Match Document Document Title
US20170042078 Ornithogalum plant named 'MFPRINSTAR'  
A new and distinct Ornithogalum cultivar named ‘MFPRINSTAR’ is disclosed, characterized by long inflorescence of 30 cm, height of 60 cm, a high yield of 2-3 flowers per bulb, and light orange...
US20170042077 Ornithogalum plant named 'MFYELLSTAR'  
A new and distinct Ornithogalum cultivar named ‘MFYELLSTAR’ is disclosed, characterized by sterility, long inflorescence of 30 cm, height of 60 cm, a high yield of 2-3 inflorescence per bulb and...
US20170042076 Fuchsia plant named 'FWUNW20-0'  
A new and distinct Fuchsia cultivar named ‘FWUNW20-0’ is disclosed, characterized a well branched, mounded growth habit and strong stems. Flowers have a highly reflexed bright pink calyx, which...
US20170042075 Fuchsia plant named 'FWULR24-0'  
A new and distinct Fuchsia cultivar named ‘FWULR24-0’ is disclosed, characterized a strong, upright plant habit, with flowers occurring across the top of the plant. Plants are well branched, with...
US20170042074 Spiraea plant named 'Odessa'  
A new and distinct cultivar of Spiraea plant named ‘Odessa’, characterized by its deep rosy-pink colored flowers, dark green-colored foliage, and moderately vigorous, compact-globular growth...
US20170042073 ELECTRONIC COMPONENT MOUNTER  
There is provided an electronic component mounter configured to include a supplier holder in which a radial lead type electronic component supplier can be mounted, and to cause a mounting head to...
US20170042072 OPTIMIZATION PROGRAM AND MOUNTING WORK SYSTEM  
With multiple-board substrate defined as a circuit substrate provided with multiple boards of circuit pattern on which multiple electronic components are mounted, when performing mounting work of...
US20170042071 MANUFACTURING METHOD OF CASING  
A manufacturing method of a casing is provided. First, a plate, a frame and a main shell are provided, wherein the plate has an adhering region and at least one thermal fusion region, and the...
US20170042070 HIGH ISOLATION GROUNDING DEVICE  
The device includes a body and a plurality of contact portions. The body is substantially planar. The plurality of contact portions are associated with the body so as to form ports. The plurality...
US20170042069 APPARATUS AND METHODS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOUNT DEVICES  
Apparatus and methods related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a...
US20170042068 Use of Computationally Generated Thermal Energy  
In one aspect, a computing device-implemented method includes receiving at least one triggering event signal from one or more components of a heat recovery system. The method also includes...
US20170042067 ENERGY EFFICIENT VERTICAL DATA CENTER  
The vertical data center module is a multistory compact footprint data center unit that exploits vertical air movements, both downward and upward, to efficiently sustain conventional low-cost...
US20170042066 ELECTRONIC CIRCUIT DEVICE AND HEAT SINK STRUCTURE FOR THE SAME  
An electronic circuit device and a heat sink structure for the electronic circuit device capable of simultaneously achieving improved space efficiency and safeness are provided. The electronic...
US20170042065 HEAT SPREADER AND POWER MODULE  
The present disclosure provides a heat spreader and a power module. The heat spreader comprises: a base plate comprising a first surface and a second surface opposite to the first surface; an...
US20170042064 THERMAL MODULE  
A thermal module includes a heat pipe and a heat dissipation unit. The heat pipe has a main body and at least one first heat conduction section integrally radially and axially extending from a...
US20170042063 HYBRID THERMAL MANAGEMENT OF ELECTRONIC DEVICE  
An enclosure with hybrid thermal management for a heat-generating electronic device comprises a passive heat sink for conducting heat away from the electronic device, a cold skin adapted to slide...
US20170042062 HEAT DISSIPATION DEVICE AND WORKING METHOD THEREOF, DISPLAY DEVICE  
The present disclosure provides a heat dissipation device, a working method thereof and a display device. The heat dissipation device is applied to a display device, including a temperature...
US20170042061 SERVER FAN FLAP AND SHUTTER SYSTEM FOR PREVENTION OF AIR FLOW DIVERSION  
A server rack can include a plurality of server chassis. The server chassis can form a opening configured to receive a removable fan through the opening. The removable fan can including a...
US20170042060 QUICK RELEASE FAN MODULE  
A liftable and lockable fan is provided. The fan includes: a housing having a side wall; a tab mounted in the side wall, including an upwardly extending lower portion, an outwardly facing locking...
US20170042059 HEAT DISSIPATION DEVICE FOR AN ELECTRICAL METER SOCKET  
A heat dissipation device is presented for an electrical meter socket. The heat dissipation device includes a conduit with a first end configured to be mounted to a first opening in a housing of...
US20170042058 PARALLEL HEAT SPREADER  
A heat spreader including multiple layers of anisotropic material to conduct thermal energy. Multiple graphite sheet layers may be laminated and each sheet may be thermally connected to one or...
US20170042057 Electronics Cabinet  
An electronics cabinet having a cabinet frame, a front equipment rail, and a structural air dam. The cabinet frame includes a first pair of front-to-back beams connected to a pair of top...
US20170042056 EQUIPMENT SECURING DEVICE, ATTACHMENT-FRAME-INTERNAL STORAGE EQUIPMENT, RACK-MOUNT SEVER DEVICE AND EQUIPMENT SECURING METHOD  
The present invention reduces an area in which an attachment frame for storing equipment on which a device is mounted is arranged. An equipment securing device is equipped with a panel mounted on...
US20170042055 COMPONENT QUICK RELEASE LATCH ASSEMBLY  
Latch mechanism having a latch slide having a receiving portion and configured to couple a component with a server chassis. A latch ramp disposed on the latch slide at a first end of the receiving...
US20170042054 REMOVAL ASSEMBLY  
A removal assembly includes a main body, a positioning element, an elastic element, an actuating element, and a wrench element. The positioning element is movably disposed in an inner space of the...
US20170042053 SEMICONDUCTOR DEVICE  
In a semiconductor device, a multilayer substrate includes an insulating substrate, a first circuit board having a first semiconductor chip disposed thereon, and a second circuit board having a...
US20170042052 PRESSURE COMPENSATION ELEMENT HAVING SPRING ELEMENT, CASING AND ELECTRONIC CONTROL DEVICE  
A pressure compensation element for casings includes a connecting body in the form of a hollow body, a membrane seat having a contact surface for a membrane and an impact protection device. The...
US20170042051 SEMICONDUCTOR DEVICE  
When a nut housing member is inserted from a first opening portion into a case (terminal housing area) in a semiconductor device, first and second protrusions of the nut housing member slide on...
US20170042050 THERMAL SLEEVE WITH REFLECTIVE POSITIONING MEMBER, ASSEMBLY THEREWITH AND METHOD OF CONSTRUCTION THEREOF  
A thermal sleeve for protecting an electronic member connected to a wiring harness against exposure to heat is provided. The thermal sleeve has a tubular member including a circumferentially...
US20170042049 THERMAL SLEEVE WITH REFLECTIVE POSITIONING MEMBER, ASSEMBLY THEREWITH AND METHOD OF CONSTRUCTION THEREOF  
A thermal sleeve for protecting an electronic member connected to a wiring harness against exposure to heat, combination thereof, and method of construction thereof is provided. The thermal sleeve...
US20170042048 Module Arrangement  
The invention relates to a module arrangement (1) with a base module and at least one submodule (5); the base module has at least two connection modules. The submodule (5) can be put into contact...
US20170042047 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME  
A display device and a method of manufacturing the same are disclosed. In one aspect, the display device includes a flexible substrate having a display area and a peripheral area outside the...
US20170042046 DISPLAY DEVICE, AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME  
A display device, and a method and apparatus for manufacturing the display device, are provided. The display device includes a cover window including a curved portion, and a display panel smaller...
US20170042045 CURVED SURFACE DISPLAY DEVICE AND CURVED SURFACE DISPLAY METHOD  
A curved surface display device and a curved surface display method, which belong to the field of display technology. The curved display device comprises a display panel, a motor, a first arc...
US20170042044 Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device  
Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in...
US20170042043 FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS  
A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250°...
US20170042042 INTELLIGENT SOLDERING CARTRIDGE FOR AUTOMATIC SOLDERING CONNECTION VALIDATION  
An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a...
US20170042041 ATTACHING APPARATUS FOR CHIP-ON-FILMS  
An attaching apparatus for chip-on-films includes: a base; a rotary table; a first driving device configured to drive the rotary table to rotate around the axis of the rotary table; a TCP side...
US20170042040 COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM PHOSPHORUS ON COPPER, AND A COATED COMPONENT THEREFROM  
A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution...
US20170042039 ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRAZINE DERIVATIVE CONTAINING CATALYSTS  
Pyrazine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal...
US20170042038 PROCESS FOR PRODUCING SUBSTRATE HAVING WIRING, RADIATION-SENSITIVE COMPOSITION, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE  
A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii)...
US20170042037 METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRIDYL ALKYLAMINES AND BISEPOXIDES  
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction...
US20170042036 Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device  
Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in...
US20170042035 FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE  
The present disclosure provides a flexible printed circuit board, a method for manufacturing the same and a display device. The flexible printed circuit board includes a first component and a...
US20170042034 SYSTEM AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTROMECHANICAL ASSEMBLIES  
A hybrid additive manufacturing approach that incorporates three-dimensional (3D) printing and placement of modules selected from a library of modules to fabricate an electromechanical assembly....
US20170042033 COMPONENT BUILT-IN MULTILAYER BOARD  
In an LC composite component, a chip capacitor is built in a multilayer substrate including base material layers made of a thermoplastic resin. The number of the base material layers in a portion...
US20170042032 CLAMP AND DISPLAY DEVICE INCLUDING SAME  
According to an embodiment of the present disclosure, since the electronic components are fixed on the PCB by the clamp, post processing, such as soldering or application of an adhesive, may be...
US20170042031 METHOD FOR PROTECTING AN ELECTRONIC CIRCUIT CARRIER AGAINST ENVIRONMENTAL INFLUENCES AND CIRCUIT MODULE  
The present disclosure provides a method for protecting an electronic interconnect device from environmental effects. The electronic interconnect device may be connected to at least one electronic...
US20170042030 BOARD-MOUNTED CIRCUIT BREAKERS FOR ELECTRONIC EQUIPMENT ENCLOSURES  
A board-mounted circuit breaker assembly for an electronic equipment enclosure includes a printed circuit board having a plurality of quick-connect terminals and a circuit breaker. The circuit...
US20170042029 LAMINATED ELECTRONIC COMPONENT AND LAMINATED ELECTRONIC COMPONENT MOUNTING STRUCTURE  
A laminated electronic component includes a main body composed of a stacked body in which dielectric layers and internal electrode layers are alternately laminated, and an external electrode...