Match Document Document Title
US20150382480 THERMOCOMPRESSION BONDERS, METHODS OF OPERATING THERMOCOMPRESSION BONDERS, AND INTERCONNECT METHODS FOR FINE PITCH FLIP CHIP ASSEMBLY  
A thermocompression bonder is provided. The thermocompression bonder includes: a bond head including a heated bonding tool for bonding a semiconductor element to a substrate; and a flux...
US20150382479 PRE-APPLIED CONDUCTIVE ADHESIVE FOR EMI SHIELDING  
A method for providing EMI shielding to an electronic circuit board using an electrically-conductive thermoplastic sheet containing a pre-applied electrically-conductive adhesive composition is...
US20150382478 DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF DEVICE EMBEDDED SUBSTRATE  
A device embedded substrate includes an insulating layer including an insulating resin material, a device embedded in the insulating layer, a metal film coating at least one face of the device,...
US20150382477 BURNING METHOD  
There is provided a burning method of burning, on a base member, a precursor in which conductive particles are dispersed in a dispersion medium, and the burning method includes: a first...
US20150382476 TWO-STEP, DIRECT-WRITE LASER METALLIZATION  
A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern (42) is fixed in the matrix by directing an energy...
US20150382475 PREPARATION METHOD OF PATTERNED FILM, DISPLAY SUBSTRATE AND DISPLAY DEVICE  
Embodiments of the present invention provide a preparation method of a patterned film, a display substrate and a display device, avoiding falling off of a film layer occurring in the process of...
US20150382474 METHOD FOR FABRICATING FLEXIBLE ELECTRONIC DEVICE AND SUBSTRATE FOR FABRICATING THE SAME  
The present invention relates to the field of electronic device fabrication, provides a method for fabricating a flexible electronic device, and is intended to address the problems present in the...
US20150382473 PHOTOSENSITIVE DRY FILM AND PROCESS FOR PRODUCING PRINTED WIRING BOARD USING THE SAME  
Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The...
US20150382472 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF  
A printed circuit board includes a first substrate, two first circuits formed on a surface of the first substrate, and a thick copper circuit. The thickness of each first circuit is smaller than...
US20150382471 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening...
US20150382470 ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME  
An electronic circuit device which forms a parting line preventing the penetration of moisture into a connector and a manufacturing method thereof are provided. The electronic, circuit device (1)...
US20150382469 PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF  
A package apparatus comprises a first wiring layer, a first conductive pillar layer, a first molding compound layer, a second wiring layer, and a protection layer. The first wiring layer has a...
US20150382468 WIRING BOARD HAVING ELECTRICAL ISOLATOR AND MOISTURE INHIBITING CAP INCORPORATED THEREIN AND METHOD OF MAKING THE SAME  
A method of making a wiring board having an electrical isolator and metal posts incorporated in a resin core is characterized by the provision of moisture inhibiting caps covering interfaces...
US20150382467 PACKAGE STRUCTURE  
A package structure, including: a circuit board, including a first surface and a second surface opposite to the first surface, where the circuit board possesses multiple carrying units arranged in...
US20150382466 MOUNTING SYSTEM FOR OPTICS  
An optical system comprises a detector to determine one or more intensities of light impinging on one or more locations of the detector and an optical element to redirect light towards the...
US20150382465 SYSTEMS AND METHODS FOR IMPLEMENTING DISPLAY DRIVERS  
A device includes a first substrate formed of a first material and a plurality of electromechanical devices formed upon a surface of the first substrate. The device also includes an integrated...
US20150382464 MULTILAYER SUBSTRATE AND MANUFACTURING METHOD FOR THE MULTILAYER SUBSTRATE  
A multilayer substrate is manufactured by first manufacturing a first substrate by stacking and hot-pressing resin base materials of the first substrate and then adjacently stacking and...
US20150382463 PRINTED CIRCUIT BOARD, PACKAGE SUBSTRATE, AND METHOD OF FABRICATING THE SAME  
A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an...
US20150382462 COMPONENT CARRIER  
Component carrier for electrical/electronic components, for example for the combination with a lock housing or as a component of a lock housing of a motor vehicle door lock, comprising a carrier...
US20150382461 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME  
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface...
US20150382460 PRINTED CIRCUIT BOARD (PCB) WITH WRAPPED CONDUCTOR  
A printed circuit board (PCB) includes a wrapped conductor enabling transmission of a radio frequency (RF) signal, the wrapped conductor including a conductor core and a conductive wrap disposed...
US20150382459 Printed Circuit Board And Method For Fabricating The Same, And Apparatus For Fabricating Printed Circuit Borad  
The present disclosure provides a printed circuit board and a method for fabricating the same, and an apparatus for fabricating printed circuit board. The printed circuit board includes a...
US20150382458 PRINTED WIRING BOARD AND METHOD OF PRODUCING THE SAME  
The printed wiring board includes: an insulating board including a conductive metal layer formed on both surfaces of an insulating resin; and a conductor layer formed on both surfaces of the...
US20150382457 FLEXIBLE SUBSTRATE  
A flexible substrate includes unit wiring structures including first and second unit wiring structures that are mutually adjacent. Each of the unit wiring structures includes a central section and...
US20150382456 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF  
A printed circuit board including a metal conductor formed on a surface of an insulating base material and having a component mounting portion, and a solder resist covering a part of the metal...
US20150382455 A Security Module for Protecting Circuit Components from Unauthorized Access  
There is provided a security module for protecting circuit components from unauthorized access. The security module comprises a base printed circuit board, base PCB, for supporting circuit...
US20150382454 SPILLED ADHESIVE GUIDE STRUCTURE OF FLEXIBLE CIRCUIT BOARD  
Disclosed is a spilled adhesive guide structure of a flexible circuit board. At least one contact pad is formed in a conductive circuit trace arranged on a substrate of the flexible circuit board....
US20150382453 WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF  
A wired circuit board, including a metal supporting layer; an insulating layer formed on one side of the metal supporting layer in a thickness direction thereof; and a conductive layer having a...
US20150382452 ELECTROLESS SURFACE TREATMENT PLATED LAYERS OF PRINTED CIRCUIT BOARD AND METHOD FOR PREPARING THE SAME  
An electroless surface treatment plated layer of a printed circuit board, a method for preparing the same, and printed circuit board including the same. The electroless surface treatment plated...
US20150382451 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD  
A write wiring trace is formed over insulating layer. A coating layer, being directly in contact with at least a first portion of a surface of the write wiring trace, is formed over the insulating...
US20150382450 TRANSMISSION LINE STRUCTURE  
A transmission line structure emplaces at a substrate which includes a first layout layer, a first dielectric layer, a second dielectric layer, a second dielectric layer, and a grounding layer...
US20150382449 TECHNIQUES AND ARRANGEMENTS FOR MULTIPLE COMPONENT GROUNDING  
Techniques and arrangements for forming ground bonds between a plurality of components are provided. In one form, a grounding arrangement includes a first circuit board including a first ground...
US20150382448 THERMAL SOLUTIONS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN PORTABLE ELECTRONIC DEVICES  
A compact portable electronic device packaged into a System-in-Package assembly and thermal solutions for the device is disclosed. The compact portable electronic device can be assembled into a...
US20150382447 MODULE ASSEMBLY AND DISPLAY DEVICE  
A module assembly is provided. The module assembly includes a back bezel, a heating member, and a thermal expansion member. The heating member is fixed on a first surface of the back bezel. The...
US20150382446 FLEXIBLE DISPLAY DEVICE WITH REDUCED BEND STRESS WIRES AND MANUFACTURING METHOD FOR THE SAME  
There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an...
US20150382445 DOUBLE-SIDED FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING PLATING LAYER AND METHOD OF MANUFACTURING THE SAME  
Disclosed is a double-sided flexible printed circuit board, including a flexible substrate including at least one via hole and a via formed therein to connect circuit wirings respectively formed...
US20150382444 THERMALLY ENHANCED WIRING BOARD HAVING METAL SLUG AND MOISTURE INHIBITING CAP INCORPORATED THEREIN AND METHOD OF MAKING THE SAME  
A method of making a wiring board having a metal slug incorporated in a resin core is characterized by the provision of a moisture inhibiting cap covering interfaces between metal and plastic. In...
US20150382443 SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE  
A substrate for a semiconductor package and a method for manufacturing a semiconductor package are disclosed. The substrate comprises a surface, and package unit regions arranged on the surface in...
US20150382442 FREQUENCY TUNING FOR PULSED RADIO FREQUENCY PLASMA PROCESSING  
This disclosure describes systems, methods, and apparatus for pulsed RF power delivery to a plasma load for plasma processing of a substrate. In order to maximize power delivery, a calibration...
US20150382441 HIGH POWER DC NON TRANSFERRED STEAM PLASMA TORCH SYSTEM  
A high power DC steam plasma torch system (S) includes a steam plasma torch assembly (1) wherein superheated steam (46) is used as the main plasma forming gas, thereby resulting in a very reactive...
US20150382440 X-RAY RADIATION SOURCE  
In an X-ray radiation source, a counter wall made of alkali-containing glass, out of walls of a housing of an X-ray tube, is arranged opposite to a high-voltage region VH of a power supply unit...
US20150382439 RESISTIVE BYPASS FOR SERIES LIGHTING CIRCUIT  
A resistor bypass circuit for a series lighting circuit includes a plurality of serially connected light sources and a bypass resistor being connected in parallel with at least one of the...
US20150382438 CODED LIGHT DETECTOR  
A coded lighting system comprises a set of light sources and a remote control unit or an arrangement. The set of light sources emits coded light. In order to do so each light source is associated...
US20150382437 STATE CHANGE DEVICES FOR SWITCHED ELECTRICAL RECEPTACLES  
A state change device may be electrically connected to a switched receptacle, or to both the switched and unswitched receptacles, of an outlet. The state change device may generate a change of...
US20150382436 Light Switch Controlling Light Source Via Wireless Transmission  
This disclosure relates in general to a networked light switch. More specifically, the disclosure relates to a light switch that, in response to detecting a local input or motion, transmits a...
US20150382435 Remotely Programming a Photocontrol Device  
Disclosed are various methods for lighting control of a light fixture by a remote device. The remote device receives, via a wireless network interface, an identifier from a photocontrol device...
US20150382434 Techniques for Remote Communication with a Photocontrol Device  
Disclosed are various embodiments for remote lighting control by a processor of photocontrol device for a light fixture. The photocontrol receives, via a wireless network interface, a request to...
US20150382433 NETWORKED SYSTEM OF INTELLIGENT LIGHTING DEVICES WITH SHARING OF PROCESSING RESOURCES OF THE DEVICES WITH OTHER ENTITIES  
A system of network-connected lighting devices also offers a distributed processing function that utilizes processor and/or memory resources if/when available in some or all of the lighting...
US20150382432 Motion Detector System, Lighting System with Such System and Method for Detecting Moving Vehicles and/or Pedestrians  
The invention relates to a motion detector system (2), a lighting system (14) with such detector system and a method for detecting moving vehicles and/or pedestrians. The motion detector system...
US20150382431 Electrically Illuminated Flame Simulator  
An electrically powered flame simulator comprises at least two light sources, an integrated circuit electrically connected to the light sources for intermittently illuminating at least one of the...