Match Document Document Title
US20170094837 TWO-PHASE JET IMPINGEMENT COOLING DEVICES AND ELECTRONIC DEVICE ASSEMBLIES INCORPORATING THE SAME  
Two-phase jet impingement cooling devices and electronic device assemblies are disclosed. In one embodiment, a cooling device includes a manifold having a fluid inlet surface, a fluid outlet...
US20170094836 DOUBLE-SIDED HEAT EXCHANGER FOR FLUID-COOLED ELECTRONICS WITH A FLAT COPLANAR SERIES-WISE COOLANT FLOW PATH  
A fluid-cooled electronics assembly for high-power electronics includes an arrangement of electronic components that defines an upper-side of the arrangement and a lower-side of the arrangement...
US20170094835 THERMAL FLOW ASSEMBLY INCLUDING INTEGRATED FAN  
An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate...
US20170094834 THERMAL MANAGEMENT VIA ACTIVE SURFACES  
A system for thermal management of a heat sink via active surfaces. The heat sink includes a cavity within the heat sink, and a nozzle. The nozzle provides a pathway from the cavity to a surface...
US20170094833 COMPUTING SYSTEM ENCLOSURE AIRFLOW MANAGEMENT  
The disclosed technology provides systems and methods for an enclosure system with optimized internal dynamically controllable airflow distribution. The systems include a computing system...
US20170094832 COMPUTING SYSTEM ENCLOSURE AIRFLOW DISTRIBUTION MANAGEMENT  
The disclosed technology provides systems and methods for an enclosure system with optimized internal dynamically controllable airflow distribution. The systems include a computing system...
US20170094831 THERMAL INTERFACE MATERIALS INCLUDING ELECTRICALLY-CODUCTIVE MATERIAL  
According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and...
US20170094830 CONFORMABLE THERMAL BRIDGE  
A thermal bridge includes a frame and an array of multiple plates. The frame defines a bridge opening, and the array of plates is held in the bridge opening. The plates are stacked side-by-side...
US20170094829 POWER SHELF FOR COMPUTER SERVERS  
At least one embodiment of this disclosure includes a power shelf for serving a power zone within an IT equipment rack. The power shelf includes: a DC bus configured to provide DC power to...
US20170094828 Self-biasing storage device sled  
A self-biasing storage device sled for mounting a storage device within a chassis is provided. The self-biasing storage device sled includes a bezel, which includes a first portion that is...
US20170094827 Server Rack System For Mounting Equipment  
An improved server frame for securing equipment thereto. The server frame includes four corner secured between a base and a top. Each corner has a plurality of standard openings to receive ends of...
US20170094826 GUIDE AND SUPPORT APPARATUS FOR PRINTED CIRCUIT BOARD  
A guide and support apparatus is provided. The guide and support apparatus comprises a mounting portion, a support portion, and a guide and lock portion. The support portion extends to the guide...
US20170094825 ELECTRONICS HOUSING AND MANUFACTURING METHOD OF ELECTRONICS HOUSING  
An electronics housing includes a base body and a metal plating layer formed on a surface of the base body. The base body includes an upper cover, a lower cover and a metal ring. The upper cover...
US20170094824 ELECTRONIC DEVICE STRUCTURE FORMED FROM POROUS METAL BONDED TO PLASTIC  
A composite material is disclosed which includes a plastic layer formed on a layer of metal. The metal layer includes pores into which an adhesive is introduced. The plastic layer is injection...
US20170094823 APPARATUS HAVING CONNECTION MODULE FOR USE WITH ELECTRICAL MODULE  
An apparatus is for use with an electrical module. The apparatus includes a connection module having a connection housing enclosing a connection electrical circuit. A connection registration...
US20170094822 ELECTRONIC DEVICE ENCLOSURE WITH AN ACCESS MECHANISM  
A device enclosure includes a housing, a shaft, and a front panel. The housing defines a receiving bay configured to slidably receive an electronic device. The shaft is slidably mounted on a...
US20170094821 Electronic Device Having a Display and Method for Manufacture  
A method of making a device housing involves providing a transparent lens with a front surface and a rear surface, and a stepped flange along at least a portion of the lens perimeter. The method...
US20170094820 TAMPER-RESPONDENT ASSEMBLIES WITH BOND PROTECTION  
Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part,...
US20170094819 ENCLOSURE WITH INNER TAMPER-RESPONDENT SENSOR(S)  
Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses,...
US20170094818 ELECTRONIC DEVICE INCLUDING CONNECTING MEMBER  
An electronic device is provided. The electronic device includes a housing that includes a first surface directed in the first direction, a second surface directed in a second direction opposite...
US20170094817 MULTI-SCREEN DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF  
A display device according to an exemplary embodiment includes: a first display unit having a polygon shape for displaying an image; and a plurality of second display units displaying an image and...
US20170094816 COUPLER AND HEAD MOUNTED DISPLAY DEVICE  
A head mounted display device is provided. The head mounted display device includes a main frame including a lens, a front case including a seating area in which an electronic device is seated, a...
US20170094815 Plate-Type Optical Member with Optical Fiber and Multi-Panel Display Device with the Same  
In a plate-type optical member for a multi-panel display device in which a plurality of individual display devices are joined and which includes junction area in which non-active areas of the...
US20170094814 Frame-Type Optical Member with Optical Fiber and Multi-Panel Display Device with Same  
In a multi-panel display device in which plural individual display devices are joined, it is possible to guarantee image continuity in panel junction areas of the multi-panel display device by...
US20170094813 IMAGE DISPLAY APPARATUS AND IMAGE DISPLAY APPARATUS MANUFACTURING METHOD  
An image display apparatus includes: a display unit which includes a display panel that displays an image on a front face, and a chassis disposed on a back face of the display panel and holding...
US20170094812 METHOD OF MODIFYING A DATUM SURFACE FOR IMPROVED PART OFFSET CONTROL  
Devices and techniques for improving the fit between multiple components of a part are described. In particular embodiments, the techniques involve providing features that allow for offset...
US20170094811 MULTI-PART ELECTRONIC DEVICE HOUSING HAVING CONTIGUOUS FILLED SURFACE  
A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion...
US20170094810 COATED ELECTRICAL ASSEMBLY  
An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma...
US20170094809 Apparatus for Assembling Light-Emitting Diode Lighting Fixtures  
An apparatus for assembling a LED lighting fixture contains a power cable, an elongated coupler, a base plate, a protruding terminal, a receiving terminal, and a lighting assembly. The power cable...
US20170094808 CIRCUIT BOARDS AND ELECTRONIC PACKAGES WITH EMBEDDED TAMPER-RESPONDENT SENSOR  
Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the...
US20170094807 FPC Flattening Jig and FPC Flattening Method  
Disclosure provides a FPC flattening jig and a FPC flattening method. The FPC flattening jig includes a pressurization mechanism and a heating mechanism; a bottom of the pressurization mechanism...
US20170094806 TAMPER-RESPONDENT ASSEMBLIES  
Methods of fabricating tamper-respondent assemblies are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a...
US20170094805 TAMPER-RESPONDENT ASSEMBLIES WITH REGION(S) OF INCREASED SUSCEPTIBILITY TO DAMAGE  
Methods of fabricating tamper-respondent assemblies provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a...
US20170094804 OVERLAPPING, DISCRETE TAMPER-RESPONDENT SENSORS  
Methods of fabricating tamper-respondent assemblies and electronic assembly packages are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and...
US20170094803 TAMPER-RESPONDENT SENSORS WITH FORMED FLEXIBLE LAYER(S)  
Methods of fabricating tamper-respondent electronic circuit structures and electronic assembly packages are provided which include, at least in part, a tamper-respondent sensor including one or...
US20170094802 INTERCONNECTS FOR ELECTRONIC DEVICES  
Provided are interconnect circuits for interconnecting arrays of devices and methods of forming these interconnect circuits as well as connecting these circuits to the devices. An interconnect...
US20170094801 METHOD FOR MANUFACTURING A CIRCUIT HAVING A LAMINATION LAYER USING LASER DIRECT STRUCTURING PROCESS  
The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product...
US20170094800 METHOD AND ARRANGEMENT FOR PROVIDING ELECTRICAL CONNECTION TO IN-MOLD ELECTRONICS  
A multilayer structure includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, printed...
US20170094799 INTEGRATED CIRCUIT AND METHOD THAT UTILIZE A SHAPE MEMORY MATERIAL  
An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the...
US20170094798 COMPONENT INCORPORATING SUBSTRATE AND METHOD FOR MANUFACTURING COMPONENT INCORPORATING SUBSTRATE  
A laminated body of a component incorporating substrate includes insulating base members. First and second mounting terminals of a first electronic component abut on a conductor-less surface of a...
US20170094797 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME  
A printed circuit board and a method of manufacturing the same is described herein. The printed circuit board includes a first insulating layer having a first circuit embedded in a first surface...
US20170094796 CIRCUIT ASSEMBLY FOR AN ELECTRONIC DEVICE  
Embodiments relate to systems and methods for forming a circuit assembly for an electronic device. The circuit assembly may include a substrate and a group of surface-mounted electronic components...
US20170094795 Conductor Track With Enlargement-Free Transition Between Conductor Path and Contact Structure  
The invention relates to an electronic device having an electrically isolating support structure, an electrically conducting conductor path on a surface of the support structure, and an...
US20170094794 PHOTO-DEFINABLE GLASS WITH INTEGRATED ELECTRONICS AND GROUND PLANE  
The present invention includes compositions and methods of creating electrical isolation and ground plane structures, around electronic devices (inductors, antenna, resistors, capacitors,...
US20170094793 RESIN SUBSTRATE COMBINED STRUCTURE  
A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a...
US20170094792 Electronic Component  
The invention concerns an electronic component that comprises a printed circuit board stack with multiple printed circuit boards arranged one on top of the other and that is used, in particular,...
US20170094791 BRIDGE DEVICE FOR INTERFACING A PACKAGED DEVICE WITH A SUBSTRATE  
Techniques and mechanisms for facilitating connection between a packaged device and a substrate of another device. In an embodiment, a device—such as a printed circuit board—comprises a substrate...
US20170094790 Circuit Arrangement for Vehicles and Use of a Circuit Arrangement  
Circuit arrangement for vehicles with at least one semiconductor element 30 and at least one first metal carrier plate 2a and a metal circuit board 2b. A multifaceted scope of application is...
US20170094789 PRINTED CIRCUIT BOARD  
A printed circuit board (PCB) is disclosed on which various kinds of electronic components having diverse specifications may be mounted. The PCB includes a substrate base a substrate base and a...
US20170094788 PRINTED CIRCUIT BOARD  
An electronic part having a plurality of signal terminals aligned as a terminal line along at least one side of the main body of the package is to be mounted onto the printed circuit board...