Match Document Document Title
US20150334859 MOBILE TERMINAL  
The present disclosure relates to a mobile terminal, and there is provided a mobile terminal including a terminal body having a front surface and a rear surface, a rear input unit comprising a...
US20150334858 BRACKET APPARATUS APPLICABLE TO KEYBOARD AND KEYBOARD COMPRISING THE BRACKET APPARATUS  
Disclosed are a bracket apparatus applicable to a keyboard, and a keyboard comprising the bracket apparatus. The bracket apparatus comprises a shell, wherein: a support plate is hinged to the...
US20150334857 MOTOR DRIVE UNIT PROVIDED WITH HOUSING FORMED WITH OPENING  
A motor drive unit which improves the cooling ability. The motor drive unit comprises electronic components and a housing which surrounds the electronic components. The housing has a back plate to...
US20150334856 TEAR-AWAY ARC FAULT RELIEF PANEL FOR ELECTRICAL CABINET  
In one aspect, an arc fault relief panel is provided for mounting to a cabinet for enclosing medium- or high-voltage electrical equipment. The panel includes bend relief cuts or slots to allow the...
US20150334855 PROTECTIVE CASE FOR ELECTRONIC DEVICE AND METHOD FOR ACOUSTIC TRANSMISSION IN AIRTIGHT ENVIRONMENT  
A protective case for an electronic device and a method for acoustic transmission in airtight environment are disclosed. The protective case includes a case body defining a sealed accommodating...
US20150334854 VEHICLE-MOUNTED ELECTRONIC CONTROL DEVICE  
Provided is a vehicle-mounted electronic control device including a control unit reduced in size, weight, and costs with improved contact reliability between electric components included in the...
US20150334853 ELECTRONIC MODULE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE  
The Electronic Module includes body case 2 that comprises a plurality of case members 3, 4 by abutting each other and that has an internal space (S) where the first opening P1 is formed on one...
US20150334852 Packaging Box for an Electronic Device  
The invention discloses a packaging box for an electronic device, wherein an opening is formed in one surface of a box body of the packaging box, and a detachable cover plate is mounted on the...
US20150334851 THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD INCLUDING MEMBRANE SWITCH AND RELATED METHODS  
An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least...
US20150334850 METHOD OF MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE  
A method of manufacturing a wiring substrate according to the present invention includes a step of forming a wiring layer including connection terminals on a first insulating layer; a step of...
US20150334849 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM  
Manufacturing quality of a semiconductor device can be improved, and manufacturing throughput can be improved. A method of manufacturing a semiconductor device includes (a) placing a substrate on...
US20150334848 ENCLOSURE FOR A MULTI-CHANNEL MODULATOR DRIVER  
Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an...
US20150334847 TWO-STAGE POWER DELIVERY ARCHITECTURE  
A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set...
US20150334846 ELECTRONIC COMPONENT MODULE  
An electronic component module includes a substrate, an electronic component mounted on the substrate, and a resin sealing portion that seals the electronic component and covers a principal...
US20150334845 PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE  
PROBLEM To provide: a package for housing an electronic component, wherein a metal portion formed of a getter metal material exhibits high bonding strength to an insulating substrate; and an...
US20150334844 PRINTED WIRING BOARD  
A printed wiring board includes a substrate having first and second cavities, first electronic components accommodated in the first cavity, second electronic components accommodated in the second...
US20150334843 PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SAME  
Provided are a printed circuit board and a method of manufacturing the printed circuit board, the printed circuit board including: a first element and a second element a first base substrate...
US20150334842 PRINTED WIRING BOARD  
A printed wiring board includes a core substrate having a cavity, multiple electronic components accommodated in the cavity, and a build-up layer formed on the substrate and including an...
US20150334841 Printed Circuit Board  
A multilayer printed circuit board comprising conductive layers separated by dielectric insulation layers, at least one conductive layer being patterned and parts of conducting layers being...
US20150334840 RESISTANCE ASSEMBLY FOR MOBILE DEVICE AND MANUFACTURING METHOD THEREOF  
A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an aspect of the present invention...
US20150334839 COMPONENT-FIXING METHOD, CIRCUIT SUBSTRATE, AND DISPLAY PANEL  
The present invention involves forming wiring sections on a substrate capable of UV-ray transmission, and fixing a component to be electrically connected to the wiring sections onto the substrate...
US20150334838 PACKAGE FOR OPTICAL MODULE  
A package for optical module includes a flat-plate-shaped metal base, and a ceramic circuit board in which a plurality of terminals are arranged in a longitudinal direction, and which is joined to...
US20150334837 WIRING BOARD  
To provide a wiring board ensuring adhesion strength of a connecting terminal to reduce the connecting terminal from being fallen over or peeled off under fabrication process. The wiring board...
US20150334836 VIA IN A PRINTED CIRCUIT BOARD  
A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both...
US20150334835 PRINTED CIRCUIT BOARD OF PROBE CARD  
The present invention relates to a printed circuit board of a probe card. The printed circuit board comprises a first side, a second side, a plurality of plated through holes and at least one...
US20150334834 WIRING BOARD, WIRING BOARD WITH LEAD, AND ELECTRONIC DEVICE  
A wiring board includes an insulating substrate composed of a ceramic sintered compact; and a connection pad disposed on a surface part of the insulating substrate. The connection pad includes a...
US20150334833 Semi-Finished Product for the Production of a Printed Circuit Board and Method for Producing the Same  
In a semi-finished product for the production of a printed circuit board with at least one recessed electronic component having at least one conductive layer structured to provide a connector pad...
US20150334832 ELECTRODE STRUCTURE  
The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on...
US20150334831 STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAPSULATION SURFACE  
A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation...
US20150334830 AXIOCENTRIC SCRUBBING LAND GRID ARRAY CONTACTS AND METHODS FOR FABRICATION  
A contact structure and assembly for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned...
US20150334829 ELECTRICAL BARRIER LAYERS  
A barrier layer includes a variable-composition nickel alloy layer with a minor constituent of boron, carbon, phosphorus, and tungsten varying throughout the nickel alloy layer in a direction from...
US20150334828 WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME  
There is provided a wiring substrate including an electrode including Cu or a Cu alloy, a plating film having a film including at least Pd, formed on the electrode, and a solder which is bonded...
US20150334827 EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD USING SAME  
The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains...
US20150334826 EMBEDDED TRACES  
A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated....
US20150334825 EMBEDDED TRACES  
A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic core material that resists metal plating except where a surface of the catalytic material is...
US20150334824 Multilayer Body Having Electrically Conductive Elements and Method for Producing Same  
The invention provides a large number of possibilities for how, in the case of a multi-layer body with electrically conductive elements which are not visible to the naked eye, the electrically...
US20150334823 SUBSTRATE COMPONENTS FOR PACKAGING IC CHIPS AND ELECTRONIC DEVICE PACKAGES OF THE SAME  
Substrate components for packaging IC chips and electronic device packages are disclosed. A substrate component for packaging IC chips comprises: a glass core base with at least one conductive...
US20150334822 Controlling Apparatus for Electric Power Steering Apparatus  
There is provided a printed circuit substrate and a noise suppression structure capable of minimizing constraint on a component layout on a substrate and suppressing noise. The printed circuit...
US20150334821 VIA STRUCTURE  
A via structure includes a ground conductor, a floated conductor and a signal conductor. The ground conductor is electrically coupled to a reference potential. The floated conductor is...
US20150334820 Heatsink-Less Electronic Unit  
A heatsink-less electronic unit includes a metal coreless electronic substrate, a heatsink-less microcomputer and various semiconductor relays. The heatsink-less microcomputer and the various...
US20150334819 TRANSMISSION DEVICE  
Transmission device including at least one electric conductor for the transmission of an AC signal and a dielectric material at least partly surrounding the at least one conductor. The dielectric...
US20150334818 AIR COOLED PLASMA TORCH AND COMPONENTS THEREOF  
Embodiments of the present invention are directed to an air cooled, retract-start plasma cutting torch having improved performance. The torch comprises any one, or a combination of an improved...
US20150334817 IMPROVED AIR COOLED PLASMA TORCH AND COMPONENTS THEREOF  
Embodiments of the present invention are directed to an air cooled, retract-start plasma cutting torch having improved performance. The torch comprises any one, or a combination of an improved...
US20150334816 AIR COOLED PLASMA TORCH AND COMPONENTS THEREOF  
Embodiments of the present invention are directed to an air cooled, retract-start plasma cutting torch having improved performance. The torch comprises any one, or a combination of an improved...
US20150334815 ELECTROMAGNETIC WAVE HIGH FREQUENCY HYBRID PLASMA TORCH  
The purpose of the present invention is to solve the problems of conventional high frequency plasma torches and develop a plasma torch which enables quick quenching of high frequency plasma and...
US20150334814 DEVICE FOR CONTROLLING LASER BEAM AND APPARATUS FOR GENERATING EXTREME ULTRAVIOLET LIGHT  
A device is provided for controlling a laser beam. The device may include a first wavefront adjuster provided in a beam path of a laser beam outputted from a laser apparatus, a beam delivery unit...
US20150334813 Beam Delivery for EUV Lithography  
A beam delivery apparatus is used with a laser produced plasma source. The beam delivery apparatus comprises variable zoom optics (550) operable to condition a beam of radiation so as to output a...
US20150334812 DESIGN TO MANAGE CHARGE AND DISCHARGE OF WAFERS AND WAFER CARRIER RINGS  
Embodiments of the invention include methods and apparatuses for removing charge from a carrier ring assembly. Embodiments include picking up a carrier ring assembly from a first location with an...
US20150334811 Illumination Regulating System in Synchronization with AC Power Frequency and Method Using the Same  
An illumination regulating system in synchronization with an AC power frequency comprises: an illumination regulating device and a regulated device, wherein the illumination regulating device and...
US20150334810 Multi-Function Controllable Luminous Decoration  
A multi-function controllable luminous decoration includes a casing and an inductive light-emitting device disposed in the casing. The inductive light-emitting device includes a detection switch,...