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| 5689195 | Programmable logic array integrated circuit devices | November, 1997 | Cliff et al. | 326/41 |
| 5744980 | Flexible, high-performance static RAM architecture for field-programmable gate arrays | April, 1998 | McGowan et al. | 326/40 |
| 5787007 | Structure and method for loading RAM data within a programmable logic device | July, 1998 | Bauer | 716/16 |
| 5828229 | Programmable logic array integrated circuits | October, 1998 | Cliff et al. | 326/40 |
| 6127843 | Dual port SRAM memory for run time use in FPGA integrated circuits | October, 2000 | Agrawal et al. | 326/40 |
| WO/1998/010517 | March, 1998 | FPGA ARCHITECTURE HAVING RAM BLOCKS WITH PROGRAMMABLE WORD LENGTH AND WIDTH AND DEDICATED ADDRESS AND DATA LINES |
The following copending U.S. patent applications are owned by the owner of the present application, and their disclosures are incorporated herein by reference:
The disclosures of the following U.S. patent are incorporated herein by reference:
1. Field of the Invention
The invention is generally directed to integrated circuits, more specifically to on-chip memory provided for run-time use with on-chip logic circuits. The invention is yet more specifically directed to on-chip memory provided for run-time use within Programmable Logic Devices (PLD's), and even more specifically to a subclass of PLD's known as Field Programmable Gate Arrays (FPGA's).
2. Description of Related Art
Field-Programmable Logic Devices (FPLD's) have continuously evolved to better serve the unique needs of different end-users. From the time of introduction of simple PLD's such as the Advanced Micro Devices 22V10™ Programmable Array Logic device (PAL), the art has branched out in several different directions.
One evolutionary branch of FPLD's has grown along a paradigm known as Complex PLD's or CPLD's. This paradigm is characterized by devices such as the Advanced Micro Devices MACH™ family. Examples of CPLD circuitry are seen in U.S. Pat. Nos. 5,015,884 (issued May 14, 1991 to Om P. Agrawal et al.) and 5,151,623 (issued Sep. 29, 1992 to Om P. Agrawal et al.).
Another evolutionary chain in the art of field programmable logic has branched out along a paradigm known as Field Programmable Gate Arrays or FPGA's. Examples of such devices include the XC2000™ and XC3000™ families of FPGA devices introduced by Xilinx, Inc. of San Jose, Calif. The architectures of these devices are exemplified in U.S. Pat. Nos. 4,642,487; 4,706,216; 4,713,557; and 4,758,985; each of which is originally assigned to Xilinx, Inc.
An FPGA device can be characterized as an integrated circuit that has four major features as follows.
In addition to the above-mentioned basic components, it is sometimes desirable to include on-chip reprogrammable memory that is embedded between CLB's and available for run-time use by the CLB's and/or resources of the FPGA for temporarily holding storage data. This embedded run-time memory is to be distinguished from the configuration memory because the latter configuration memory is generally not reprogrammed while the FPGA device is operating in a run-time mode. The embedded run-time memory may be used in speed-critical paths of the implemented design to implement, for example, FIFO or LIFO elements that buffer data words on a first-in/first-out or last-in/first-out basis. Read/write speed, data validating speed, and appropriate interconnecting of such on-chip embedded memory to other resources of the FPGA can limit the ability of a given FPGA architecture to implement certain speed-critical designs.
Modern FPGA's tend to be fairly complex. They typically offer a large spectrum of user-configurable options with respect to how each of many CLB's should be configured, how each of many interconnect resources should be configured, and how each of many IOB's should be configured. Rather than determining with pencil and paper how each of the configurable resources of an FPGA device should be programmed, it is common practice to employ a computer and appropriate FPGA-configuring software to automatically generate the configuration instruction signals that will be supplied to, and that will cause an unprogrammed FPGA to implement a specific design.
FPGA-configuring software typically cycles through a series of phases, referred to commonly as ‘partitioning’, ‘placement’, and ‘routing’. This software is sometimes referred to as a ‘place and route’ program. Alternate names may include, ‘synthesis, mapping and optimization tools’.
In the partitioning phase, an original circuit design (which is usually relatively large and complex) is divided into smaller chunks, where each chunk is made sufficiently small to be implemented by a single CLB, the single CLB being a yet-unspecified one of the many CLB's that are available in the yet-unprogrammed FPGA device. Differently designed FPGA's can have differently designed CLB's with respective logic-implementing resources. As such, the maximum size of a partitioned chunk can vary in accordance with the specific FPGA device that is designated to implement the original circuit design. The original circuit design can be specified in terms of a gate level description, or in Hardware Descriptor Language (HDL) form or in other suitable form.
After the partitioning phase is carried out, each resulting chunk is virtually positioned into a specific, chunk-implementing CLB of the designated FPGA during a subsequent placement phase.
In the ensuing routing phase, an attempt is made to algorithmically establish connections between the various chunk-implementing CLB's of the FPGA device, using the interconnect resources of the designated FPGA device. The goal is to reconstruct the original circuit design by reconnecting all the partitioned and placed chunks.
If all goes well in the partitioning, placement, and routing phases, the FPGA configuring software will find a workable ‘solution’ comprised of a specific partitioning of the original circuit, a specific set of CLB placements and a specific set of interconnect usage decisions (routings). It can then deem its mission to be complete and it can use the placement and routing results to generate the configuring code that will be used to correspondingly configure the designated FPGA.
In various instances, however, the FPGA configuring software may find that it cannot complete its mission successfully on a first try. It may find, for example that the initially-chosen placement strategy prevents the routing phase from completing successfully. This might occur because signal routing resources have been exhausted in one or more congested parts of the designated FPGA device. Some necessary interconnections may have not been completed through those congested parts. Alternatively, all necessary interconnections may have been completed, but the FPGA configuring software may find that simulation-predicted performance of the resulting circuit (the so-configured FPGA) is below an acceptable threshold. For example, signal propagation time may be too large in a speed-critical part of the FPGA-implemented circuit. More specifically, certain synchronization signals may need to propagate from one section of the FPGA to another according to a particular sequence and architectural constraints of the FPGA device may impede this from happening in an efficient manner in so far as resource utilization is concerned.
Given this, if the initial partitioning, placement and routing phases do not provide an acceptable solution, the FPGA configuring software will try to modify its initial place and route choices so as to remedy the problem. Typically, the software will make iterative modifications to its initial choices until at least a functional place-and-route strategy is found (one where all necessary connections are completed), and more preferably until a place-and-route strategy is found that brings performance of the FPGA-implemented circuit to a near-optimum point. The latter step is at times referred to as ‘optimization’. Modifications attempted by the software may include re-partitionings of the original circuit design as well as repeated iterations of the place and route phases.
There are usually a very large number of possible choices in each of the partitioning, placement, and routing phases. FPGA configuring programs typically try to explore a multitude of promising avenues within a finite amount of time to see what effects each partitioning, placement, and routing move may have on the ultimate outcome. This in a way is analogous to how chess-playing machines explore ramifications of each move to each chess piece on the end-game. Even when relatively powerful, high-speed computers are used, it may take the FPGA configuring software a significant amount of time to find a workable solution. Turn around time can take more than 8 hours.
In some instances, even after having spent a large amount of time trying to find a solution for a given FPGA-implementation problem, the FPGA configuring software may fail to come up with a workable solution and the time spent becomes lost turn-around time. It may be that, because of packing inefficiencies, the user has chosen too small an FPGA device for implementing too large of an original circuit.
Another possibility is that the internal architecture of the designated FPGA device does not mesh well with the organization and/or timing requirements of the original circuit design.
Organizations of original circuit designs can include portions that may be described as ‘random logic’ (because they have no generally repeating pattern). The organizations can additionally or alternatively include portions that may be described as ‘bus oriented’ (because they carry out nibble-wide, byte-wide, or word-wide, parallel operations). The organizations can yet further include portions that may be described as ‘matrix oriented’ (because they carry out matrix-like operations such as multiplying two, multidimensional vectors). These are just examples of taxonomical descriptions that may be applied to various design organizations. Another example is ‘control logic’ which is less random than fully ‘random logic’ but less regular than ‘bus oriented’ designs. There may be many more taxonomical descriptions. The point being made here is that some FPGA structures may be better suited for implementing random logic while others may be better suited for implementing bus oriented designs or other kinds of designs. In cases where embedded memory is present, the architecture of the embedded memory can play an important role in determining how well a given taxonomically-distinct design is accommodated. Compatibility between the embedded memory architecture and the architecture of intertwined CLB's and interconnect can also play an important role in determining how well a given taxonomically-distinct design is accommodated.
If after a number of tries, the FPGA configuring software fails to find a workable solution, the user may choose to try again with a differently-structured FPGA device. The user may alternatively choose to spread the problem out over a larger number of FPGA devices, or even to switch to another circuit implementing strategy such as CPLD or ASIC (where the latter is an Application Specific hardwired design of an IC). Each of these options invariably consumes extra time and can incur more costs than originally planned for.
FPGA device users usually do not want to suffer through such problems. Instead, they typically want to see a fast turnaround time of no more than, say 4 hours, between the time they complete their original circuit design and the time a first-run FPGA is available to implement and physically test that design. More preferably, they would want to see a fast turnaround time of no more than, say 30 minutes, for successful completion of the FPGA configuring software when executing on a 80486-80686 PC platform (that is, a socommercially specified, IBM compatible personal computer) and implementing a 25000 gate or less, design in a target FPGA device.
FPGA users also usually want the circuit implemented by the FPGA to provide an optimal emulation of the original design in terms of function packing density, cost, speed, power usage, and so forth irrespective of whether the original design is taxonomically describable generally as ‘random logic’, or as ‘bus oriented’, ‘memory oriented’, or as a combination of these, or otherwise.
When multiple FPGA's are required to implement a very large original design, high function packing density and efficient use of FPGA internal resources are desired so that implementation costs can be minimized in terms of both the number of FPGA's that will have to be purchased and the amount of printed circuit board space that will be consumed.
Even when only one FPGA is needed to implement a given design, a relatively high function packing density is still desirable because it usually means that performance speed is being optimized due to reduced wire length. It also usually means that a lower cost member of a family of differently sized FPGA's can be selected or that unused resources of the one FPGA can be reserved for future expansion needs.
In summary, end users want the FPGA configuring software to complete its task quickly and to provide an efficiently-packed, high-speed compilation of the functionalities provided by an original circuit design irrespective of the taxonomic organization of the original design.
In the past, it was thought that attainment of these goals was primarily the responsibility of the computer programmers who designed the FPGA configuring software. It has been shown however, that the architecture or topology of the unprogrammed FPGA can play a significant role in determining how well and how quickly the FPGA configuring software completes the partitioning, placement, and routing tasks.
As indicated above, the architectural layout, implementation, and use of on-chip embedded memory can also play a role in how well the FPGA configuring software is able to complete the partitioning, placement and routing tasks with respect to using embedded memory; and also how well the FPGA-implemented circuit performs in terms of propagating signals into, through and out of the on-chip embedded memory.
An improved FPGA device in accordance with the invention includes one or more columns of multi-ported SRAM blocks for holding run-time storage data.
In each such SRAM block, at least a first of the multiple ports is a read/write port (Port_ 1 ) which can receive first address signals and respond by directing the writing of further-received first data to an address-defined first area of the SRAM block and which can alternatively respond by directing the reading of stored data from an address-defined area of the SRAM block. A second of the multiple ports (Port_ 2 ) has at least an independent read-capability such that the second port can receive respective second address signals and can respond independently of the first port by reading stored second data from a respective address-defined area of the SRAM block.
The address signals that drive the multiple ports of each SRAM block generally come from respective signal sources that have changing output states. In accordance with the invention, one or more address-capturing registers are provided for a respective one or more of the multiple ports of each SRAM block for capturing a respective address signal for that port in response to an address-validating strobe signal. The address-validating strobe signal is routable to the respective signal source of the address signal so that the address-validating strobe signal may be used to enable a changing of the output state of the signal source once the respective address signal has been captured by the address-capturing register.
In one embodiment, an address-validating strobe signal of each SRAM block may be coupled by userconfiguration from a special SRAM control bus (SVIC) to crossing bidirectional interconnect lines (e.g., tri-stated horizontal longlines) for providing timingsynchronization to the respective signal source of the address signal so that the address-validating strobe signal may be used to enable a changing of the output state of the signal source once the respective address signal has been captured by the address-capturing register.
Further in accordance with the invention, one or more data-capturing registers are provided for a respective one or more of the multiple ports of each SRAM block for capturing a respective data signal for that port in response to a data-validating strobe signal.
When data writing is taking place, the data-validating strobe signal is routable to the respective signal source of the data signal so that the data-validating strobe signal may be used to enable a changing of the output state of the signal source once the respective data write signal has been captured by the data-capturing register.
When data reading is taking place, the data-validating strobe signal is routable to respective logic of the data signal destination so that the data-validating strobe signal may be used to indicate to that logic that a valid data output state is present for the respective to-be read data signal which has now been captured by the data-capturing register.
In one embodiment, special, vertical interconnect channels are provided adjacent to embedded SRAM columns for supplying the address-validating strobe signals and data-validating strobe signals to the SRAM blocks as well as additional control signals. The control signals (which include the address-validating and data-validating strobe signals) may be broadcast via special longlines (SMaxL lines) to all SRAM blocks of a given column or localized to groups of SRAM blocks in a given column by using shorter special vertical lines (S 4 xL lines).
One of the features of embodiments that include the address-capturing registers is that read operations can be performed simultaneously at the multiple ports of each SRAM block using respective, and typically different, address signals for each such port, as well as different interconnect lines for transferring the output data. The data output (data reading) bandwidth of the embedded memory can be thereby maximized, if such maximize bandwidth is desired. Logic circuits can engage in generating a next, new address signals even while the SRAM blocks are busy responding to register-captured, old address signals. Such pipelining of operations can help to increase overall system bandwidth.
Another of the features of embodiments that include the data-capturing registers is that the SRAM blocks can begin responding to new address signals even while the destination logic blocks of old data are busy responding to register-captured, old data signals. Such pipelining of operations can help to increase overall system bandwidth.
Other aspects of the invention will become apparent from the below detailed description.
The below detailed description makes reference to the accompanying drawings, in which:
FIG. 1 illustrates FIGS. 1A and 1B illustrate a first FPGA having an 8×8 matrix of VGB's (Variable Grain Blocks) with an embedded left memory column (LMC) and an embedded right memory column (RMC) in accordance with the invention;
FIG. 2 is a diagram showing the placement of switch boxes along double length, quad length, and octal length lines within normal interconnect channels of another, like FPGA device having a 20×20 matrix of VGB's with embedded LMC and RMC;
FIG. 3 illustrates FIGS. 3A and 3B illustrate more details of a Right Memory Column (RMC), and in particular of two adjacent memory blocks and of the relation of the memory blocks to an adjacent super-VGB core tile and its horizontal interconnect channels (HIC's);
FIG. 4 illustrates how the 2/4/8xL output lines of respective CBB's (X, Z, W, Y) within a SVGB are configurably couplable to surrounding interconnect channels;
FIG. 5 illustrates how MaxL line drivers of respective SVGB's are coupled to surrounding interconnect channels;
FIG. 6A shows one embodiment of a VGB;
FIG. 6B shows an exemplary CSE (Configurable Sequential Element) having a flip flop that is responsive to a VGB clock signal;
FIG. 7A illustrates how the MaxL line drivers of respective IOB's are coupled to surrounding interconnect channels in one embodiment of the invention;
FIG. 7B illustrates internal components of an exemplary IOB (configurable Input/Output Block)having plural flip flops that are respectively responsive to respective IOB input and output clock signals;
FIG. 7C illustrates an exemplary IOB controls-acquiring multiplexer that may be used for acquiring respective IOB input and output clock signals from neighboring interconnect lines;
FIG. 8 is a further magnified illustration of one embodiment of FIG. 3, showing further details of a Right Memory Column (RMC), and in particular of a given SRAM block in accordance with the invention and its neighboring interconnect channels;
FIG. 9 is a further magnified illustration of one embodiment of FIG. 8, showing further details inside of a given SRAM block;
FIG. 10 is a block diagram of embodiments of FPGA devices, including those conform with FIG. 9 as one set of alternatives, wherein respective flows may be seen for respective address signals, address-validating strobe signals, memory data signals, and memory data-validating strobe signals of dual-ported SRAM block; and
FIG. 11A is a schematic diagram of an FPGA configuring process wherein a predefined design definition is supplied to an FPGA compiling software module; and
FIG. 11 B is a flow chart of FPGA-configuration software that takes advantage of the ability to configurably route respective address-validating strobe signals and data-validating strobe signals in FPGA devices that conform to the present invention.
FIG. 1 shows a macroscopic view of an FPGA device 100 in accordance with the invention. The illustrated structure is preferably formed as a monolithic integrated circuit.
The macroscopic view of FIG. 1 is to be understood as being taken at a magnification level that is lower than later-provided, microscopic views. The more microscopic views may reveal greater levels of detail which may not be seen in more macroscopic views. And in counter to that, the more macroscopic views may reveal gross architectural features which may not be seen in more microscopic views. It is to be understood that for each more macroscopic view, there can be many alternate microscopic views and that the illustration herein of a sample microscopic view does not limit the possible embodiments of the macroscopically viewed entity. Similarly, the illustration herein of a sample macroscopic view does not limit the possible embodiments into which a microscopically viewed embodiment might be included.
FPGA device 100 comprises a regular matrix of super structures defined herein as super-VGB's (SVGB's). In the illustrated embodiment, a dashed box(upper left corner) circumscribes one such super-VGB structure which is referenced as 101 . There are four super-VGB's shown in each super row of FIG. 1 and also four super-VGB's shown in each super column. Each super row or column contains plural rows or columns of VGB's. One super column is identified as an example by the braces at 111 . Larger matrices with more super-VGB's per super column and/or super row are of course contemplated. FIG. 1 is merely an example.
There is a hierarchy of user-configurable resources within each super-VGB. At a next lower level, each super-VGB is seen to contain four VGB's. In the illustrated embodiment, identifier 102 points to one such VGB within SVGB 101 .
A VGB is a Variable Grain Block that includes its own hierarchy of user configurable resources. At a next lower level, each VGB is seen to contain four Configurable Building Blocks or CBB's arranged in a L-shaped configuration. In the illustrated embodiment, identifier 103 points to one such CBB within VGB 102 .
At a next lower level, each CBB has its own hierarchy of user configurable resources. Some of these (e.g., a CSE) will be shown in later figures. A more detailed description of the hierarchal resources of the super-VGB's, VGB's, CBB's, and so forth, may be found in the above-cited Ser. No. 08/948,306filed Oct. 9, 1997 by Om P. Agrawal et al. and originally entitled, VARIABLE GRAIN ARCHITECTURE FOR FPGA INTEGRATED CIRCUITS, whose disclosure is incorporated herein by reference.
It is sufficient for the present to appreciate that each CBB includes a clocked flip flop and that each CBB is capable of producing at least one bit of result data and/or storing one bit of data in its flip flop and/or of outputting the stored and/or result data to adjacent interconnect lines. Each VGB ( 102 ) is in turn, therefore capable of producing and outputting at least 4 such result bits at a time to adjacent interconnect lines. This is referred to as nibble-wide processing. Nibble-wide processing may also be carried out by the four CBB's that line the side of each SVGB (e.g., 101 ).
With respect to the adjacent interconnect lines (AIL's), each SVGB is bounded by two horizontal and two vertical interconnect channels (HIC's and VIC's). An example of a HIC is shown at 150 . A sample VIC is shown at 160 . Each such interconnect channel contains a diverse set of interconnect lines as will be seen later.
The combination of each SVGB (e.g., 101 ) and its surrounding interconnect resources (of which resources, not all are shown in FIG. 1) is referred to as a matrix tile. Matrix tiles are tiled one to the next as seen, with an exception occurring about the vertical sides of the two central, super columns, 115 . Columns 114 (LMC) and 116 (RMC) of embedded memory are provided along the vertical sides of the central pair 115 of super columns. These columns 114 , 116 will be examined in closer detail shortly.
From a more generalized perspective, the tiling of the plural tiles creates pairs of adjacent interconnect channels within the core of the device 100 . An example of a pair of adjacent interconnect channels is seen at HIC's 1 and 2 . The peripheral channels (HIC 0 , HIC 7 , VIC 0 , VIC 7 ) are not so paired. Switch matrix boxes (not shown, see FIG. 2) are provided at the intersections of the respective vertical and horizontal interconnect channels. The switch matrix boxes form part of each matrix tile construct that includes a super-VGB at its center. See area 465 of FIG. 3 .
The left memory column (LMC) 114 is embedded as shown to the left of central columns pair 115 . The right memory column (RMC) 116 is further embedded as shown to the right of the central columns pair 115 . It is contemplated to have alternate embodiments with greater numbers of such embedded memory columns symmetrically distributed in the FPGA device and connected in accordance with the teachings provided herein for the illustrative pair of columns, 114 and 116 . It is also possible to additionally have embedded rows of such embedded memory extending horizontally.
Within the illustrated LMC 114 , a first, special, vertical interconnect channel (SVIC) 164 is provided adjacent to respective, left memory blocks MLO through ML 7 . Within the illustrated RMC 164 , a second, special, vertical interconnect channel (SVIC) 166 is provided adjacent to respective, right memory blocks MRO through MR 7 .
As seen, the memory blocks, ML 0 -ML 7 and MR 0 -MR 7 are numbered in accordance with the VGB row they sit in (or the HIC they are closest to) and are further designated as left or right (L or R) depending on whether they are respectively situated in LMC 114 or RMC 116 . In one embodiment, each of memory blocks, ML 0 -ML 7 and MR 0 -MR 7 is organized to store and retrieve an addressable plurality of nibbles, where a nibble contains 4 data bits. More specifically, in one embodiment, each of memory blocks, ML 0 -ML 7 and MR 0 -MR 7 has an internal SRAM array organized as a group of 32 nibbles (32×4=128 bits) where each nibble is individually addressable by five address bits. The nibble-wise organization of the memory blocks, ML 0 -ML 7 and MR 0 -MR 7 corresponds to the nibble-wise organization of each VGB ( 102 ) and/or to the nibble-wise organization of each group of four CBB's that line the side of each SVGB ( 101 ). Thus, there is a data-width match between each embedded memory block and each group of four CBB's or VGB. As will be seen a similar kind of data-width matching also occurs within the diversified resources of the general interconnect mesh.
At the periphery of the FPGA device 100 , there are three input/output blocks (IOB's) for each row of VGB's and for each column of VGB's. One such IOB is denoted at 140 . The IOB's in the illustrated embodiment are shown numbered from 1 to 96 . In one embodiment, there are no IOB's directly above and below the LMC 114 and the RMC 116 . In an alternate embodiment, special IOB's such as shown in phantom at 113 are provided at the end of each memory column for driving address and control signals into the corresponding memory column.
Each trio of regular IOB's at the left side ( 1 - 24 ) and the right side ( 49 - 72 ) of the illustrated device 100 may be user-configured to couple data signals to the nearest HIC. Similarly, each trio of regular IOB's on the bottom side ( 25 - 48 ) and top side ( 73 - 96 ) may be user-configured for exchanging input and/or output data signals with lines inside the nearest corresponding VIC. The SIOB's (e.g., 113 ), if present, may be userconfigured to exchange signals with the nearest SVIC (e.g., 164 ). Irrespective of whether the SIOB's (e.g., 113 ) are present, data may be input and/or output from points external of the device 100 to/from the embedded memory columns 114 , 116 by way of the left side IOB's ( 1 - 24 ) and the right side IOB's ( 49 - 72 ) using longline coupling, as will be seen below. The longline coupling allows signals to move with essentially same speed and connectivity options from/to either of the left or right side IOB's ( 1 - 24 , 49 - 72 ) respectively to/from either of the left or right side memory columns.
It is sufficient for the present to appreciate that each IOB includes one or more clocked flip flops and that each IOB is capable of receiving at least one bit of external input data from a point outside the FPGA device, and/or outputting at least one bit of external output data to a point outside the FPGA device, and/or storing one bit of input or output data in respective ones of its one or more flip flops, and/or of transferring such external input or output data respectively to or from adjacent interconnect lines. Each set of 24 IOB's that lie adjacent to a corresponding one of the peripheral HIC's and VIC's may therefore transfer in parallel, as many as 24 I/O bits at a time. Such transference may couple to the adjacent one of the peripheral HIC's and VIC's and/or to neighboring VGB's.
Data and/or address and/or control signals may be generated within the FPGA device 100 by its internal VGB's and transmitted to the embedded memory 114 , 116 by way of the peripheral and inner HIC's, as will be seen below.
The VGB's are numbered according to their column and row positions. Accordingly, VGB( 0 , 0 ) is in the top left corner of the device 100 , VGB( 7 , 7 ) is in the bottom right corner of the device 100 ; and VGB( 1 , 1 ) is in the bottom right corner of SVGB 101 .
Each SVGB ( 101 ) may have centrally-shared resources. Such centrally-shared resources are represented in FIG. 1 by the diamond-shaped hollow at the center of each illustrated super-VGB (e.g., 101 ). Longline driving amplifiers (see FIG. 5) correspond with these diamond-shaped hollows and have their respective outputs coupling vertically and horizontally to the adjacent HIC's and VIC's of their respective superVGB's.
As indicated above, each super-VGB in FIG. 1 has four CBB's along each of its four sides. The four CBB's of each such interconnect-adjacent side of each super-VGB can store a corresponding four bits of result data internally so as to define a nibble of data for output onto the adjacent interconnect lines. At the same time, each VGB contains four CBB's of the L-shaped configuration which can acquire and process a nibble's worth of data. One of these processes is nibble-wide addition within each VGB as will be described below. Another of these processes is implementation of a 4:1 dynamic multiplexer within each CBB. The presentation of CBB's in groups of same number (e.g., 4 per side of a super-VGB and 4 within each VGB) provides for a balanced handling of multi-bit data packets along rows and columns of the FPGA matrix. For example, nibbles may be processed in parallel by one column of CBB's and the results may be efficiently transferred in parallel to an adjacent column of CBB's for further processing. Such nibble-wide handling of data also applies to the embedded memory columns 114 / 116 . As will be seen, nibble-wide data may be transferred between one or more groups of four CBB's each to a corresponding one or more blocks of embedded memory (MLx or MRx) by way of set of 4 equally-long lines in a nearby HIC. Each such set of 4 equally-long lines may be constituted by so-called, double-length lines (2xL lines), quad-length lines (4xL lines), octal-length lines (8xL lines) or maximum length longlines (MaxL lines).
In one particular embodiment of the FPGA device, the basic matrix is 10-by-10 SVGB's, with embedded memory columns 114 / 116 positioned around the central two super columns 115 . (See FIG. 2.) In that particular embodiment, the integrated circuit may be formed on a semiconductor die having an area of about 100,000 mils 2 or less. The integrated circuit may include four metal layers for forming interconnect. So-called ‘direct connect’ lines and ‘longlines’ of the interconnect are preferably implemented entirely by the metal layers so as to provide for low resistance pathways and thus relatively small RC time constants on such interconnect lines. Logic-implementing transistors of the integrated circuit have drawn channel lengths of 0.35 microns or 0.25 microns or less. Amplifier output transistors and transistors used for interfacing the device to external signals may be larger, however.
As indicated above, the general interconnect channels (e.g., HIC 150 , VIC 160 of FIG. 1) contain a diverse set of interconnect lines. FIG. 2 shows a distribution 200 of different-length horizontal interconnect lines (2xL, 4xL, 8xL) and associated switch boxes of a single horizontal interconnect channel (HIC) 201 , as aligned relative to vertical interconnect channels in an FPGA of the invention. This particular FPGA has a 10×10 matrix of super-VGB's (or a 20×20 matrix of VGB's). The embedded memory columns ( 114 / 116 ) are not fully shown, but are understood to be respectively embedded in one embodiment, between VIC's 7 - 8 and 11 - 12 , as indicated by zig-zag symbols 214 and 216 .
For an alternate embodiment, symbol 214 may be placed between VIC's 6 and 7 while symbol 216 is placed between VIC's 12 and 13 to indicate the alternate placement of the embedded memory columns 114 / 116 between said VIC's in the alternate embodiment. For yet another alternate embodiment, zig-zag symbol 214 may be placed between VIC's 8 and 9 while zig-zag symbol 216 is placed between VIC's 10 and 11 to represent corresponding placement of the embedded memory columns 114 / 116 in the corresponding locations. Of course, asymmetrical placement of the embedded memory columns 114 / 116 relative to the central pair of SVGB columns ( 115 ) is also contemplated. In view of these varying placement possibilities, the below descriptions of which 2xL, 4xL, or 8xL line intersects with corresponding columns 214 / 216 should, of course, be read as corresponding to the illustrated placement of symbols 214 and 216 respectively between VIC's 7 - 8 and VIC's 11 - 12 with corresponding adjustments being made if one of the alternate placements of 214 / 216 is chosen instead.
By way of a general introduction to the subject of interconnect resources, it should be noted that the interconnect mesh of FPGA 100 includes lines having different lengths. It may be said that, without taking into account any length changes created by the imposition of the embedded memory columns 114 / 116 , the horizontally-extending general interconnect channels (HIC's) and vertically-extending general interconnect channels (VIC's) of the FPGA device 100 are provided with essentially same and symmetrically balanced interconnect resources for their respective horizontal (x) and vertical (y) directions. These interconnect resources include a diversified and granulated assortment of MaxL lines, 2xL lines, 4xL lines and 8xL lines as well as corresponding 2xL switch boxes, 4xL switch boxes, and 8xL boxes.
In one embodiment, each general channel, such as the illustrated example in FIG. 2 of HIC 201 (the horizontal interconnect channel), contains at least the following resources: eight double-length (2xL) lines, four quad-length (4xL) lines, four octal-length (8xL) lines, sixteen full-length (MaxL) lines, sixteen directconnect (DC) lines, eight feedback (FB) lines and two dedicated clock (CLK) lines. Vertical ones of the general interconnect channels (VIC's) may contain an additional global reset (GR) longline. Parts of this total of 58/59 lines may be seen in FIGS. 4 and 5 as having corresponding designations AILO through AIL 57 / 58 for respective interconnect lines that are adjacent to corresponding VGB's. Not all of the different kinds of lines are shown in FIG. 2 . Note that each of the 2xL, 4xL, 8xL and MaxL line sets includes at least four lines of its own kind for carrying a corresponding nibble's worth of data or address or control signals.
In FIG. 2, core channels 1 through 18 are laid out as adjacent pairs of odd and even channels. Peripheral channels 0 and 19 run alone along side the IOB's (see FIG. 1 ). Although not shown in FIG. 2, it should be understood that each switch box has both horizontally-directed and vertically-directed ones of the respective 2xL, 4xL, and 8xL lines entering into that respective switch box. (See region 465 of FIG. 3.) A given switchbox (XxSw) may be user-configured to continue a signal along to the next XxL line (e.g., 2xL line) of a same direction and/or to couple the signal to a corresponding same kind of XxL line of an orthogonal direction. A more detailed description of switchboxes for one embodiment may be found in the above-cited, U.S. Ser. No. 09/008,762, filed Jan. 19, 1998 by inventors Om Agrawal et al whose disclosure is incorporated herein by reference.
Group 202 represents the 2xL lines of HIC 201 and their corresponding switch boxes. For all of the 2xL lines, each such line spans the distance of essentially two adjacent VGB's (or one super-VGB). Most 2xL lines terminate at both ends into corresponding 2x switch boxes (2xSw's). The terminating 2xSw boxes are either both in even-numbered channels or both in odd-numbered channels. Exceptions occur at the periphery where either an odd or even-numbered channel is nonexistent. As seen in the illustrated embodiment 200 , interconnections can be made via switch boxes from the 2xL lines of HIC 201 to any of the odd and even-numbered vertical interconnect channels (VIC's) 0 - 19 .
With respect to the illustrated placement 214 / 216 of embedded memory columns 114 / 116 , note in particular that 2xL line 223 and/or its like (other, similarly oriented 2xL lines) may be used to provide a short-haul, configurable connection from SVGB 253 (the one positioned to the right of VIC # 6 ) to LMC 214 . Similarly, line 224 and its like may be used to provide a short-haul connection from SVGB 254 (the one positioned to the right of VIC # 8 ) to LMC 214 . Line 225 and/or its like may be used to provide a short-haul connection from SVGB 255 to RMC 216 . Line 226 and/or its like may be used to provide a short-haul connection from SVGB 256 to RMC 216 . Such short-haul connections may be useful for quickly transmitting speed-critical signals such as address signals and/or data signals between a nearby SVGB ( 253 - 256 ) and the corresponding embedded memory column 114 or 116 .
Group 204 represents the 4xL lines of HIC 201 and their corresponding switch boxes. Most 4xL lines each span the distance of essentially four, linearly-adjacent VGB's and terminate at both ends into corresponding 4x switch boxes (4xSw's). The terminating 4xSw boxes are either both in even-numbered channels or both in odd-numbered channels. As seen in the illustrated embodiment 200 , interconnections can be made via switch boxes from the 4xL lines of HIC 201 to any of the odd and evennumbered vertical interconnect channels (VIC's) 0 - 19 .
With respect to the illustrated placement 214 / 216 of embedded memory columns 114 / 116 , note in particular that 4xL line 242 and/or its like (other, similarly oriented 4xL lines that can provide generally similar coupling) may be used to provide a medium-haul configurable connection between LMC 214 and either one or both of SVGB 252 and SVGB 253 . Line 243 and/or its like may be used to provide a configurable connection of medium-length between LMC 214 and either one or both of SVGB's 253 and 254 . Similarly, line 245 and/or its like may be used to provide medium-length coupling between RMC 216 and either one or both of SVGB's 255 and 256 . Moreover, line 247 and/or its like may be used to configurably provide medium-haul interconnection between RMC 216 and either one or both of SVGB's 257 and 256 . Such medium-haul interconnections may be useful for quickly propagating address signals and/or data signals in comparatively medium-speed applications.
Group 208 represents the 8xL lines of HIC 201 and their corresponding switch boxes. Most 8xL lines (7 out of 12) each spans the distance of essentially eight, linearly-adjacent VGB's. A fair number of other 8xL lines (5 out of 12) each spans distances less than that of eight, linearly-adjacent VGB's. Each 8xL line terminates at least one end into a corresponding 8x switch box (8xSw). The terminating 8xSw boxes are available in this embodiment only in the core oddnumbered channels ( 1 , 3 , 5 , 7 , 9 , 11 , 13 , 15 and 17 ). Thus, in embodiment 200 , interconnections can be made via switch boxes from the 8xL lines of HIC 201 to any of the nonperipheral, odd-numbered vertical interconnect channels (VIC's). It is within the contemplation of the invention to have the 8xSw boxes distributed symmetrically in other fashions such that even-numbered channels are also covered.
With respect to the illustrated placement 214 / 216 of embedded memory columns 114 / 116 , note in particular that 8xL line 281 or its like may be used to provide even longer-haul, configurable connection from between LMC 214 and any one or more of SVGB's 251 - 254 . (In one embodiment where 214 places to the left of VIC 7 , 8xL line 280 provides configurable interconnection between LMC 214 and any one or more of SVGB's 250 - 253 .) In the illustrated embodiment, 8xL line 282 may be used to provide 8xL coupling between any two or more of: LMC 214 and SVGB's 252 - 255 . Line 283 may be used to provide 8xL coupling between any two or more of: LMC 214 , RMC 216 , and SVGB's 253 - 256 . Line 284 may be used to provide 8xL coupling between any two or more of: LMC 214 , RMC 216 , and SVGB's 254 - 257 . Line 285 may be used to provide 8xL coupling between any two or more of: RMC 216 and SVGB's 255 - 258 . Line 286 may be similarly used to provide 8xL coupling between any two or more of: RMC 216 and SVGB's 256 - 259 . Although the largest of the limited-length lines is 8xL in the embodiment of FIG. 2, it is within the contemplation of the invention to further have 16xL lines, 32xL lines and so forth in arrays with larger numbers of VGB's.
In addition to providing configurable coupling between the intersecting memory channel 214 and/or 216 , each of the corresponding 2xL, 4xL, 8xL and so forth lines may be additionally used for conveying such signals between their respective switchboxes and corresponding components of the intersecting memory channel.
Referring briefly back to FIG. 1, it should be noted that the two central super columns 115 are ideally situated for generating address and control signals and broadcasting the same by way of short-haul connections to the adjacent memory columns 114 and 116 . High-speed data may be similarly conveyed from the memory columns 114 / 116 to the SVGB's of central columns 115 .
Before exploring more details of the architecture of FPGA device 100 , it will be useful to briefly define various symbols that may be used within the drawings. Unless otherwise stated, a single line going into a trapezoidal multiplexer symbol is understood to represent an input bus of one or more wires. Each open square box (MIP) along such a bus represents a point for user-configurable acquisition of a signal from a crossing line to the multiplexer input bus. In one embodiment, a PIP (programmable interconnect point) is placed at each MIP occupied intersection of a crossing line and the multiplexer input bus. Each of PIP (which may be represented herein as a hollow circle) is understood to have a single configuration memory bit controlling its state. In the active state the PIP creates a connection between its crossing lines. In the inactive state the PIP leaves an open between the illustrated crossing lines. Each of the crossing lines remains continuous however in its respective direction (e.g., x or y).
PIP's (each of which may be represented herein by a hollow circle covering a crossing of two continuous lines) may be implemented in a variety of manners as is well known in the art. In one embodiment pass transistors such as MOSFET's may be used with their source and drain respectively coupled to the two crossing lines while the transistor gate is controlled by a configuration memory bit. In an alternate embodiment, nonvolatilely-programmable floating gate transistors may be used with their source and drain respectively coupled to the crossing lines. The charge on the floating gate of such transistors may represent the configuration memory bit. A dynamic signal or a static turn-on voltage may be applied to the control gate of such a transistor as desired. In yet another alternate embodiment, nonvolatilely-programmable fuses or anti-fuses may be provided as PIP's with their respective ends being connected to the crossing lines. One may have bidirectional PIP's for which signal flow between the crossing lines (e.g., 0 and 1 ) can move in either direction. Where desirable, PIP's can also be implemented with unidirectional signal coupling means such as AND gates, tri-state drivers, and so forth.
An alternate symbol for a group of PIP's is constituted herein by a hollow and tilted ellipse covering a bus such as is seen in FIG. 10 .
Another symbol that may be used herein is a hollow circle with an ‘X’ inside. This represents a POP. POP stands for ‘Programmable Opening Point’. Unless otherwise stated, each POP is understood to have a single configuration memory bit controlling its state. In the active state the POP creates an opening between the colinear lines entering it from opposing sides. In the inactive state the POP leaves closed an implied connection between the colinear lines entering it. Possible implementations of POP's include pass transistors and tri-state drivers. Many other alternatives will be apparent to those skilled in the art.
Referring now to FIG. 3, this figure provides a mid-scopic view of some components within an exemplary matrix tile 400 that lays adjacent to embedded memory column, RMC 416 . Of course, other implementations are possible for the more macroscopic view of FIG. 1 .
The mid-scopic view of FIG. 3 shows four VGB's brought tightly together in mirror opposition to one another. The four, so-wedged together VGB's are respectively designated as ( 0 , 0 ), ( 0 , 1 ), ( 1 , 0 ) and ( 1 , 1 ). The four VGB's are also respectively and alternately designated herein as VGB_A, VGB_B, VGB_C, and VGB_D.
Reference number 430 points to VGB_A which is located at relative VGB row and VGB column position ( 0 , 0 ). Some VGB internal structures such as CBB's Y, W, Z, and X are visible in the mid-scopic view of FIG. 3 . An example of a Configurable Building Block (CBB) is indicated by 410 . As seen, the CBB's 410 of each VGB 430 are arranged in an L-shaped organization and placed near adjacent interconnect lines. Further VGB internal structures such as each VGB's common controls developing (Ctrl) section, each VGB's wide-gating supporting section, each VGB's carry-chaining (Fast Carry) section, and each VGB's coupling to a shared circuit 450 of a corresponding super-structure (super-VGB) are also visible in the mid-scopic view of FIG. 3 . VGB local feedback buses such as the L-shaped structure shown at 435 in FIG. 3 allow for high-speed transmission from one CBB to a next within a same VGB, of result signals produced by each CBB.
The mid-scopic view of FIG. 3 additionally shows four interconnect channels surrounding VGB's ( 0 , 0 ) through ( 1 , 1 ). The top and bottom, horizontally extending, interconnect channels (HIC's) are respectively identified as 451 and 452 . The left and right, vertically extending, interconnect channels (VIC's) are respectively identified as 461 and 462 .
Two other interconnect channels that belong to other tiles are partially shown at 453 (HIC2) and 463 (VIC2) so as to better illuminate the contents of switch boxes area 465 . Switch boxes area 465 contains an assortment of 2xL switch boxes, 4x switch boxes and 8x switch boxes, which may be provided in accordance with FIG. 2 .
In addition, a memory-control multiplexer area 467 is provided along each HIC as shown for configurably coupling control signals from the horizontal bus (e.g., HIC 452 ) to special vertical interconnect channel (SVIC) 466 . The illustrated placement of multiplexer area 467 to the right of the switch boxes (SwBoxes) of VIC's 462 and 463 is just one possibility. Multiplexer area 467 may be alternatively placed between or to the left of the respective switch boxes of VIC's 462 and 463 .
In one embodiment (see FIG. 8 ), SVIC 466 has sixteen, special maximum length lines (16 SMaxL lines), thirty-two, special quad length lines (32 S4xL lines), and four special clock lines (SCLK 0 - 3 ). SVIC 466 carries and couples control signals to respective control input buses such as 471 , 481 of corresponding memory blocks such as 470 , 480 .
A memory-I/O multiplexer area 468 is further provided along each HIC for configurably coupling memory data signals from and to the horizontal bus (e.g., HIC 452 ) by way of data I/O buses such as 472 , 482 of corresponding memory blocks such as 470 , 480 . Again, the illustrated placement of multiplexer area 468 to the right of the switch boxes (SwBoxes) of VIC's 462 and 463 is just one possibility. Multiplexer area 468 may be alternatively placed between or to the left of the respective switch boxes of VIC's 462 and 463 .
Memory control multiplexer area 477 and memory I/O multiplexer area 478 are the counterparts for the upper HIC 451 of areas 467 and 468 of lower HIC 452 . Although not specifically shown, it is understood that the counterpart, left memory channel (LMC) is preferably arranged in mirror symmetry to the RMC 416 so as to border the left side of its corresponding matrix tile.
As seen broadly in FIG. 3, the group of four VGB's ( 0 , 0 ) through ( 1 , 1 ) are organized in mirror image relationship to one another relative to corresponding vertical and horizontal centerlines (not shown) of the group and even to some extent relative to diagonals (not shown) of the same group. Vertical and horizontal interconnect channels (VIC's and HIC's) do not cut through this mirror-wise opposed congregation of VGB's. As such, the VGB's may be wedged-together tightly.
Similarly, each pair of embedded memory blocks (e.g., 470 and 480 ), and their respective memory-control multiplexer areas ( 477 and 467 ), and their respective memory-I/O multiplexer areas ( 478 and 468 ) are organized in mirror image relationship to one another as shown. Horizontal interconnect channels (HIC's) do not cut through this mirror-wise opposed congregation of embedded memory constructs. As such, the respective embedded memory constructs of blocks MRx 0 (in an even row, 470 being an example) and MRx 1 (in an odd row, 480 being an example) may be wedged-together tightly. A compact layout may be thereby achieved.
With respect to mirror symmetry among variable grain blocks, VGB ( 0 , 1 ) may be generally formed by flipping a copy of VGB ( 0 , 0 ) horizontally. VGB ( 1 , 1 ) may be similarly formed by flipping a copy of VGB ( 0 , 1 ) vertically. VGB ( 1 , 0 ) may be formed by flipping a copy of VGB ( 1 ,