Match Document Document Title
US20150351256 ASSEMBLY OF PRINTED CIRCUIT BOARDS  
A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a...
US20150351255 MANUFACTURING JIG AND MANUFACTURING APPARATUS FOR TEMPERATURE MEASURING SAMPLE  
Embodiments of the present invention provide a manufacturing jig and a manufacturing apparatus for a temperature measuring sample. The manufacturing jig for a temperature measuring sample includes...
US20150351254 METASTABLE GAS HEATING  
A heating apparatus includes a gas supply for providing a base gas, a generator configured to excite the base gas to produce a metastable gas mixture that includes a metastable gas, and a housing....
US20150351253 METHOD AND APPARATUS FOR FLUID GUIDED SELF-ASSEMBLY OF MICROCOMPONENTS  
A method and apparatus is provided for self-assembly of micro-components such as microchips onto a carrier substrate, provided with assembly locations for said components. The components are...
US20150351252 METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY  
A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: -arranging the...
US20150351251 DESMEARING METHOD AND DESMEARING DEVICE  
Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to...
US20150351250 METHOD AND APPARATUS FOR FORMING ON A SUBSTRATE A PATTERN OF A MATERIAL  
A method for forming on a substrate (108; 214) a pattern of a material, the method comprising: providing (S100) a material layer (104); providing (S104, S106) an adhesive layer (106), wherein at...
US20150351249 IMAGING ON SUBSTRATES WITH AQUEOUS ALKALINE SOLUBLE UV BLOCKING COMPOSITIONS AND AQUEOUS SOLUBLE UV TRANSPARENT FILMS  
Substrates, such as printed circuit boards, are coated with an aqueous alkaline developable UV photosensitive material followed by applying an aqueous soluble UV transparent film to coat the UV...
US20150351248 METHOD FOR MANUFACTURING SUBSTRATE GAP SUPPORTER  
Disclosed is a method for manufacturing a substrate gap supporter. The method includes: a first step of forming metal foils on both sides of an insulating plate; a second step of etching the metal...
US20150351247 PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME  
There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, the package board includes: a first insulating layer...
US20150351246 STRUCTURE WITH SEVERAL CAVITIES PROVIDED WITH ACCESS CHANNELS OF DIFFERENT HEIGHTS  
A packaging structure including: a cover secured to a first substrate and forming first and second distinct cavities between the cover and the first substrate,first and second channels formed in...
US20150351245 SEMICONDUCTOR PACKAGE  
A semiconductor package includes a substrate, a first conductive layer, a second conductive layer, a first surface mount device, a second surface mount device and a connection element. The first...
US20150351244 PRINTED BOARD UNIT, PRINTED BOARD, AND INFORMATION PROCESSING APPARATUS  
A printed board unit includes: a base material; an electrode formed on the base material; a resist film formed on the base material, the resist film has an opening to expose the electrode; a...
US20150351243 LC COMPOSITE COMPONENT  
An LC composite component includes one or more inductors, one or more capacitors, a magnetic layer, and a substrate. The substrate has a first surface, and a second surface opposite to the first...
US20150351242 ASSEMBLY OF PRINTED CIRCUIT BOARDS  
A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a...
US20150351241 Ceramic Wiring Substrate, Semiconductor Device, And Method For Manufacturing Ceramic Wiring Substrate  
A ceramic wiring substrate and method for manufacturing the same, the substrate having an up-and-down conduction body which is made by forming a porous structure body from a high melting point...
US20150351240 PRINT SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING PRINT SUBSTRATE  
A print substrate includes: a base; a tapered shape hole that is formed in the base, and is configured to have a diameter which continuously changes along a thickness direction of the base; a...
US20150351239 SUBSTRATE AND METAL LAYER MANUFACTURING METHOD  
This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through...
US20150351238 DEVICE AND DEVICE PACKAGE  
There are provided a device and a device package including a terminal electrically connected to a board and including one or more protrusion parts disposed on amounting surface on which the...
US20150351237 CIRCUIT MATERIALS WITH IMPROVED FIRE RETARDANT SYSTEM AND ARTICLES FORMED THEREFROM  
A circuit subassembly, comprising a conductive layer, a dielectric layer is formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of...
US20150351236 METHOD FOR MANUFACTURING METAL FOIL-CLAD LAMINATE  
A method for manufacturing a metal foil-clad laminate in which the occurrence of voids and unevenness is suppressed compared with conventional ones even when a prepreg obtained from a curable...
US20150351235 MULTILAYER WIRING BOARD AND MANUFACTURING METHOD FOR THE MULTILAYER WIRING BOARD  
A manufacturing method for a multilayer wiring board includes: forming a groove on a surface of a first thermoplastic resin board; forming a modified layer made of resin having a melting point...
US20150351234 SUPPORT STRUCTURE FOR STACKED INTEGRATED CIRCUIT DIES  
Delamination of stacked integrated circuit die configurations on printed circuit boards is avoided by providing a metal trace support structure underneath the die stack. The metal trace support...
US20150351233 Flexible Midplane And Architecture For A Multi-Processor Computer System  
A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the middle section and each side section;...
US20150351232 MAKING Z-FOLD MULTI-ELEMENT SUBSTRATE STRUCTURE  
A method of making a folded micro-wire substrate structure includes providing a transparent flexible substrate having a first side and a second side opposed to the first side. The flexible...
US20150351231 CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD  
Disclosed herein is a circuit board in which a metal plate is provided on a surface coupled to a device, and a connection pad is exposed through an opening part of the metal plate to be...
US20150351230 COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND MOUNTING BODY  
A component built-in board comprises a multi-layer structure comprising a plurality of unit boards stacked therein a plurality of electronic components built in thereto in a stacking direction....
US20150351229 PRINTED CIRCUIT BOARD COMPRISING CO-PLANAR SURFACE PADS AND INSULATING DIELECTRIC  
A printed circuit board (PCB) comprises a non-conductive base layer, a conductive interconnect disposed on the non-conductive base layer and comprising at least two surface pads separated by a...
US20150351228 PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME  
There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, a package board includes: a first insulating layer; a...
US20150351227 WIRING BOARD  
A wiring board in the present invention includes an insulating layer, a via-hole penetrating from an upper surface to a lower surface of the insulating layer, a wiring formation layer, and a...
US20150351226 PROCEDURE FOR THE MANUFACTURE AND ASSEMBLY OF ELECTRONIC BOARDS AND ELECTRONIC DEVICE THUS OBTAINABLE  
The procedure for the manufacture and assembly of electronic boards includes the steps of: arranging a first electronic board (2) having a first power connector (7) of substantially elongated...
US20150351225 METAL-BASED MOUNTING BOARD AND METHOD OF MANUFACTURING METAL-BASED MOUNTING BOARD  
A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate through which a through-hole is provided along a thickness...
US20150351224 METAL-BASED MOUNTING BOARD AND MEMBER PROVIDED WITH METAL-BASED MOUNTING BOARD  
A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first...
US20150351223 METAL-BASED MOUNTING BOARD AND MEMBER PROVIDED WITH METAL-BASED MOUNTING BOARD  
The metal-based mounting board includes: a metal-based circuit board including a metal substrate having a first surface and a second surface, an insulating film provided on the first surface and a...
US20150351222 RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS  
A flat cable includes a plurality of resin layers that are flexible and stacked together, a line conductor, and grounding conductors. The flat cable includes a triplate line in which both surfaces...
US20150351221 ELECTRODE ARRANGEMENT WITH 3D STRUCTURE AND FABRICATION METHOD THEREOF  
An electrode arrangement which is based on elastomer and has elasticity and flexibility may include: an elastomer substrate; first and second pads arranged over the substrate; and a conductive...
US20150351220 MAKING Z-FOLD MICRO-WIRE SUBSTRATE STRUCTURE  
A method of making a folded micro-wire substrate structure includes providing a flexible substrate and first, second, and third portions. One or more electrical conductors are formed on or in the...
US20150351219 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate having a via hole for signal transfer and a via hole for...
US20150351218 COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND MOUNTING BODY  
A component built-in board comprises a multi-layer structure comprising a plurality of unit boards stacked therein a plurality of electronic components built in thereto in a stacking direction,...
US20150351217 HEAT DISSIPATION STRUCTURE  
A heat dissipation structure including: (A) a printed circuit board; (B) a heat-generating element; (C) an electromagnetic shielding case; (D) a rubbery, thermally conductive resin layer with a...
US20150351216 PASSIVE SYSTEM OF POWERING AND COOLING WITH LIQUID METAL AND METHOD THEREOF  
Example embodiments disclose a passive system of power and cooling with a liquid metal for a digital system. The passive system may include a digital device operatively coupled to a printed...
US20150351215 TRANSVERSELY ACTUATED PIEZOELECTRIC BELLOWS HEATSINK  
A transversely actuated piezoelectric bellows heatsink (TAPBH) has a linkage that includes multiple rigid sections coupled by flexible joints. A first fixed support is affixed to a first end of...
US20150351214 Cooling Plasma Cutting System Consumables and Related Systems and Methods  
In some aspects, electrodes can include a front portion shaped to matingly engage a nozzle of the plasma cutting system, the front portion having a first end comprising a plasma arc emitter...
US20150351213 Power Transfer Assembly for Contact-Start Plasma Arc Torch  
A power transfer assembly for a contact-start plasma arc torch conducts electrical current to an electrode through mating structures provided on two conductive elements. The mating structures are...
US20150351212 Coil Assembly for Plasma Generation  
A coil assembly for generating plasma, is disclosed. The coil assembly includes a cylindrical coil having a cylindrical inner mesh, a cylindrical outer mesh and a cylindrical dielectric separating...
US20150351211 EXTREME ULTRAVIOLET LIGHT GENERATING APPARATUS, METHOD OF GENERATING EXTREME ULTRAVIOLET LIGHT, CONCENTRATED PULSED LASER LIGHT BEAM MEASURING APPARATUS, AND METHOD OF MEASURING CONCENTRATED PULSED LASER LIGHT BEAM  
Provided is an extreme ultraviolet light generating apparatus that may include: a chamber containing one or more kinds of gases; a light concentration optical system provided in an optical path of...
US20150351210 SYSTEM AND METHOD FOR GENERATING EXTREME ULTRAVIOLET LIGHT, AND LASER APPARATUS  
An extreme ultraviolet light generation system used with a laser apparatus may be provided, and the extreme ultraviolet light generation system may include: a chamber including at least one window...
US20150351209 SYSTEM AND METHOD FOR GENERATING EXTREME ULTRAVIOLET LIGHT  
A system includes a chamber, a laser beam apparatus configured to generate a laser beam to be introduced into the chamber, a laser controller for the laser beam apparatus to control at least a...
US20150351208 LASER APPARATUS AND EXTREME ULTRAVIOLET LIGHT GENERATION SYSTEM  
There may be included: a master oscillator configured to output pulsed laser light; a power amplifier disposed in an optical path of the pulsed laser light to amplify the pulsed laser light; and a...
US20150351207 ELECTROSTATIC DISCHARGE MITGATION IN DISPLAY DEVICES  
This disclosure provides apparatus and methods for mitigating electrostatic discharge (ESD) in display devices. In one aspect, a display device includes an encapsulation substrates having an...