Match Document Document Title
US20160007519 Heuchera plant named 'DKIRA95'  
A new and distinct Heuchera cultivar named ‘DKIRA95’ is disclosed, characterized by a large leaf size, small white green flowers, mounded growth habit and full, strong plant structure. The new...
US20160007518 Poinsettia plant named 'EURX0001'  
A new Poinsettia plant named ‘EURZ0001’ particularly distinguished by its pink flower color, relatively large inflorescences with the bracts a little upright directed, early flowering response,...
US20160007517 Poinsettia plant named 'EURZ0002'  
A new Poinsettia plant named ‘EURZ0002’ particularly distinguished by cream-white flower color, relatively large inflorescences with the bracts a little upright directed, early flowering response,...
US20160007516 Landscape shrub rose plant named 'Meiradena'  
A new and distinct Landscape Shrub rose plant is provided that abundantly and substantially continuously forms attractive cup-shaped double white blossoms. The plant exhibits vigorous vegetation...
US20160007515 Ball Grid Array Rework  
Embodiments of the invention relates to a method for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the...
US20160007514 COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD  
A component mounting device that mounts on a board a fitting component to be attached by a mechanical fitting or engagement to a to-be-attached part formed in the board. The component mounting...
US20160007513 ELECTRONIC CIRCUIT COMPONENT MOUNTING METHOD AND MOUNTING SYSTEM  
A mounting method performed by an electronic circuit component mounting machine that includes a tape feeder which is mounting-machine-main-body-side feeder held by a mounting machine main body,...
US20160007512 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD  
An electronic component mounting system includes a component mounting line formed by interconnecting component mounting units which concurrently performs component mounting work on two kinds of...
US20160007511 INTERNAL PCI ADAPTER CARD CARRIER  
According to one embodiment, a method for placing an adapter card on a system board of a computer system includes, aligning a tool having an adapter card secured therewith to a slot on a system...
US20160007510 ELECTROMAGNETIC INTERFERENCE SHIELDING FILM  
The invention relates to an electromagnetic interference shielding film comprising an electromagnetic wave absorptive layer which contains electromagnetic wave absorptive particles; a conductive...
US20160007509 FLAME RETARDANT, ELECTRICALLY CONDUCTIVE ADHESIVE MATERIALS AND RELATED METHODS  
Disclosed are exemplary embodiments of a flame retardant, electrically conductive adhesive material. In an exemplary embodiment, a flame retardant, electrically conductive adhesive material...
US20160007508 PORTABLE MECHANICAL SWITCH FOR SELECTIVE DEACTIVATION OF RADIO FREQUENCY IDENTIFICATION CIRCUITS  
Systems and methods for providing security for authentication devices—such as electronically readable cards or ID badges with embedded RFID chips or NFC capability—may include an envelope or...
US20160007507 Power Conversion Device  
A power conversion device capable of reducing a temperature variation between a plurality of semiconductor modules is provided. The power conversion device comprises condensers 121, 122, a...
US20160007506 MODULAR DATA CENTER  
A modular data center includes: a rack which houses an electronic device; a blower device capable of switching a flowing direction of air and configured to feed the air into the rack; a space...
US20160007505 SERVER HEAT DISSIPATION SYSTEM  
A heat dissipation system includes a main body part, an inner unit and a rear surface part. The main body part has first and second surfaces at both ends so as to form a receiving space therein....
US20160007504 ELECTRONIC SUBSTRATE WITH HEAT DISSIPATION STRUCTURE  
An electronic substrate with heat dissipation structure includes a substrate plate and at least one heat pipe. The substrate plate includes a wiring layer, a grounding layer and an insulation...
US20160007503 MOUNTING FRAMEWORK FOR ARRANGING ELECTRONIC COMPONENTS  
A mounting frame for arrangement of electronic components includes a set of horizontal shelves and vertical posts of the frame with, at least, one internal channel for coolant to pass...
US20160007502 HEAT EXCHANGER, COOLING SYSTEM, AND ELECTRONIC DEVICE  
An object of technology disclosed herein is improving cooling efficiency. A heat exchanger includes plural pipes and a tank. The plural pipes are arrayed side-by-side. The tank couples together...
US20160007501 COOLING SYSTEM AND ELECTRONIC DEVICE  
An object of technology disclosed herein is to improve cooling performance for plural heat generating bodies. A cooling system includes a heat dissipating section, plural heat receiving sections,...
US20160007500 POWER CONVERTER APPARATUS  
A power converter apparatus is provided, which includes a horizontal switching device, a control switching device connected with the horizontal switching device and for controlling drive of the...
US20160007499 HEAT DISSIPATION LID HAVING DIRECT LIQUID CONTACT CONDUITS  
A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also...
US20160007498 HEAT RADIATION SHEET  
Provided is a heat-radiating sheet including a heat-radiating layer having a porous structure with multiple pores, a filler including multiple thermally conductive particles and filling the pores...
US20160007497 APPARATUS AND METHOD FOR CONDUCTIVE COOLING OF AN INFORMATION HANDLING SYSTEM  
An apparatus provides conductive cooling of an information handling system. The apparatus includes a panel having a vent area formed in the panel. The vent area includes a perimeter, an interior...
US20160007496 SPARK PREVENTING ELEMENT FOR PRINTED CIRCUIT BOARD  
A spark-preventing element embedded in a printed circuit board includes a capacitive output electrode, a capacitive input electrode, an interlayer conductive member electrically connecting the...
US20160007495 ASSEMBLY FOR ATTACHING A CIRCUIT BOARD TO A HOUSING  
The present invention provides an assembly for attaching a circuit substrate to a housing. The assembly includes a fastener having a first end and a second end opposite the first end, where the...
US20160007494 Compact Casing Structure  
This invention illustrates a compact casing structure, integrally made by press-fitting at least one metallic material and adapted to be connected with a preset electronic device. The casing...
US20160007493 METHOD OF FABRICATING HOUSING AND HOUSING  
A method of fabricating a housing includes: providing a metal member including a base plate and a sidewall, the base plate having an inner surface connected to the sidewall; providing a filler...
US20160007492 Power Semiconductor Device and Power Conversion Device  
A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power...
US20160007491 UNIVERSAL SYSTEM FOR MOUNTING RACK DOORS  
A mount for mounting a door to rack includes a rack including a first pair of vertically-extending supports, each support including an array of openings; a first mount coupled to the rack at a...
US20160007490 TRANSFORMER SECURITY ENCLOSURE  
A security enclosure for a transformer includes a first sidewall, a second sidewall, and a bottom at least partially enclosing an interior. The bottom has an aperture configured to receive a...
US20160007489 SUPPORT ASSEMBLY AND DISPLAY DEVICE  
A support assembly and a display device are provided. The support assembly comprises a support frame (3) and a carrier frame (1) provided at an upper end of the support frame (3). The carrier...
US20160007488 CONNECTION BOX, MAIN BOX, AND BASE STATION TRANSCEIVER  
Embodiments provide a connection box, a main box, and a base station transceiver. The connection box 10 of the base station transceiver 100is operable for connecting a backhaul processing...
US20160007487 PROTECTING CASING FOR A PORTABLE ELECTRONIC DEVICE  
A protecting casing for a portable electronic device has a shell and a detachable actuating panel. The actuating panel has a curved clamping sheet crossing over a front edge of the portable...
US20160007486 PACKAGE SUBSTRATE  
There is provided a package substrate including: a substrate on which a circuit layer and an insulating layer are stacked; a metal post provided in an outside region of at least any one of an...
US20160007485 SEMICONDUCTOR MODULE WITH ULTRASONICALLY WELDED TERMINALS  
A semiconductor module includes a base plate, a substrate on the base plate and carrying at least one semiconductor chip, a housing attached to the base plate and at least partially enclosing the...
US20160007484 Bag computer display panel improvements  
Disclosed are improvements on a display panel mounted to a bag. For a display panel mounted in a pocket and with a retainer for angle holding capability, protective spacers may be provided. To...
US20160007483 FABRICATION METHOD OF PACKAGING SUBSTRATE HAVING EMBEDDED PASSIVE COMPONENT  
A carrier board having two opposite surfaces is provided and a releasing film and a metal layer are formed on the two opposite surfaces respectively. Each metal layer formed with positioning pads...
US20160007482 Prepregs and Laminates Having a UV Curable Resin Layer  
Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable...
US20160007481 ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS  
A method of assembling a packaged semiconductor device starts by dropping a pre-formed capacitor precursor on a surface of or within a first substrate. An integrated circuit die is dropped on...
US20160007480 COMPONENT BUILT-IN MULTILAYER SUBSTRATE FABRICATING METHOD AND COMPONENT BUILT-IN MULTILAYER SUBSTRATE  
A fabricating method according to the present disclosure is a component built-in multilayer substrate fabricating method for incorporating a component (12) in a resin multilayer substrate (11)...
US20160007479 CHIP SPACING MAINTAINING APPARATUS  
A chip spacing maintaining apparatus for maintaining the spacing between any adjacent ones of a plurality of chips obtained by dividing a workpiece attached to an expand sheet, the expand sheet...
US20160007478 DISPLAY DEVICE  
A display device includes a first substrate, at least one trace, a hydrophobic protective layer, a flexible printed circuit board (FPCB), a second substrate and a sealant. The first substrate has...
US20160007477 METHOD FOR FORMING ELECTRICALLY CONDUCTIVE ULTRAFINE PATTERN, ELECTRICALLY CONDUCTIVE ULTRAFINE PATTERN, AND ELECTRIC CIRCUIT  
There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing...
US20160007476 ELECTROLESS PLATING METHOD AND CERAMIC SUBSTRATE  
Provided is an electroless plating method for a low temperature co-fired glass ceramic substrate, the method including: a degreasing and activation treatment step of degreasing and activating a...
US20160007475 METHOD OF PRINTING ELECTRONIC SYSTEMS ON TEXTILE SUBSTRATES  
The present invention relates to the very innovative field of smart textiles. More particularly the present invention discloses an innovative process for screen printing of textile substrates, by...
US20160007474 HEATING CIRCUIT ASSEMBLY AND METHOD OF MANUFACTURE  
A heating circuit assembly and method of manufacture includes an electrically conductive heating element having a pattern. An electrically non-conductive substrate is additive manufactured and...
US20160007473 METHOD FOR FABRICATING PRINTED ELECTRONICS  
A method for fabricating printed electronics and optical components includes printing a trace of electrically conductive, semiconductive or insulating material on a substrate and shrinking the...
US20160007472 METHOD OF FABRICATING AN ELECTRICAL DEVICE PACKAGE STRUCTURE  
A method of packaging an electrical device including following steps is provided. A circuit board including a substrate and a first conductive pattern is provided. The electrical device having an...
US20160007471 VIA ADDING METHOD AND PRINTED CIRCUIT BOARD  
A via adding method comprising: identifying a target area where a via is to be added in a printed circuit board; determining a starting point for starting a search for a location of the via in the...
US20160007470 Method and Device for Electrically Coupling a Plurality of Semiconductor Device Layers by a Common Conductive Layer  
An assembly includes a first laminate electronic component and a second laminate electronic component. The first laminate electronic component includes a first dielectric layer, at least one first...