circuit is preferably...
7413979 Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices  
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and dies are disclosed herein. In one...
7405487 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7388294 Semiconductor components having stacked dice  
A semiconductor package component includes a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary...
7382060 Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts  
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit...
7381591 Flip-chip adaptor package for bare die  
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead...
7371609 Stacked module systems and methods  
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a...
7368810 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7335994 Semiconductor component having multiple stacked dice  
A semiconductor package component includes a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary...
7335975 Integrated circuit stacking system and method  
The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip...
7332376 Method of encapsulating packaged microelectronic devices with a barrier  
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
7329945 Flip-chip adaptor package for bare die  
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead...
7324352 High capacity thin module system and method  
Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers,...
7323364 Stacked module systems and method  
A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second...
7310458 Stacked module systems and methods  
The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of...
7309914 Inverted CSP stacking system and method  
Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible...
7289327 Active cooling methods and apparatus for modules  
A circuit module that includes a system for reducing thermal variation and cooling the circuit module. In preferred embodiments, the module includes a thermally-conductive rigid substrate having...
7279364 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Flip-chip adaptor package for bare die  
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead...
7273769 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7259451 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7256484 Memory expansion and chip scale stacking system and method  
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance...
7224051 Semiconductor component having plate and stacked dice  
A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for...
7221059 Wafer level semiconductor component having thinned, encapsulated dice and polymer dam  
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit...
RE39628 Stackable flex circuit IC package and method of making same  
A stackable flex circuit IC package includes a flex circuit comprised of a flexible base with a conductive pattern thereon, and wrapped around at least one end portion of a frame so as to expose...
7218001 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components  
The present disclosure describes microfeature workpieces, microelectronic component packages, and methods of forming microelectronic components and microelectronic component packages. In one...
7202555 Pitch change and chip scale stacking system and method  
The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present...
7199050 Pass through via technology for use during the manufacture of a semiconductor device  
A method for forming vias which pass through a semiconductor wafer substrate assembly such as a semiconductor die or wafer allows two different types of connections to be formed during a single...
7193310 Stacking system and method  
A chip stack comprising a flex circuit including a flex substrate having a first conductive pattern disposed thereon and a plurality of leads extending therefrom. Also included in the chip stack...
7180167 Low profile stacking system and method  
The present invention provides a system and method that mounts integrated circuit devices onto substrates and a system and method for employing the method in stacked modules. The contact pads of a...
7166915 Multi-chip module system  
Multi-chip module systems and method of fabrication thereof wherein the equivalent of a failed die of a multi-chip module (MCM) is added to the module in a vacancy position previously constructed...
7157353 Method for fabricating encapsulated semiconductor components  
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit...
7132731 Semiconductor component and assembly having female conductive members  
A semiconductor component includes back side pin contacts fabricated using a circuit side fabrication method. The component also includes a thinned semiconductor die having a pattern of die...
7122905 Microelectronic devices and methods for mounting microelectronic packages to circuit boards  
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can...
7111080 Distributing an electronic signal in a stackable device  
Techniques are provided for distributing signals in a stackable unit, including a first input connector of two or more input connectors; a second input connector of two or more input connectors,...
7101737 Method of encapsulating interconnecting units in packaged microelectronic devices  
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
7094632 Low profile chip scale stacking system and method  
The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile structures provide connection between...
7091124 Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices  
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and dies are disclosed herein. In one...
7081665 Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts  
A semiconductor component includes back side pin contacts fabricated using a circuit side fabrication method. The component also includes a thinned semiconductor die having a pattern of die...
7081373 CSP chip stack with flex circuit  
A chip stack comprising a flex circuit including a flex substrate having a first conductive pattern disposed thereon and a plurality of leads extending therefrom. Also included in the chip stack...
7078266 Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts  
A semiconductor component includes back side pin contacts fabricated using a circuit side fabrication method. The component also includes a thinned semiconductor die having a pattern of die...
7066741 Flexible circuit connector for stacked chip module  
The present invention provides a flexible circuit connector for electrically coupling IC devices to one another in a stacked configuration. Each IC device includes: (1) a package having top,...
7060526 Wafer level methods for fabricating multi-dice chip scale semiconductor components  
A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for...
7053478 Pitch change and chip scale stacking system  
The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present...
7049685 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices  
Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In...
7033861 Stacked module systems and method  
A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second...
7029949 Method for fabricating encapsulated semiconductor components having conductive vias  
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit...
7026708 Low profile chip scale stacking system and method  
The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile contacts are created by any of a...
6998860 Method for burn-in testing semiconductor dice  
A reusable burn-in/test fixture for discrete TAB die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. When the two halves are assembled, the...
6998717 Multi-dice chip scale semiconductor components  
A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for...
Matches 1 - 50 out of 169 1 2 3 4 >