|
Match
|
Document |
Document Title |
|
|
7367845 |
Modular sockets using flexible interconnects
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
|
|
|
7192311 |
Apparatus for forming modular sockets using flexible interconnects and resulting structures
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
|
|
|
7153164 |
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
|
|
|
7094108 |
Apparatus for forming modular sockets using flexible interconnects and resulting structures
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
|
|
|
7040930 |
Modular sockets using flexible interconnects
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor die to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined...
|
|
|
6765803 |
Semiconductor device socket
A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a...
|
|
|
6760970 |
Method for forming modular sockets using flexible interconnects and resulting structures
Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of...
|
|
|
6758696 |
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in...
|
|
|
6751859 |
Method for forming modular sockets using flexible interconnects and resulting structures
Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor die 18 to a substrate. The socket assembly 10 is comprised of a plurality of...
|
|
|
6743038 |
Zero insertion force connector basing on surface contact
A zero insertion force connector basing on surface contact having a connector base with multiple connecting terminals installed thereon in array form, a sliding cover, and a clamping lever for...
|
|
|
6612872 |
Apparatus for forming modular sockets using flexible interconnects and resulting structures
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in...
|
|
|
6478627 |
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in...
|
|
|
6453550 |
Method for forming modular sockets using flexible interconnects and resulting structures
Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of...
|
|
|
6442044 |
Semiconductor device socket, assembly and methods
A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a...
|
|
|
6319065 |
Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
A modular bare die socket assembly for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in...
|
|
|
6198636 |
Semiconductor device socket, assembly and methods
A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a...
|
|
|
6089920 |
Modular die sockets with flexible interconnects for packaging bare semiconductor die
A modular bare die socket assembly 10 for attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined...
|
|
|
6088238 |
Semiconductor device socket, assembly and methods
A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a...
|
|
|
6088237 |
Semiconductor device socket, assembly and methods
A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a...
|
|
|
5995378 |
Semiconductor device socket, assembly and methods
A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a...
|
|
|
RE36217 |
Top load socket for ball grid array devices
A test socket for temporary connection of a ball grid array integrated circuit device to a test circuit includes an array of contacts each including two cantilever arms biased toward each other and...
|
|
|
5747175 |
LCP blends
Liquid-crystalline polymer blends comprising two or more cholesteric liquid-crystalline polymers or at least one nematic liquid-crystalline polymer and at least one cholesteric liquid-crystalline...
|
|
|
EP0790274A1 |
Expandable moulding compositions
Expandable moulding materials (I) contains (A) high temperature-resistant polymer(s), (B) 1-99 wt% (based on total polymer content) polymer(s) with sulphoxide groups and optionally (C) conventional...
|
|
|
EP0718368A2 |
Cross-linked moulding compositions of polyarylene sulphides and polyarylene-sulfoxides, associated manufacturing method and use
Polymer mixts. (I) contain (A) 1-99 wt.% polyarylene sulphide(s) (PAS) and (B) 1-99 wt.% polyarylene sulphoxide(s) (PASO). Also claimed is a process for the prodn. of crosslinked or partly...
|
|
|
5170117 |
Socket for testing a plug-in type semiconductor
A socket for testing a plug-in type semiconductor having two rows of flat pins includes an elongated base having two rows of resilient conductive clamps positioned on the base and an elongated...
|
|
|
5147213 |
Zero insertion pressure test socket for pin grid array electronic packages
A zero-insertion-pressure, pin-grid-array test socket is provided which includes a novel toggle mechanism for opening an array of contacts within the socket to accept a component for testing and...
|
|
|
5065941 |
Apparatus for carrying out connection and disconnection of a circuit member to an electrical connector
An apparatus for carrying out connection and disconnection of circuit member to an electrical connector has an inner frame for regulating a space for a circuit to be mounted, an outer frame,...
|
|
|
4872851 |
Electrical connector with torsional contacts
An electrical connector for providing electrical connection to a substrate having contact elements thereon (e.g., a printed circuit board) wherein torsional contacts are utilized. The contacts,...
|
|
|
4779674 |
Sawtooth card retainer
A printed circuit board heat sink retainer is disclosed comprising a mating pair of sawtoothed bars with slidably engaging teeth. The bars are laterally spread apart and held by a forcing device,...
|
|
|
4744768 |
Coupling connector
A connector with a base having a plurality of contacts that are operable and which can be closed, with opposing sides resiliently forced against device terminals which force can be supplemented by...
|
|
|
4721155 |
Sawtooth card retainer
A printed circuit board heat sink retainer is disclosed comprising a mating pair of sawtoothed bars with slidably engaging teeth. The bars are laterally spread apart and held by a forcing device,...
|
|
|
4627681 |
Locking electrical connector
A locking electrical connector in which male contacts (22) and female contacts (17,18) are adapted to be locked together in coupled relationship. The female contacts comprise resiliently movable...
|
|
|
4531792 |
IC Connector
In an IC connector for connecting lead terminals of an IC package of the dual in-line type to terminals of a circuit board, first grooves and first projections are formed on two surfaces of a slide...
|
|
|
4496205 |
Low or zero insertion force connector for multi-pin arrays
A connector for low or zero insertion force receipt of multi-pin arrays, such as those in very large scale integration (VLSI) components, includes cooperating camming surfaces having inclined ramps...
|
|
|
4418972 |
Electrical connector for printed wiring board
The present disclosure describes an electrical connector for use with a printed wiring board. The connector design is characterized by an inner housing of insulative material for supporting a...
|
|
|
4402563 |
Zero insertion force connector
A connector is disclosed for electrically interconnecting the conductive pins of an electrical component to a printed circuit board. The connector includes a plurality of conductive contacts...
|
|
|
4392705 |
Zero insertion force connector system
The present invention relates to a connector system for electrically connecting a circuit card to a circuit board. More particularly the connector system includes an upper card-carrying member...
|
|
|
4390224 |
Two piece zero insertion force connector
A two-piece connector is disclosed for making zero insertion force interconnection between a mother board and a daughter board. The connector includes a plug mounted on the daughter board and a...
|