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US20160007469 EMBEDDED COMPONENT SUBSTRATE AND METHOD FOR FABRICATING THE SAME  
An embedded component substrate and methods for fabricating the same are provided. The embedded component substrate includes a substrate having at least one cavity, a first surface, and a second...
US20160007468 CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME  
A circuit substrate includes a core substrate having cavity, metal blocks in the cavity, first and second build-up layers including insulating layers and laminated on first and second sides of the...
US20160007467 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF  
A package structure and a method of manufacturing the package structure are disclosed. The package structure in accordance with an aspect of the present invention includes: a stiffener substrate;...
US20160007466 PRINTED CIRCUIT BOARD  
A printed circuit board includes a first semiconductor package on a first surface layer of a printed wiring board and a second semiconductor package on a second surface layer where a bus signal is...
US20160007465 SEMICONDUCTOR DEVICE  
A semiconductor device includes a semiconductor chip which includes a first circuit and a second circuit that are spaced apart from each other, without internal wirings electrically connecting the...
US20160007464 ELECTRONIC DEVICE AND MOUNTING STRUCTURE OF THE SAME  
An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is...
US20160007463 ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME  
An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on...
US20160007462 METHOD FOR MANUFACTURING LAYERED ELECTRONIC DEVICES  
A method for fabricating printed electronics includes printing a trace of an electrical component on a first substrate to form a first layer. The method further includes printing a trace of an...
US20160007461 Insulating Substrates Including Through Holes  
It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 μm, and a diameter of the...
US20160007460 WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE  
A wiring substrate includes a core layer, a first wiring layer, a first insulating layer, a first via wiring, a second wiring layer, a second insulating layer, a second via wiring, a third wiring...
US20160007459 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME  
A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device...
US20160007458 SUSPENSION BOARD WITH CIRCUIT  
A suspension board with circuit includes a metal supporting board having a support opening portion passing through a thickness direction; a base insulating layer disposed on an upper surface of...
US20160007457 Ball Grid Array Rework  
Embodiments of the invention relates to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is...
US20160007456 ELECTROCONDUCTIVE NANOWIRE NETWORK, AND ELECTROCONDUCTIVE SUBSTRATE AND TRANSPARENT ELECTRODE USING SAME, AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE NANOWIRE NETWORK, ELECTROCONDUCTIVE SUBSTRATE, AND TRANSPARENT ELECTRODE  
There are provided a conductive nanowire network, a conductive board and transparent electrode utilizing it, and a method for producing the same. The conductive nanowire network of the invention...
US20160007455 COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND CIRCUIT BOARD  
Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. A copper particulate dispersion includes a...
US20160007454 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM USING SAME, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD  
The present invention relates to a photosensitive resin composition containing (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerization initiator, (C) a thiol...
US20160007453 HIGH THERMAL CONDUCTIVITY PREPREG, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD USING THE PREPREG, AND SEMICONDUCTOR DEVICE USING THE MULTILAYER PRINTED WIRING BOARD  
Problem: To prepare a prepreg having high thermal conductivity and a low thermal expansion coefficient. Resolution Means: The prepreg of the present disclosure is composed of a composite layer...
US20160007452 CIRCUIT SUBSTRATE AND PROCESS FOR PREPARING THE SAME  
The present invention relates to a process for preparing a bonding sheet for composing circuit substrate, comprising pre-treating glass fabrics with a pre-treating varnish having a same or close...
US20160007451 CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME  
A circuit substrate includes a core substrate having cavity penetrating through the core substrate, a metal block accommodated in the cavity of the core substrate, a first build-up layer including...
US20160007450 Method for Producing a Printed Circuit Board with MultiLayer Sub-Areas in Sections  
A method for producing a printed circuit board (13, 15, 16) with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (1, 1′) and...
US20160007449 CHIP EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME  
Disclosed herein is a chip embedded substrate including: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip...
US20160007448 S-Shaped Ceramic Feedthrough  
An electrical interconnect has a non-planar ceramic substrate with opposing first and second ends. A first conductive layer having first and second opposing sides is disposed within the ceramic...
US20160007447 ELECTRONIC DEVICE MOUNTING SUBSTRATE, ELECTRONIC APPARATUS, AND IMAGING MODULE  
There are provided an electronic device mounting substrate and an electronic apparatus which are capable of miniaturization. An electronic device mounting substrate includes: an insulating base...
US20160007446 MULTILAYER CERAMIC CAPACITOR WITH INTERPOSER, AND INTERPOSER FOR MULTILAYER CERAMIC CAPACITOR  
An embodiment of an multilayer ceramic capacitor with interposer includes: an interposer 20 having an insulated substrate 21, two first conductor pads 22, two second conductor pads 23 and two...
US20160007445 HIGH-FREQUENCY SIGNAL PROCESSING METHOD  
The high-frequency signal processing method provides at least two isolation terminals between adjacent signal transmission conductor sets. For two adjacent signal transmission conductor sets of a...
US20160007444 REINFORCING MEMBER FOR FLEXIBLE PRINTED WIRING SUBSTRATE, FLEXIBLE PRINTED WIRING SUBSTRATE, AND SHIELD PRINTED WIRING SUBSTRATE  
A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A...
US20160007443 CIRCUIT BOARD DEVICE AND CIRCUIT BOARD DEVICE FOR REDUCING ACOUSTIC NOISE  
A circuit board device for reducing acoustic noise is provided. The circuit board device includes a substrate, a first capacitor packaging area, a second capacitor packaging area, a first pad, a...
US20160007442 Prepregs Including UV Curable Resins Useful for Manufacturing Semi-Flexible PCBs  
Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV...
US20160007441 FOLDING TYPE DISPLAY APPARATUS AND ELECTRIC EQUIPMENT  
Disclosed are folding type display apparatuses. The folding type display apparatus comprises a flexible display section, and a plurality of housings, which includes a first housing having a space...
US20160007440 HEAT CHANNELING AND DISPERSING STRUCTURE AND MANUFACTURING METHOD THEREOF  
A heat channeling and dispersing structure includes a substrate, a printed circuit board, and a heat-producing electronic element on the printed circuit board. The printed circuit board is mounted...
US20160007439 COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME  
A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of...
US20160007438 SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF  
A substrate structure with invisible inner electrode patterns is provided. The substrate structure includes a substrate, an electrode pattern, a first laminated structure, and a passivation layer....
US20160007437 ELECTROMAGNETIC WAVE EMISSION DEVICE  
The purpose of the present invention is to provide an electromagnetic wave emission device in which the destination to which an electromagnetic wave is supplied can be switched among a plurality...
US20160007436 METHOD AND APPARATUS FOR PROVIDING HIGH CONTROL AUTHORITY ATMOSPHERIC PLASMA  
Embodiments of the invention relate to a method and apparatus for providing high thrust density plasma, and/or high control authority plasma. In specific embodiments, such high thrust density,...
US20160007435 SYSTEMS AND METHODS FOR SYNCHRONOUS OPERATION OF DEBRIS-MITIGATION DEVICES  
Systems and methods for synchronous operation of debris-mitigation devices (DMDs) in an EUV radiation source that emits EUV radiation and debris particles are disclosed. The methods include...
US20160007434 EXTREME ULTRAVIOLET LIGHT SOURCE  
An initial pulse of radiation is generated; a section of the initial pulse of radiation is extracted to form a modified pulse of radiation, the modified pulse of radiation including a first...
US20160007433 EXTREME ULTRAVIOLET SOURCE WITH MAGNETIC CUSP PLASMA CONTROL  
A laser-produced plasma extreme ultraviolet source has a buffer gas to slow ions down and thermalize them in a low temperature plasma. The plasma is initially trapped in a symmetrical cusp...
US20160007432 RADIOGRAPHIC IMAGE CAPTURING APPARATUS AND RADIOGRAPHIC IMAGE CAPTURING SYSTEM  
A radiographic image capturing apparatus has a radiation source device including a radiation source for outputting radiation, and a detector device including a radiation detector for detecting...
US20160007431 SWITCH AND METHOD OF OPERATION  
A control system including: a base including a central axis; a knob rotatably connected to the base, the knob rotatable about the central axis; a plurality of individually indexed light emitting...
US20160007430 REMOTELY CONTROLLED HOLIDAY LIGHTING AND SOUND SYSTEM  
A remotely controlled holiday lighting and sound system provides a remotely controlled and decorated control module that integrates into a holiday symbol, such as a Christmas tree, to control a...
US20160007429 Lighting Control System and Method for Association of Nodes in a Multi-Node Network  
The invention relates to a lighting control system and method for association of nodes in a multi-node network. The system comprises a number of lighting nodes forming a multi-node network, each...
US20160007428 INTEGRATED LIGHT-EMITTING DIODE DRIVER CIRCUIT AND METHOD OF OPERATING THE SAME  
An integrated light-emitting diode (LED) driver circuit includes a bi-directional power line communication (PLC) unit, a power conversion module, and a constant current (CC)/constant voltage (CV)...
US20160007427 METHOD AND SYSTEM FOR ACTUATING LOADS CONNECTED TO A BUS SYSTEM  
A method for actuating loads connected to a bus system, in particular lamp operating devices, by at least one command generator which is likewise connected to the bus system. The actuation is...
US20160007426 PREDICTIVE DAYLIGHT HARVESTING SYSTEM  
In an example, an expected sky condition is calculated for a geographic location, a time of day, and a date based on a mathematical model. A predicted distribution of direct and interreflected...
US20160007425 ILLUMINATING DEVICES AND SYSTEMS  
Illuminating devices and systems are described herein. One illuminating device embodiment includes a computing component configured to determine a change in a state associated with a room in which...
US20160007424 ILLUMINATION AND GROW LIGHT SYSTEM AND ASSOCIATED METHODS  
A lighting system with selectable emission characteristics may include a housing, a controller, a first plurality of light sources operatively coupled to the controller and carried by the housing,...
US20160007423 METHODS AND APPARATUS FOR CONTROLLING LIGHTING  
Disclosed are methods and apparatus for lighting control. Presence of a lighting control element (110, 310, 312A-C, 510, 512, 610, 710, 915, 917) is identified over one or more LEDs (323, 327,...
US20160007422 SOLID-STATE SOURCES OF LIGHT FOR PREFERENTIAL COLOUR RENDITION  
Polychromatic light sources of white light, which have spectral power distributions composed of at least three different components, such as clusters of coloured light-emitting diodes (LEDs) or...
US20160007421 LIGHTING DEVICE AND METHOD FOR MANAGING A LIGHTING SYSTEM  
Lighting device including a plurality of lighting elements, at least one sensor receiving sensory stimuli from an establishment, and a control means connected with the at least one sensor and with...
US20160007420 LED LIGHTING DEVICE  
An LED lighting device comprises: a rectification circuit unit for receiving input power from a power source unit and outputting a rectified power; an LED unit having a plurality of LED channels...