Match Document Document Title
US20160192520 MODULAR ELEMENTS EMPLOYING LATCHES WITH FLEXURE BEARINGS  
Modular elements employing latches with flexure bearings are disclosed. A modular element may include a chassis body supporting electronic components. The body is in communication with a latch and...
US20160192519 DISPLAY APPARATUS  
Provided is a display apparatus. The display apparatus includes a display panel for displaying an image, a back cover mounted on a rear surface of the display panel, and a curvature adjustment...
US20160192518 OBJECT DETECTION DEVICE  
An object detection device includes: an object detection portion which detects an object around a vehicle; a support member by which the object detection portion is attached to the vehicle; and a...
US20160192517 CASING, ELECTRONIC DEVICE EMPLOYING SAME AND MANUFACTURING METHOD  
A casing includes a cover and a frame coupled to the cover. The frame includes a base body and a plurality of non-conductive portions. The base body defines a plurality of gaps spaced from each...
US20160192516 Mobile Electronic Device Armband Carrier  
An Armband composed of a stretchable compression, see-through material fabrication incorporates a pocket for receiving a mobile electronic device in an arrangement where the device's display...
US20160192515 CIRCUIT BOARD ASSEMBLY AND ASSEMBLING METHOD THEREOF  
A circuit board assembly includes a casing, a first circuit board, a second circuit board, plural connectors and at least one fastening element. The casing includes plural openings and at least...
US20160192514 ELECTRONIC APPARATUS HAVING A MOLDED RESIN HOUSING  
An electronic apparatus includes a substrate having an edge including a non-flat portion, a plurality of electronic units disposed on a surface of the substrate, and a molded resin member covering...
US20160192513 Suspended Segmented Display Array  
A suspended segmented display array in one embodiment includes multiple cables offset from a wall via standoff members. Adjacent display panels attach to cables via finger releasable clamps and...
US20160192512 DISPLAY  
A display which thickness is allowed to be reduced is provided. A display includes: a display panel; and a back-face member having rigidity and provided on a back face of the display panel, the...
US20160192511 IMAGE DISPLAY APPARATUS  
Provided is an image display apparatus. The image display apparatus includes a display panel displaying an image through a display area, a plurality of acoustic devices disposed on a non-display...
US20160192510 INJECTION-MOLDED CASE FOR ELECTRONIC COMMUNICATION PRODUCTS  
The present utility model provides a twice injection-molded frame structure for electronic communication products, which comprises a metal housing connected by injection-molding and an inner frame...
US20160192509 Modular Casings  
A modular casing for electronic equipment comprises edge portions and corner portions. Each corner portion is interlocked with adjacent edge portions to form a framework. The casing also includes...
US20160192508 FORMATION OF DIELECTRIC WITH SMOOTH SURFACE  
Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a...
US20160192507 ELECTRODEPOSITED CONTACT TERMINAL FOR USE AS AN ELECTRICAL CONNECTOR OR SEMICONDUCTOR PACKAGING SUBSTRATE  
An electrical connectors with electrodeposited terminals that are grown in place by electroplating cavities formed in a series of resist layers. The resist layers are subsequently stripped away....
US20160192506 BACK-DRILLING METHOD FOR A PIN-IN-HOLE PCB COMPONENT PROCESS, AND A PCB ASSEMBLY PRODUCED THEREBY  
An approach for through-hole component soldering for a PCB, and a resulting PCB assembly, that eliminates protruding solder joints, is provided. The approach comprises back-drilling, from a bottom...
US20160192505 THIN FAN, ELECTRONIC SYSTEM AND MANUFACTURING METHOD OF THIN FAN  
A manufacturing method of the thin fan includes the steps of: providing a plastic material containing a plurality of metal particles; processing the plastic material to form a housing; removing a...
US20160192504 SINGLE MOLECULE DETECTION  
Disclosed herein is a method comprising patterning a second electrode of each of a plurality of electrode pairs onto a substrate; patterning a strip of a sacrificial layer directly across the...
US20160192503 METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD  
A method for producing a ceramic circuit board comprising the steps of bonding a metal sheet to a ceramic substrate via a brazing material containing Ag to form a bonded body; etching the bonded...
US20160192502 GERMANIUM OXIDE PRE-CLEAN MODULE AND PROCESS  
In some embodiments, a method for integrated circuit fabrication includes removing oxide material from a surface of a substrate, where the surface includes silicon and germanium. Removing the...
US20160192501 METHOD OF MANUFACTURING A FLEXIBLE AND/OR STRETCHABLE ELECTRONIC DEVICE  
A method of manufacturing a flexible electronic device is provided. The method includes a) filtering a mixture including an electrically conducting nanostructured material through a membrane such...
US20160192500 Electronic Devices and Methods of Manufacturing Electronic Devices  
Disclosed are a foldable and spreadable electronic device and a method of manufacturing the electronic device. The electronic device may include a flexible chip, a protection film and a flexible...
US20160192499 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF  
A manufacturing method of an electronic device includes the following steps. A circuit board and at least one electronic component are provided, wherein the electronic component is installed on...
US20160192498 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT  
A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection...
US20160192497 ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF  
An electronic component module including a first board; a plurality of first electronic components disposed on a first surface of the first board; a second board disposed on a second surface of...
US20160192496 CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND METHODS OF FABRICATING SAME  
A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between...
US20160192495 SEMICONDUCTOR DEVICE  
A semiconductor device including: a plurality of semiconductor units each constituting a three-level inverter circuit; and a connection unit electrically connecting the plurality of semiconductor...
US20160192494 Electrical contact arrangement for an electric motor and method for producing the same  
Electrical contact arrangement for an electric motor and method for producing same. The present invention relates to an electrical contact arrangement for an electric motor, in particular for an...
US20160192493 Circuit board assembly, control device for a cooler fan module and method  
The present invention relates to a circuit board assembly, comprising a circuit board which has a first and a second solder region, which is galvanically separated from the first, and which...
US20160192492 CIRCUIT MODULE SYSTEM  
A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing, the first connecting housing includes...
US20160192491 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating...
US20160192490 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit...
US20160192489 POWER SUPPLY BOARD  
A power supply board includes: a first board including a top surface on which a processor is capable of being mounted, a bottom surface located on an opposite side of the top surface, and a...
US20160192488 CIRCUIT BOARD, MULTILAYERED SUBSTRATE HAVING THE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD  
Disclosed is a circuit board that includes a core portion having a first via disposed therein in the general shape of an hourglass. The circuit board implements a finer via that penetrates a core...
US20160192487 Via Transition and Method of Fabricating the Same  
The present disclosure provides a via transition, comprising: two end segments; high-impedance segments and low-impedance segments. The high-impedance segments and the low-impedance segments are...
US20160192486 CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
A circuit board disclosed herein includes: two substrates opposed to each other, where a dielectric being interposed between the two substrates; a through hole formed in each of the two substrates...
US20160192485 ELECTRONIC ENTITY WITH COUPLING INTEGRATED BETWEEN A MICROCIRCUIT AND AN ANTENNA AND METHOD OF FABRICATION  
An electronic entity includes a module formed of a support film carrying, on an internal face, a microcircuit and a first coupling coil, and a body including a cavity in which this module is...
US20160192484 NANOTUBE DISPERSANTS AND DISPERSANT FREE NANOTUBE FILMS THEREFROM  
A degradable polymeric nanotube (NT) dispersant comprises a multiplicity of NT associative groups that are connected to a polymer backbone by a linking group where there are cleavable groups...
US20160192483 TRANSPARENT ELECTRODES AND ELECTRONIC DEVICES INCLUDING THE SAME  
A transparent electrode includes: a substrate; an electrically conductive layer disposed on the substrate and including a plurality of nano-sized conductors; and an organic/inorganic composite...
US20160192482 PATTERNED CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME  
A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a...
US20160192481 IMPLEMENTING CONFORMAL COATING COMPOSITION FOR HIGH CURRENT CIRCUIT APPLICATIONS  
A method and structure are provided for implementing a conformal coating composition for high current applications. A copper particulate filler material layer is added over a standard conformal...
US20160192480 ELECTRONIC DEVICE INCLUDING TRANSPARENT AND FLEXIBLE MICA SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME  
An electronic device including a transparent and flexible mica substrate and a method of manufacturing the electronic device are provided, in which the method includes forming an organic or...
US20160192479 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT  
A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection...
US20160192478 FLEXIBLE ELECTRONIC DEVICE  
According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least one component and at least one stress...
US20160192477 Conductive Transparent Substrate Manufacturing Method, and Conductive Transparent Substrate  
Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are...
US20160192476 WARPAGE-PREVENTING STRUCTURE OF SUBSTRATE  
The present invention relates to a warpage-preventing structure for reducing the warpage of the substrate itself, the warpage which results from the difference of the metal patterns of top and...
US20160192475 WIRING BOARD  
The wiring board in the present invention includes: an insulating board; external connection pads for a differential signal and external connection pads for grounding or a power supply formed on a...
US20160192474 MULTILAYER STRUCTURE FOR ACCOMMODATING ELECTRONICS AND RELATED METHOD OF MANUFACTURE  
Multilayer structure (200) for electronic devices, including a flexible substrate film (102) for accommodating electronics, a number of electrical elements (204, 206) provided to the flexible...
US20160192473 CIRCUIT BOARD  
A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower...
US20160192472 DEVICE AND METHOD FOR DETERMINING THE TEMPERATURE OF A HEAT SINK  
A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat...
US20160192471 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF  
A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second...