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7425763 Electronic circuit package  
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor...
7425467 Web process interconnect in electronic assemblies  
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having...
7378597 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Multilayer printed circuit board  
A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20 . Due to this, it is...
7368374 Super high density module with integrated wafer level packages  
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
7365019 Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes  
A system that generates an intense hot gas stream is described to etch a polymer on a substrate used in the manufacture of semiconductor and MEMS devices with no surface damage. The etching process...
7361987 Circuit device with at least partial packaging and method for forming  
A circuit device ( 15 ) is placed within an opening of a conductive layer ( 10 ) which is then partially encapsulated with an encapsulant ( 24 ) so that the active surface of the circuit device (...
7327022 Assembly, contact and coupling interconnection for optoelectronics  
A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active...
7291910 Semiconductor chip assemblies, methods of making same and components for same  
Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the...
7289336 Electronic packaging and method of making the same  
An interconnect structure for use in an electronic device, wherein the interconnect structure comprises a first substrate comprising a flexible material, wherein the first substrate comprises a...
7288432 Electronic devices with small functional elements supported on a carrier  
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having...
7271481 Microelectronic component and assembly having leads with offset portions  
A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a...
7260882 Methods for making electronic devices with small functional elements supported on a carriers  
Methods for making electronic devices with small functional elements supported on a carrier are presented. One method of making an electronic assembly is by first providing the following: a web of...
7253735 RFID tags and processes for producing RFID tags  
A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit...
7233534 Electronic circuit package  
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor...
7231707 Method of manufacturing planar inductors  
Method of forming a ferromagnetic layer on at least one surface of a dielectric material that may be serve as an inductive core on a printed circuit board or a multichip module. Conductive leads...
7214569 Apparatus incorporating small-feature-size and large-feature-size components and method for making same  
An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated...
EP1001440B1 Switching structure and method of fabrication  
Abstract of EP1001440 A switch structure having a base surface; a first high density interconnect (HDI) plastic interconnect layer overlying the base surface layer; a cavity within the HDI plastic...
7198969 Semiconductor chip assemblies, methods of making same and components for same  
Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the...
7179742 Interconnect circuitry, multichip module, and methods for making them  
Methods of electroless plating metal on a dielectric material includes dipping the dielectric in a solution containing attractive catalytic metal particles and a metal salt solution. A thicker...
7120069 Electronic circuit package  
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor...
7098078 Microelectronic component and assembly having leads with offset portions  
A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a...
7070851 Web process interconnect in electronic assemblies  
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having...
7067352 Vertical integrated package apparatus and method  
A method of fabricating integrated circuits from a plurality of semiconductor dice, each semiconductor die defining a top side and a bottom side, includes the steps of attaching the bottom sides of...
7049697 Process for making fine pitch connections between devices and structure made by the process  
A semiconductor device structure including fine-pitch connections between chips is fabricated using stud/via matching structures. The stud and via are aligned and connected, thereby permitting...
D520947 Power converter body  
7042074 Power semiconductor module and method for producing it  
A power semiconductor module and a method for producing it, wherein the module includes a substrate, with conductor tracks disposed on it to suit circuitry with which the module is used and with...
6998281 Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics  
A light emitting device containing an array of directional emission LEDs is provided. The directional emission LEDs of the array may be substrate emitting, lateral current injection, resonant...
6985341 Components having actively controlled circuit elements  
Circuitry provides various protection mechanisms to an external circuit using actively controlled elements. The controlled elements may by controlled to provide overcurrent, overvoltage, or...
D510906 Power converter  
6955991 Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes  
A hot arc-type plasma generating system is described to etch a polymer on a substrate used in the manufacture of semiconductor devices. The etching process is particularly useful to remove a...
6921975 Circuit device with at least partial packaging, exposed active surface and a voltage reference plane  
A circuit device ( 15 ) is placed within an opening of a conductive layer ( 10 ) which is then partially encapsulated with an encapsulant ( 24 ) so that the active surface of the circuit device (...
6908561 Polymide-to-substrate adhesion promotion in HDI  
Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of...
6879038 Method and apparatus for hermetic sealing of assembled die  
An optically transparent, hermetic coating is locally formed on die and other components already assembled in an existing nonhermetic structure. The local hermetic sealing of an OSA includes...
6864165 Method of fabricating integrated electronic chip with an interconnect device  
A method is described for forming an integrated structure, including a semiconductor device and connectors for connecting to a motherboard. A first layer is formed on a plate transparent to...
6838776 Circuit device with at least partial packaging and method for forming  
In one embodiment, circuit device ( 15 ) is placed within an opening of a conductive layer ( 10 ) which is then partially encapsulated with an encapsulant ( 24 ) so that the active surface of the...
6838750 Interconnect circuitry, multichip module, and methods of manufacturing thereof  
An electrical circuit having one or more dielectric layers formed of latex; and one or more layers of electrically conductive material, such as copper, patterned to form multiple electrical...
6818466 Method of fabricating an integrated optoelectronic circuit  
A method of fabricating an integrated optoelectronic circuit. The method includes positioning a microchip on a first flexible dielectric substrate. A polymer electro-optic waveguide is positioned...
6794222 HDI module with integral conductive electromagnetic shield  
A method for making high density interconnected modules for radio-frequency, digital processing, or other circuits subject to radiated interference includes the step of applying sets of...
6790703 Apparatus for aligning die to interconnect metal on flex substrate  
A method and process sequence for accurately aligning (die to interconnect metal on flex substrate such as polyimide flex is described. A mask for via formation is first patterned in a metal layer...
6770964 Semiconductor device including intermediate wiring element  
An IGBT module comprises a ceramic substrate having a collector wiring element on a surface thereof, an IGBT chip provided on the collector wiring element, an insulative member provided on the...
6762136 Method for rapid thermal processing of substrates  
A technique is described for a very rapid thermal treatment of a substrate used to make semiconductor devices. The substrate is subjected to a very hot gas stream such as can be produced from an...
6759316 Method of manufacturing a semiconductor chip  
A semiconductor device having a multilayer structure and a method of manufacturing the semiconductor device are disclosed. The semiconductor device according to the present invention has a...
6753746 Printed circuit board having jumper lines and the method for making said printed circuit board  
The present invention relates a printed circuit board having jumper lines, and a method for making the printed circuit board. An isolation layer made of a dielectric material is coated on the line...
6737297 Process for making fine pitch connections between devices and structure made by the process  
A semiconductor device structure including fine-pitch connections between chips is fabricated using stud/via matching structures. The stud and via are aligned and connected, thereby permitting...
6733711 Plastic packaging of LED arrays  
There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base...
6730533 Plastic packaging of LED arrays  
There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base...
6728904 Electronic circuit package  
An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chip packaged...
6711312 Integrated optoelectronic circuit and method of fabricating the same  
The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic...
6710257 Circuit encapsulation  
A circuit on a circuit board is encapsulated using a first mold section and a second mold section. The first mold section closes on one side of the board, and the first mold section has an exposed...
6707124 HID land grid array packaged device having electrical and optical interconnects  
A high density interconnect device which creates a thin, electrically and thermally high performance package for semiconductor devices having a mechanically stable and high thermal conductivity...
Matches 1 - 50 out of 272 1 2 3 4 5 6 >