Match Document Document Title
US20160021758 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME  
A printed wiring board includes an insulation layer, a first conductive layer embedded into first surface of the insulation layer, a second conductive layer formed on second surface of the...
US20160021757 METHOD AND DEVICE FOR FABRICATING MULTI-PIECE SUBSTRATE  
Provided are a multi-piece board fabrication method and apparatus which are capable of efficiently bonding a frame and a non-defective board piece together, thereby efficiently fabricating a...
US20160021756 LOW-AREA OVERHEAD CONNECTIVITY SOLUTIONS TO SIP MODULE  
Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One...
US20160021755 CHIP EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME  
The present invention relates to a chip embedded substrate, which includes a substrate formed by alternately stacking an insulation layer and a circuit layer and an embedded chip equipped with a...
US20160021754 SMD, IPD, AND/OR WIRE MOUNT IN A PACKAGE  
Various package structures and methods of forming package structures are described. According an embodiment, a structure includes a first package and a package component attached to the first...
US20160021753 CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME  
A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a combined component accommodated in the cavity of the substrate, a first build-up layer laminated...
US20160021752 PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT  
A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a...
US20160021751 CIRCUIT FIXING MEMBER, CIRCUIT MODULE, AND JOINING METHOD FOR CIRCUIT MODULE  
A circuit fixing member is provided which achieves a connection with a controlled object after a circuit module is produced, thereby avoiding disconnection of a wire member in the course of the...
US20160021750 MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION  
A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic...
US20160021749 PACKAGE BOARD, METHOD OF MANUFACTURING THE SAME AND STACK TYPE PACKAGE USING THE SAME  
There are provided a package board, a method of manufacturing the same, and a stack type package using the same. The package board according to an exemplary embodiment of the present invention...
US20160021748 WIRING BOARD STRUCTURE AND METHOD OF MANUFACTURING WIRING BOARD STRUCTURE  
A wiring board structure includes: a first wiring board includes a first interconnection and a second interconnection constituting a power supply route; a second wiring board mounted over the...
US20160021747 LASER WELDING OF THRU-HOLE ELECTRICAL COMPONENTS  
A circuit board assembly includes a printed circuit board and a component. The printed circuit board includes a plated thru-hole through the printed circuit board. The component includes a lead to...
US20160021746 Display with Vias for Concealed Printed Circuit and Component Attachment  
An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic...
US20160021745 BALL GRID ARRAY FORMED ON PRINTED CIRCUIT BOARD  
A Ball Grid Array (BGA) formed on printed circuit board is provided. The BGA comprises a first solder ball module and a second solder ball module. The first solder ball module comprises a...
US20160021744 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
A printed circuit board includes a first circuit pattern embedded in an insulating layer so that an upper surface of the first circuit pattern is exposed to one surface of the insulating layer, a...
US20160021743 CORELESS PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF  
A coreless packaging substrate is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and exposed from...
US20160021742 REFLOW SOLDERABLE FLEXIBLE CIRCUIT BOARD-TO-FLEXIBLE CIRCUIT BOARD CONNECTOR REINFORCEMENT  
A system embodiment may include a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed. The system may further include a...
US20160021741 CONDUCTIVE FILM FORMING COMPOSITION, CONDUCTIVE FILM, AND WIRING BOARD  
A conductive film forming composition includes a fluorine atom-containing migration inhibitor and a metal particle, with the migration inhibitor including at least one selected from the group...
US20160021740 LOW DIELECTRIC RESIN COMPOSITION WITH PHOSPHORUS-CONTAINING FLAME RETARDANT AND PREPARATION METHOD AND APPLICATION THEREOF  
The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin...
US20160021739 LOW DIALECTRIC COMPOSITE MATERIAL AND LAMINATE AND PRINTED CIRCUIT BOARD THEREOF  
The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared...
US20160021738 High Rate Electric Field Driven Nanoelement Assembly on an Insulated Surface  
A method for high rate assembly of nanoelements into two-dimensional void patterns on a non-conductive substrate surface utilizes an applied electric field to stabilize against forces resulting...
US20160021737 ELECTRIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME  
An electronic device module includes a board including one or more external connection electrodes and plating lines extending from the external connection electrodes by a predetermined distance;...
US20160021736 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME  
There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: a first...
US20160021735 THROUGH-HOLE LAYOUT STRUCTURE, CIRCUIT BOARD, AND ELECTRONIC ASSEMBLY  
A through-hole layout structure is suitable for a circuit board. The through-hole layout structure includes a pair of first differential through-holes, a pair of second differential through-holes,...
US20160021734 SEMICONDUCTOR DEVICE WITH ACTIVE SHIELDING OF LEADS  
A semiconductor device has a multi-wire lead and a die having a multi-site bond pad. A shielding wire and a guarded wire both extend from the multi-wire lead to the multi-site bond pad. The...
US20160021733 FLEXIBLE DEVICE CARRIER AND METHOD FOR ATTACHING MEMBRANE ON FLEXIBLE DEVICE  
The present invention provides a flexible device carrier for a flexible display panel and a method for attaching a membrane on the flexible device. The flexible device carrier comprises: a bottom...
US20160021732 FLEXIBLE DISPLAY AND METHOD FOR PREPARING THE SAME  
The present invention provides a flexible display and a method for preparing the same. The method comprises the steps of: providing a first substrate; forming a bonding agent layer on a first...
US20160021731 ELECTRONIC DEVICE CONSOLE WITH NATURAL DRAFT COOLING  
An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an...
US20160021730 ELECTRONIC, OPTOELECTRONIC, OR ELECTRIC ARRANGEMENT  
An electronic, optoelectronic or electric arrangement contains a circuit carrier having a metallic heat conductor, and a component, which is embedded, inserted or formed in the circuit carrier....
US20160021729 SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, AND POWER MODULE  
The present invention provides a power module substrate including an insulating substrate, a circuit layer which is formed on one surface of the insulating substrate, and a metal layer which is...
US20160021728 PLASMATRON AND HEATING DEVICES COMPRISING A PLASMATRON  
A plasmatron for heating a gas, more specifically air, located in a heating space, includes a nozzle having a nozzle wall and a nozzle opening located in the nozzle wall, whereby a ratio of a...
US20160021727 EXPOSURE MANAGEMENT SYSTEM  
An exposure management system according to an embodiment includes a processing circuitry. The processing circuitry is configured to calculate a deviation index related to a difference between a...
US20160021726 HIGH-FREQUENCY WAVE TYPE OF X-RAY GENERATOR  
A high frequency X-ray generator includes an anode voltage generator, a cathode voltage generator and a X-ray tube. The anode voltage generator is configured to generate a first high voltage. The...
US20160021725 Portable Industrial Radiography Apparatus  
A portable industrial radiography apparatus is provided for radiographic non-destructive testing. The portable industrial radiography apparatus includes a support frame, an upright support member...
US20160021724 CONNECTABLE AND SYNCHRONIZABLE LIGHT STRINGS  
Embodiments of the present disclosure include a decorative light string including a first light strand, a power supply, a controller, and an electrical connector. The first light strand includes a...
US20160021723 System for and Method of Commissioning Lighting Devices  
A lighting system for and method of commissioning LED light fixtures is disclosed. The LED light fixtures include a controller unit that is programmed with lighting firmware and an on-board 5...
US20160021722 AMOLED Light Sensing  
The present disclosure is directed to a method and apparatus for estimating ambient light conditions for an OLED display. Embodiments of the method and apparatus use one or more columns of OLEDs...
US20160021721 SYSTEM AND METHOD FOR INTELLIGENT LIGHTING SYSTEMS  
An intelligent system for controlling an exterior landscape lighting system by self calibration and self adjustments in real-time includes a plurality of lighting units, each lighting unit...
US20160021720 INTEGRATED LIGHTING SYSTEM AND METHOD  
System and method include luminaires, control switches, occupancy detectors, and photocells connected to central control module for setting up, testing, commissioning and maintaining the system....
US20160021719 FIELD SELECTABLE CONTACTOR CONTROL MODULES  
Lighting control systems, control modules for contactors, and methods of operating a lighting control system are described. In one example, a control module for a lighting contactor includes a...
US20160021718 DISPLAY UNIT, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS  
A display unit of the present disclosure includes: a plurality of pixels configured to emit emission light different from one another; and an insulating film provided between the plurality of...
US20160021717 LIGHTING SYSTEM WITH ILLUMINANCE CONTROL  
The present invention relates to an illumination control system comprising a plurality of outdoor luminaries and a motorized service vehicle. Each luminaire comprises a controllable light source...
US20160021716 LIGHTING CONTROL DEVICE AND METHOD  
Embodiments relate to controlling a lighting control according to at least one of received signal strength indication (RSSI) and a preset lighting mode. Brightness or/and color temperature of the...
US20160021715 LIGHT EMITTING DEVICE DRIVER CIRCUIT AND CONTROL CIRCUIT AND CONTROL METHOD THEREOF  
The present invention provides a light emitting device driver circuit and a control circuit and a control method thereof. The light emitting device driver circuit is used for driving a light...
US20160021714 SYSTEMS AND METHODS FOR MAINTAINING DIMMER BEHAVIOR IN A LOW-POWER LAMP ASSEMBLY  
In accordance with the present disclosure, a control circuit may be employed for controlling delivery of energy from an input of a lamp assembly to a load of the lamp assembly. The control circuit...
US20160021713 ELECTRONIC CONTROL TO REGULATE POWER FOR SOLID-STATE LIGHTING AND METHODS THEREOF  
Apparatus and methods to regulate an input power applied to a plurality of light emitters are provided. A regulator device includes a plurality of switches and a control circuit that controls the...
US20160021712 LIGHTING DEVICE, LIGHT SOURCE DEVICE, ILLUMINATING DEVICE, AND VEHICULAR HEADLIGHT  
The lighting device according to the present invention is used for lighting a light source device. The light source device includes a light source unit connected between first and second power...
US20160021711 CIRCUIT WITH AN LED DIMMING LINEAR COMPENSATION  
A circuit with an LED dimming linear compensation, which includes: a rectification circuit with two inputs connected to the alternating current and two DC outputs, a positive DC output and a...
US20160021710 LIGHT EMITTING DIODE DRIVING APPARATUS  
A light emitting diode driving apparatus includes a first light emitting diode driving unit and a second light emitting diode driving unit. The first light emitting diode driving unit includes a...
US20160021709 INDEPENDENTLY PROGRAMMABLE LIGHTS FOR USE IN GLOVES  
The present invention extends to independently programmable lights for use in gloves and to gloves that incorporate such lights. Each independently programmable light of the present invention can...