Matches 1 - 13 out of 13
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7367114 Method for plasma etching to manufacture electrical devices having circuit protection  
Methods of manufacturing a variety of circuit protection devices are provided as well as devices so manufactured. In an embodiment, a surface mount electrical device having a substrate and a pair...
7194803 Seal ring and method of forming micro-topography ring surfaces with a laser  
A seal ring of a shaft seal has micro-topography depth features, such as wavy faces or radial grooves, formed in the seal face which define a hydrodynamic seal region between opposing seal faces....
6531326 Method to calibrate the wafer transfer for oxide etcher (with clamp)  
A method for calibrating the wafer transfer system by using an inspection control wafer after plasma etching is described. An inspection control wafer is provided comprising a polysilicon layer...
6489590 Laser removal of foreign materials from surfaces  
A method of fast and complete laser removal of inorganic and organic foreign material, including particles down to submicron-sizes and atomic contaminants, such as heavy metals and alkaline...
6303509 Method to calibrate the wafer transfer for oxide etcher (with clamp)  
A method for calibrating the wafer transfer system by using an inspection control wafer after plasma etching is described. An inspection control wafer is provided comprising a polysilicon layer...
5783482 Method to prevent oxide peeling induced by sog etchback on the wafer edge  
A method for avoiding oxide peeling by removing polymer contaminants from the edge of a wafer is described. An interlevel dielectric sandwich layer is formed by depositing a first oxide layer...
5681395 Method for the removal of a surface layer by a laser beam  
In a method for uniformly removing layers from a coated surface, a laser beam is used for scanning the surface along parallel scanning lines wherein the laser beam has a surface illuminating...
4913789 Sputter etching and coating process  
A process for coating a diagram on a substrate is disclosed, wherein a metal mask is applied to a prepared substrate and subjected to vacuum etching followed by vacuum sputtering. The sputter...
4853081 Process for removing contaminant  
Contaminant is removed from the interior of the holes in the vicinity of preselected locations by etching in a gaseous plasma wherein the sheath voltage is controlled in order to direct ions of the...
EP0313855A2 Process for removing contaminant.  
Contaminant is removed from the interior of the holes in the vicinity of preselected locations by etching in a gaseous plasma wherein the sheath voltage is controlled in order to direct ions of the...
4810326 Interlaminate adhesion between polymeric materials and electrolytic copper surfaces  
A method for improving the adhesion of a polymer such as an epoxy resin to an electrolytic copper surface wherein the copper surface to be adhered is exposed to gas plasma containing a...
4797178 Plasma etch enhancement with large mass inert gas  
The present invention provides a process for plasma cleaning and an improved gas mixture for use in a plasma cleaning process. The gas mixture of the present invention includes the normal process...
4787957 Desmear and etchback using NF.sub.3 /O.sub.2 gas mixtures  
The present invention is directed to a method for plasma desmear and etchback of epoxy and polyimide materials from a multilayered or double sided printed circuit board using a plasma gas...
Matches 1 - 13 out of 13