Match Document Document Title
US20170354075 Hibiscus Plant Named 'DUP-CMIP'  
A new and distinct cultivar of hibiscus plant named ‘DUP-CMIP’, characterized by compact growth with internode distance reduced with respect to standard exotic varieties, glossy, dark green leaves...
US20170354074 Magnolia plant named 'Melissa Parris'  
A new and distinct Magnolia cultivar named ‘Melissa Parris’ is disclosed, characterized by having pleasantly scented pink flowers, a strong central leader, and large tardily deciduous foliage. The...
US20170354073 COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING SYSTEM  
In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components...
US20170354072 MODULE INSTALLATION ALIGNMENT DEVICE  
A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment...
US20170354071 ELECTRONIC COMPONENT SUPPLY APPARATUS, REEL APPARATUS, TAPE PROCESSING APPARATUS, AND METHOD FOR RESUPPLYING COMPONENT STORED TAPE  
An electronic component supply apparatus (1) includes a reel apparatus (2) and a tape processing apparatus (3). The reel apparatus (2) has a tape reel (8) with a component stored tape (100) wound...
US20170354070 COMPONENT MOUNTING SYSTEM  
A component mounting system includes a component mounter that mounts a component in a board, a tape feeder (component feeder) that is placed in the component mounter and supplies the component,...
US20170354069 ELECTRONIC COMPONENT SUPPLY SYSTEM  
Provided is an electronic component supply system determining the types of electronic components installed on component pallets at a time when the electronic components are installed on the...
US20170354068 COMPONENT PLACEMENT MACHINE AND COMPONENT PLACEMENT METHOD  
A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the board are measured by a plurality of...
US20170354067 POWER SYSTEM AND METHOD  
A power system (1), typically for use in a data centre, which eliminates use of a changeover device when switching between power sources. The power system (1) includes first and second rectifiers...
US20170354066 LIQUID IMMERSION COOLING APPARATUS, LIQUID IMMERSION COOLING SYSTEM, AND CONTROL METHOD OF LIQUID IMMERSION COOLING APPARATUS  
A liquid immersion cooling apparatus that cools an electronic device including a heat generating element, the apparatus includes a liquid immersion tank that accommodates a cooling liquid and the...
US20170354065 Facility Including Externally Disposed Data Center Air Handling Units  
Described herein is an integrated data center that provides for efficient cooling, as well as efficient wire routing.
US20170354064 MODULAR DATA CENTER FACILITY WITH COOLING MODULES  
A modular housing encloses a data center and a modular cooling system. The modular cooling system includes a modular cooling pallet on which cooling modules are installed. Each cooling module can...
US20170354063 Data Center Cooling System  
A data center cooling system configured to cool one or more components of a data center thereby enabling a data center to be maintained at a higher overall temperature while still providing...
US20170354062 HEAT PIPE ASSEMBLY AND HEAT PIPE STRUCTURE  
A heat pipe assembly adapted to an electronic device is provided. The heat pipe assembly includes at least one heat pipe, a bracket, and at least one fixing member. The heat pipe is disposed in a...
US20170354061 ELECTRONIC APPARATUS COOLING SYSTEM  
Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances...
US20170354060 APPARATUS FOR COOLING ELECTRONIC CIRCUITRY  
Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a...
US20170354059 SYSTEMS AND METHODS FOR COOLING A COMPARTMENTALIZED AND DUCTED ELECTRICAL ENCLOSURE  
In one embodiment, the system includes one or more electrical components associated with turbomachinery, and the one or more electrical components are disposed within two or more interior...
US20170354058 SERVER COOLING SYSTEM WITHOUT THE USE OF VAPOR COMPRESSION REFRIGERATION  
A system, method, and computer product for cooling a server center without the use of vapor compression refrigeration. An example embodiment involves using outdoor ambient air to cool first server...
US20170354057 Junction Box Thermal Management  
An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first...
US20170354056 POWER DISTRIBUTION UNIT WITH CORD STORAGE CARTRIDGE  
Systems, methods, and devices are provided in which cord storage cartridges are removably connected to a power distribution unit (PDU). The cord storage cartridge may include a cartridge housing...
US20170354055 Quick Release Device for a Slide Track  
A quick release device for a slide track includes a frame having an abutment section. A positioning seat is fixed to the frame and has a fixing section located adjacent to the abutment section and...
US20170354054 COMPONENT RACK FOR A DISPLAY  
A component rack for a display that includes: a frame, that includes: a base, a first wall, and a second wall arranged to form a U-shaped cavity; and a plurality of component modules located...
US20170354053 POWER DISTRIBUTION UNIT SYSTEM INCORPORATING SMART CABLES AND ADAPTERS  
A power distribution unit including a plurality of outlet cores arranged along an outlet panel of a housing and mounted to one or more circuit boards with an unobstructed space between adjacent...
US20170354052 Assembly for Attaching and Connecting a Computer Data Storage Device to an On-Board Computer and Associated Method for Use  
The present invention relates to an assembly (10) for attaching a data storage device (12) to an on-board computer including an encapsulation structure (17), and a receiving structure (18) for...
US20170354051 INTERLOCK BRACKET UNIT  
An example bracket unit to control installation of an electronic module is provided herein. The bracket unit includes a bracket body, a bracket plate, and a fastener. The bracket plate includes a...
US20170354050 MODULAR HOUSING APPARATUS  
Described herein are systems, modes, and methods for mounting one or more electronic housings to each other and to a rack mount system, a table mount system, or wall mount system. The mounting...
US20170354049 HERMETIC SEALING LID MEMBER, METHOD FOR MANUFACTURING HERMETIC SEALING LID MEMBER, AND ELECTRONIC COMPONENT HOUSING PACKAGE  
This hermetic sealing lid member (10) is made of a clad material (20) including a silver brazing layer (21) that contains Ag and Cu and a first Fe layer (22) bonded onto the silver brazing layer...
US20170354048 PLUGIN-POD FOR ELECTRONIC CONTROL UNIT  
A ruggedized engine control module (ECU) system includes a plugin-pod, a connector configured to connect the plugin-pod to a connector of an ECU, and signal processing circuitry. The ruggedized...
US20170354047 CONTROLLER  
A controller includes a control board, a transmitting board, a display board, and a USB board. A modular jack is arranged at a position on one surface of the transmitting board, the surface on...
US20170354046 HEAD-UP DISPLAY AND OPERATION OF OPENING COVER THEREOF  
A head-up display includes a transmission mechanism, a first cover, a second cover and a driver. The first cover is connected to the transmission mechanism and slidable with respect to the...
US20170354045 ELECTRONIC DEVICE HOUSING AND DISASSEMBLY FIXTURE THEREOF  
An electronic device housing is provided, which may include a front cover and a back cover. The front cover may include at least two flexible hooks and at least one fixation hook, and each...
US20170354044 METHOD FOR MANUFACTURING WIRING BOARD  
A method for manufacturing a wiring board includes preparing a core substrate having first and second surfaces, forming a first build-up structure including interlayer insulating layers and...
US20170354043 HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE  
A multi-layer printed circuit board (PCB) includes a laminate between a PCB heating core and a PCB signal core. The PCB heating core includes an electrically conductive resistive heating element...
US20170354042 Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Using Solder Transfer Sheet  
Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5,...
US20170354041 METHOD OF MANUFACTURING MOUNTING SUBSTRATE AND MOUNTING SUBSTRATE MANUFACTURING APPARATUS  
A method of manufacturing a mounting substrate includes a provisional pressing process, a driver pressing process, and a flexible printed circuit board pressing process. In the provisional...
US20170354040 PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATALYSTS  
Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating...
US20170354039 Encapsulated Circuit Module, And Production Method Therefor  
To reduce, when a single encapsulated circuit module has electronic components that are mutually influenced by their electromagnetic waves, the mutual influence. A encapsulated circuit module M...
US20170354038 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, PRINTED BOARD AND MANUFACTURING METHOD OF THE SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE  
A semiconductor integrated circuit device (101) includes a component built-in board (21) in which at least a first core layer (Co21) on which a first electronic component (C21) is mounted, a...
US20170354037 CIRCUIT ASSEMBLY AND METHOD FOR MANUFACTURING SAME  
Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to which terminals that are electrically...
US20170354036 Electronic Assembly and Method for the Production thereof  
The disclosure provides an electronic assembly that includes: a carrier element, a circuit carrier having a number of electronic components, a circuit board, which is electrically conductively...
US20170354035 FLEXIBLE PRINTED CIRCUIT BOARD  
There is provided a flexible printed circuit board. The flexible printed circuit board includes: a flexible insulation layer having a first surface and a second surface; a first land which is...
US20170354034 PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME  
A printed wiring board according to an aspect of the present invention includes an insulating resin, a plated copper formed on a front surface side of the insulating resin, and a plated copper...
US20170354033 RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD  
A resin composition contains a component (A) being a polyphenylene ether in which the hydroxy group at an end of the main chain thereof has been modified with an ethylenically unsaturated...
US20170354032 HALOGEN-FREE AND PHOSPHORUS-FREE SILICONE RESIN COMPOSITION, PREPREG, LAMINATE BOARD, COPPER-CLAD PLATE USING THE SAME, AND PRINTED CIRCUIT BOARD  
Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the...
US20170354031 TOP-SIDE CONNECTOR INTERFACE FOR PROCESSOR PACKAGING  
An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor...
US20170354030 HIGH FREQUENCY SIGNAL TRANSMISSION STRUCTURE AND METHOD FOR SAME  
A high frequency signal transmission structure includes an insulating sheet and a conductive wiring layer forming on the insulating sheet. The conductive wiring layer includes a silver conductive...
US20170354029 METHOD FOR MAKING AN INTERACTIVE INFORMATION DEVICE AND PRODUCT PRODUCED THEREBY  
A method and product produced by the method for forming an interactive information device with a conductively coated panel includes forming a reduced contrast increased light transmitting,...
US20170354028 BAND PASS FILTER-BASED GALVANIC ISOLATOR  
A galvanic isolator includes a multi-layer printed circuit board (PCB) including a dielectric material having a top side and a bottom side. An RF transmission line is embedded within the PCB...
US20170354027 INFORMATION PROCESSING APPARATUS  
Provided is an information processing apparatus that enables acquisition, manipulation and the like of information through unauthorized access to be prevented with a simple structure, without...
US20170354026 FLEX-LESS MULTILAYER CERAMIC SUBSTRATE  
In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through at least one of the ceramic layers....