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7342805 |
Capacitor plate for substrate components
A method and apparatus to mount a capacitor plate to a substrate, under a component. One embodiment of the invention involves a method to assemble a capacitor plate on a substrate. A second...
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7133275 |
Integrated capacitor assembly
A single layer capacitive device including a portion of pre-fired ceramic material and one or more terminations is formed with manufacturing steps that are easily modified to customize size and...
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6828666 |
Low inductance power distribution system for an integrated circuit chip
A low impedance electrical pathway from decoupling capacitance located on a circuit board to an integrated circuit chip. The integrated circuit includes multiple power and ground C4 bumps and is...
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6657136 |
Termination board for mounting on circuit board
Terminating resistances are provided to at least some pins of an ASIC or other multi-pin component mounted on a surface of a circuit board, by positioning a second circuit board on the surface of...
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6643916 |
Method to assemble a capacitor plate for substrate components
A method and apparatus to mount a capacitor plate to a substrate, under a component. One embodiment of the invention involves a method to assemble a capacitor plate on a substrate. A second...
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6414850 |
Method and apparatus for decoupling ball grid array devices
A small circuit board, preferably having or providing capacitance is mounted on the surface of a main circuit board opposite the surface where a BGA or other integrated circuit is mounted, and...
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6191479 |
Decoupling capacitor configuration for integrated circuit chip
A decoupling capacitor structure formed integral with an integrated circuit chip and over top of circuitry defined thereon advantageously provides decoupling capacitance in close electrical...
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5982635 |
Signal adaptor board for a pin grid array
An interconnect structure adapts one or more signals conducted between a printed circuit board (PCB) and an integrated circuit (IC) including leads, the IC having signal requirements not provided...
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5963023 |
Power surge management for high performance integrated circuit
An integrated circuit chip configuration, e.g., a microprocessor, includes feedback control circuitry defined thereon to control mid-frequency components of current demand of the integrated circuit...
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5492490 |
Insert mounting and method for inserting and mounting components in printed wiring board holes
An insert mounting and a method for inserting and mounting components in holes of printed wiring boards, in particular for plug connectors or parts thereof, include connection pegs of two...
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5474474 |
Electrically balanced connector assembly
An electrically balanced connector assembly is presented. The assembly comprises a circuit board having circuitry thereon including a plurality of plated through holes. The plated through holes...
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5459643 |
Electrically enhanced wiring block with break test capability
An electrically enhanced wiring block with break test capability employs a printed circuit board which includes integrally defined transmission lines and capacitive elements designed to improve...
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5435752 |
Electrically balanced connector assembly
An electrically balanced connector assembly is presented. The assembly comprises a printed circuit board including integrally defined capacitive elements defined by plated through slots which are...
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5362254 |
Electrically balanced connector assembly
An electrically balanced connector assembly is presented. The assembly comprises a printed circuit board including integrally defined capacitive elements designed to compensate for reactive...
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5295869 |
Electrically balanced connector assembly
An electrically balanced connector assembly is presented. The assembly comprises a printed circuit board including integrally defined capacitive elements designed to compensate for reactive...
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5252857 |
Stacked DCA memory chips
A memory system package is provided by placing memory chips face-to-face using as an interposer a thin flexible carrier having through-carrier-connections, vias, for common memory chip I/O pads...
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5049979 |
Combined flat capacitor and tab integrated circuit chip and method
A capacitor, having an area smaller than the top area of a chip, is attached above the top of a tape-automated-bonded (TAB) chip and short bonded wires or TAB leads interconnect the capacitor...
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5043533 |
Chip package capacitor cover
Disclosed is a cover for a semiconductor chip package. The cover comprises a sealing surface for providing a seal between the cover and a semiconductor chip package. A mounting surface for mounting...
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4920444 |
Arrangement for decoupling integrated circuits electrically
An arrangement for electrically decoupling IC-circuits by means of decoupling capacitors. A particularly simple and effective electical decoupling of such circuits is achieved by mounting, e.g....
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4862322 |
Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
An integrated circuit device package in which integrated circuit devices are mounted with active faces placed facing each other to form a double-device structure. Input/output terminals on the...
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4819056 |
Hybrid thick film circuit device
A hybrid thick film chip device comprising two or more electrical components mounted in parallel on a single substrate and having common terminals for electrical interconnection to other devices or...
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4779164 |
Surface mounted decoupling capacitor
A decoupling capacitor is mounted on a thin auxiliary board and connected by metallization traces on the board to a single pair of plug-in contacts press-fitted into a pair of apertures in a pair...
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4744008 |
Flexible film chip carrier with decoupling capacitors
An electronic packaging structure includes a second level electronic package having at least one opening formed therein and circuitry for electrical connection to a semiconductor chip. A...
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