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7368092 |
Apparatus and reactor for generating and feeding high purity moisture
A safe, reduced pressure apparatus for generating water vapor from hydrogen and oxygen and feeding high purity moisture to processes such as semiconductor production. The apparatus eliminates the...
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EP1602129B1 |
SPLIT FIN HEAT SINK
Abstract not available for EP1602129 Abstract of corresponding document: US6714415 A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending...
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7290598 |
Heat exchange device
A heat transfer device having a heat source for collecting waste heat from a heat-generating system, the heat transfer device having fins in which the shape of the sides of the fins is preferably...
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7278209 |
Method for manufacturing heat sink for use in heat sink fan
A method for manufacturing a heat sink for use in a heat sink fan is provided. A heat-sink base portion defining a central axis and a circumferential surface is formed. A plurality of...
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7258845 |
Apparatus and reactor for generating and feeding high purity moisture
A safe, reduced pressure apparatus for generating water vapor from hydrogen and oxygen and feeding high purity moisture to processes such as semiconductor production. The apparatus eliminates the...
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7188418 |
Method of making split fin heat sink
A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may...
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7040388 |
Heat sink, method of manufacturing the same and cooling apparatus using the same
A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of...
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6735864 |
Heatsink method of manufacturing the same and cooling apparatus using the same
A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of...
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EP1091402B1 |
Process for manufacturing heat sink
Abstract of EP1091402 In a process for manufacturing a heat sink comprising a heat dissipating base plate and a multiplicity of tonguelike fins formed on an upper surface of the base plate, a heat...
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6659168 |
Heatsink with multiple fin types
A heat sink includes a base having first and second regions, a first fin of a first type disposed on the first region of the base, and a second fin of a second type disposed on the second region of...
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6543521 |
Cooling element and cooling apparatus using the same
The cooling element of the present invention comprises a base section in contact with a heat producing element, and a heat dissipation section integrally formed with the base section. The cooling...
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6397926 |
Heat sink, method manufacturing the same and cooling apparatus using the same
A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of...
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6349762 |
Heat sink
A heat sink comprises at least one row of many tonguelike fins formed on one surface of a heat dissipating base plate and each having a circular-arc outer end. The midportion only of the entire...
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6341651 |
Heat sink and method of fabricating same
In fabricating a heat sink from a blank comprising a base plate portion, and a fin-forming portion to be cut and provided on at least one side of the base plate portion by cutting the fin-forming...
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6339880 |
Process for manufacturing heat sink
In a process for manufacturing a heat sink comprising a heat dissipating base plate and a multiplicity of tonguelike fins formed on an upper surface of the base plate, a heat sink blank of aluminum...
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EP1117130A2 |
Heatsink method of manufacturing the same and cooling apparatus using the same
A heatsink of the present invention has a column having a heat conducting plate with a heat receiving face contacting a heat producing element. On the side faces of the column are a plurality of...
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EP1091402A2 |
Process for manufacturing heat sink
In a process for manufacturing a heat sink comprising a heat dissipating base plate and a multiplicity of tonguelike fins formed on an upper surface of the base plate, a heat sink blank of aluminum...
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EP0947794A1 |
Method for producing finned tubes
The tube (R), at least on a part of its surface, is provided with at least one row of tongue-type ribs (F) produced by inclined incisions into the tube material and erection of the thus-produced...
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5960865 |
Mounting bracket with integral heat sink capabilities
A bracket for mounting an antenna along with a transmitter or receiver on a pole or wall. The bracket is able to pivot in two perpendicular planes, and can be quickly and precisely aimed in a given...
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5613552 |
Cooling apparatus using boiling and condensing refrigerant
A power pack is mounted on the side wall of a refrigerant tank in which the internal pressure is reduced and a refrigerant is held in such a way that a heat transfer panel on which a power element...
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5562146 |
Method of and apparatus for forming a unitary heat sink body
A method of forming a unitary heat sink metal body by supporting one end of each plurality of flat metal plates or fins in a row so that the plates are spaced and parallel and casting a base about...
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5229914 |
Cooling device that creates longitudinal vortices
A cooling device that achieves longitudinal vortex formation, thereby reducing downstream wake, without significantly increased pressure. The device also conducts heat from the electronic component...
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5194935 |
Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure
The plastic encapsulated semiconductor device according to the present invention has a semiconductor chip, leads, and members for electrically connecting these parts to each other. A part of leads,...
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5020586 |
Air-cooled heat exchanger for electronic circuit modules
Apparatus for cooling an electronic circuit module includes a heat sink in thermal contact with the circuit module and a device for directing cooling gas at the heat sink. The heat sink includes...
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4823869 |
Heat sink
An improved heat sink is disclosed in which a plurality of heat conducting fins extends form a base of heat conductive material. The top surface of the base is peaked to reduce the dead space that...
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4588023 |
Device for releasing heat
A heat releasing device comprises an extruded aluminum main body including a horizontal wall for attaching heat emitting elements thereto and a vertical wall formed with a large number of gouged...
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4449578 |
Device for releasing heat
A heat releasing device comprises an extruded aluminum main body including a horizontal wall for attaching heat emitting elements thereto and a vertical wall formed with a large number of gouged...
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