Matches 1 - 49 out of 49
Match Document Document Title
7368678 Method for sorting integrated circuit devices  
A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of...
7279918 Methods for wafer level burn-in  
A method, circuit and system for determining burn-in reliability from wafer level burn-in are disclosed. The method includes recording the number of failures in each IC die in nonvolatile elements...
7276672 Method for sorting integrated circuit devices  
A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of...
7249213 Memory device operable with a plurality of protocols with configuration data stored in non-volatile storage elements  
An improved memory device is operable in a plurality of protocols. The improved memory device has an interface circuit which receives communication signals from a communication bus. The interface...
7215134 Apparatus for determining burn-in reliability from wafer level burn-in  
A method, circuit and system for determining burn-in reliability from wafer level burn-in are disclosed. The method according to the present invention includes recording the number of failures in...
7194667 System for storing device test information on a semiconductor device using on-device logic for determination of test results  
A system for testing a semiconductor device and storing device test results in nonvolatile memory elements on the tested device, in which the semiconductor device includes logic circuitry which...
7155300 Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs  
An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on IC's at probe to determine whether any further repairs will be...
7150891 Method for conducting a cooking process with a cooking process probe  
A method for managing a cooking process in a cooking chamber according to a cooking program with one cooking process probe inserted at least partially into a product to be cooked in the cooking...
7124050 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture  
A method of manufacturing IC devices from semiconductor wafers includes providing the wafers and fabricating ICs on the wafers. At probe, a unique fuse ID is stored in each IC, and an electronic...
7120513 Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs  
An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on IC's at probe to determine whether any further repairs will be...
7120287 Non-lot based method for assembling integrated circuit devices  
An inventive method tracks IC devices through the assembly steps in a manufacturing process. Prior to die attach, a laser scribe marks the lead frame of each of the devices with a coded hole matrix...
7119568 Methods for wafer level burn-in  
A method, circuit and system for determining burn-in reliability from wafer level burn-in are disclosed. The method includes recording the number of failures in each IC die in nonvolatile elements...
7117063 Sorting a group of integrated circuit devices for those devices requiring special testing  
A method for sorting integrated circuit (IC) devices of the type having a fuse identification (ID) into those devices requiring enhanced reliability testing and those requiring standard testing...
7107117 Sorting a group of integrated circuit devices for those devices requiring special testing  
A method for sorting integrated circuit (IC) devices of the type having a fuse identification (ID) into those devices requiring enhanced reliability testing and those requiring standard testing...
7038481 Method and apparatus for determining burn-in reliability from wafer level burn-in  
A method and apparatus for determining burn-in reliability from wafer level burn-in are disclosed. The method according to the present invention includes recording the number of failures in each IC...
6972474 Semiconductor device having a fuse and a low heat conductive section for blowout of fuse  
In a semiconductor device having a fuse 11 which makes connection between a first interconnection 10 and a second interconnection 12 , and a first low heat-conductive section 13 which makes...
6944567 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting ICs mis-processed during their manufacture  
A method of manufacturing IC devices from semiconductor wafers includes providing the wafers and fabricating ICs on the wafers. At probe, a unique fuse ID is stored in each IC, and an electronic...
6943575 Method, circuit and system for determining burn-in reliability from wafer level burn-in  
A method, circuit and system for determining burn-in reliability from wafer level burn-in are disclosed. The method according to the present invention includes recording the number of failures in...
6894526 Apparatus for determining burn-in reliability from wafer level burn-in  
An apparatus for determining burn-in reliability from wafer level burn-in is disclosed. The apparatus according to the present invention includes nonvolatile elements on an integrated circuit for...
6829737 Method and system for storing device test information on a semiconductor device using on-device logic for determination of test results  
A method and system for testing a semiconductor device and storing device test results in nonvolatile memory elements on the tested device, in which the semiconductor device includes logic...
6753027 Method of controlling a cooking process and a cooking process sensor for use with the method  
In a method of controlling a cooking process, at least two temperature values are picked up by a cooking process sensor which is adapted to be stuck at least partly into food to be cooked. Specific...
6680519 Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry  
Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry are described. In one implementation, a first layer comprising a first...
6618273 Trace fuse  
A power providing device that has a battery, a protective housing a terminal cap, and a fuse on a substrate.
6617953 Link fuse  
A power providing device that has a battery, a protective housing a terminal cap and a fuse.
6566238 Metal wire fuse structure with cavity  
An integrated circuit has primary devices and redundant devices being selective substituted for the primary devices through at least one fuse. The fuse includes a first layer having at least one...
6365421 Method and apparatus for storage of test results within an integrated circuit  
An integrated circuit memory device has a plurality of nonvolatile programmable elements which are used to store a pass/fail status bit at selected milestones in a test sequence. At selected points...
6357911 Method and apparatus for predicting the equalized temperature of a food product  
In the processing of an item, particularly a food item, where the final equalized temperature is important to the processing a method and apparatus for predicting the equalized temperature is...
6300170 Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry  
Integrated circuitry fuse forming methods, integrated circuity programming methods, and related integrated circuitry are described. In one implementation, a first layer comprising a first...
6274440 Manufacturing of cavity fuses on gate conductor level  
A structure and method for making a cavity fuse over a gate conductor stack. The method includes providing a semiconductor substrate having a gate conductor stack over a shallow trench isolation...
6268638 Metal wire fuse structure with cavity  
An integrated circuit has primary devices and redundant devices being selective substituted for the primary devices through at least one fuse. The fuse includes a first layer having at least one...
6265299 Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry  
Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry are described. In one implementation, a first layer comprising a first...
EP1108998A1 Method and apparatus for predicting temperatures of a food product  
A method for predicting the equalised temperature of an item during processing of the item comprising the steps of applying a thermal shock to the item; measuring the surface temperature of the...
6249037 Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry  
Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry are described. In one implementation, a first layer comprising a first...
6238955 Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry  
Integrated circuitry fuse forming methods, integrated circuitry programming methods, and related integrated circuitry are described. In one implementation, a first layer comprising a first...
6190972 Method for storing information in a semiconductor device  
A semiconductor device includes a plurality of conductive layers that are formed on the substrate. Two electrically intercoupled sections of a read-only storage element, such as a fuse element,...
5822017 AGC for video signal comprising fusible links  
A fusing system is provided in connection with an integrated circuit, which may be mounted within a semiconductor integrated circuit package having a plurality of external pins. The fusing system...
5777384 Tunable semiconductor device  
The device includes a substrate (18). A first semiconductor die (12) is disposed on the substrate (18). The first semiconductor die (12) has a major surface (23) and at least a portion of the major...
5420456 ZAG fuse for reduced blow-current application  
A fuse, having reduced blow-current requirements thereby minimizing the power supply voltage and chip area required for the driver transistors, has a geometry which is characterized by an...
5284794 Method of making semiconductor device using a trimmable thin-film resistor  
A semiconductor device has a thin-film resistor trimmed by laser. The semiconductor device comprises a semiconductor substrate having an element region that covers at least part of the surface of...
4879587 Apparatus and method for forming fusible links  
A fusible link is described. It comprises a semiconductor substrate, an electrically insulating layer on the substrate, a pair of conductor elements on the surface of the insulating layer opposite...
4740485 Method for forming a fuse  
A method for forming a titanium tungsten fuse begins with the steps of forming a silicon dioxide layer (42), a titanium tungsten layer (44) and a aluminum layer (46) on a silicon substrate (40)....
4679310 Method of making improved metal silicide fuse for integrated circuit structure  
A method of making an improved metal silicide fuse of controlled thickness for an integrated circuit structure is disclosed. The metal silicide fuse is formed by first forming a layer of known...
4628272 Tuned inductorless active phase shift demodulator  
An inductorless quadrature demodulator for frequency modulated signals is disclosed. A limited FM signal is passed through an active filter (26) and a phase shift network (30) to produce a...
4587548 Lead frame with fusible links  
Copper lead frame for manufacturing a semiconductor chip carrier has signal leads extending from outer leads about the periphery of the frame and temporarily attached to a ground bus toward the...
4288911 Method for qualifying biased integrated circuits on a wafer level  
Integrated circuits in dice on a wafer are qualified by providing two sets of conductors connected to each die by fusible elements, biasing the dice using said conductors during exposure to a...
4272753 Integrated circuit fuse  
Fuses and interconnects are fabricated by applying a metallic layer on a substrate and a fusible layer on the metallic layer. Portions of the fusible layer are removed to define discrete fuse...
4209894 Fusible-link semiconductor memory  
A programmable read only memory array of the fusible link type employs a small part of a deposited metal film as a fuse. The film is covered by a protective glaze which seals the surface of the...
4198744 Process for fabrication of fuse and interconnects  
Fuses and interconnects are fabricated by applying a metallic layer on a substrate and a fusible layer on the metallic layer. Portions of the fusible layer are removed to define discrete fuse...
4188636 Semiconductor device having bump terminal electrodes  
A semiconductor device is disclosed in which a protrusion is interposed between a bump terminal electrode and the peripheral edge of the semiconductor substrate.
Matches 1 - 49 out of 49