Matches 1 - 50 out of 179 1 2 3 4 >


Match Document Document Title
DE112017005602T5 Covered electrical wire, electrical wire with a clamp, copper alloy wire and copper alloy strand  
A covered electric wire including a conductor and an insulation covering layer provided outside the conductor, the conductor being a strand composed of a strand of a plurality of copper alloy...
DE102019105660A1 Copper-based alloy  
A copper-based alloy containing Cu, Ni, Si, Fe, and Mg, and at least one selected from the group consisting of Mo, W, and V, and in which a content of Mg is 0.02 mass% or more.
DE112017005596T5 Sheathed power cable, terminated power cable, copper alloy wire, and copper alloy strand  
Provided is a sheathed power cable comprising a conductor and an insulation sheath layer provided outside the conductor, the conductor being a strand formed from a strand having a plurality of...
DE102014010711B4 Process for the thermal treatment of zinc-containing copper alloy strips  
Process for the annealing treatment, consisting of at least one heating and one cooling phase, of zinc-containing copper alloy strips, wherein the strip material is transported into and through at...
DE112016007415T5 Coated electrical wire, with connection provided electrical wire, copper alloy wire and copper alloy strand wire  
A coated electrical wire comprises a conductor and an insulating coating layer on an outside of the conductor, the conductor being a stranded wire composed of a strand of a plurality of copper...
DE112017005081T5 Hot extruded material for cylindrical sputtering target and method of making a cylindrical sputtering target  
Provided is a hot-extruded material for a cylindrical sputtering target in which a purity of copper is in a range of 99.99 mass% to 99.9995 mass%, an Al content is 0.5 mass ppm or lower Si content...
DE112010001811B4 Cu-Ni-Si-Mg alloy with improved conductivity and bendability  
Cu-Ni-Si-Mg alloy containing 1.0 to 4.5 mass% Ni, 0.16 to 1.13 mass% Si, 0.05 to 0.30 mass% Mg and the balance of copper and unavoidable impurities, wherein the alloy comprises Ni-Si-Mg...
DE112018000061T5 Bonding wire for semiconductor device  
The present invention provides a bonding wire for a semiconductor device which is suitable for modern high-density LSIs and vehicle-mounted LSIs by improving the formation rate of a Cu-Al-IMC in...
DE112017003058T5 Copper alloy bonding wire for semiconductor devices  
In a copper alloy bonding wire for semiconductor devices, the bonding longevity of a ball-bonded component is improved in high temperature and high humidity environments. The copper alloy bonding...
DE102017006970A1 Copper casting alloy and casting process  
The invention relates to a copper casting alloy having the following composition: P: 50-190 ppm by weight Mg: 20-350 ppm by weight Cu: balance and unavoidable impurities. Furthermore, the...
DE102005015467B4 Use of a copper-zinc alloy  
Use of a copper-zinc alloy as a material for a plain bearing, wherein the alloy is 59-73% copper, 2.7-8.5% manganese, 1.5-6.3% aluminum, 0.2-4% silicon, 0.2 - 3% iron, 0 - 2% lead, 0 - 2% nickel,...
DE112016005747T5 Bonding wire for a semiconductor device  
A bonding wire for a semiconductor device suitable as a bonding wire for in-vehicle devices has excellent capillary wear resistance and surface defect resistance while ensuring high bonding...
DE102008056965B4 Sliding bearing composite material with galvanically deposited sliding layer  
Sliding bearing composite material (2) with a carrier layer (4) made of steel and an insoluble applied thereon lead-free bearing metal layer (6) made of copper alloy, in particular...
DE102017105602B3 Sliding bearing composite material with a metallic support layer and a metallic bearing metal layer  
The invention relates to a sliding bearing composite material (2) having a metallic supporting layer (4) and a metallic bearing metal layer (6), wherein the bearing metal layer (6) is a sintered...
DE112015000124B4 Production process for cylindrical sputtering target material  
A method of manufacturing a cylindrical sputtering target material formed from copper or a copper alloy, the method comprising: a continuous casting step for casting a cylindrical billet having an...
DE202017100202U1 copper product  
Rolled copper product with a surface structure produced by rolling, characterized in that the surface structure appears uniform to the naked eye and is stochastically formed by rolling, wherein...
DE112009000731B4 Cu-Ni-Si-Co-Cr system alloy for electronic materials  
A copper alloy for electronic materials comprising 1.0 to 4.5 mass% Ni, 0.50 to 1.2 mass% Si, 0.1 to 2.5 mass% Co, 0.003 to 0.3 mass% % Cr, the balance being Cu and unavoidable impurities, the...
DE112016001847T5 Copper alloy wire and twisted copper alloy wire, coated electric wire and wire harness  
Provided are a copper alloy wire, a twisted copper alloy wire, a covered electric wire, and a wire harness which have high strength and excellent impact resistance. A copper alloy wire for use as...
DE102004053346B4 A method for forming a copper alloy sheet erweichungsbeständigen  
A method of forming a erweichungsbeständigen copper alloy sheet of a copper alloy containing Fe in a range of 0.01 to 4.0 wt .-%, and Fe in addition to optional P, and Zn in a content of in each...
DE102012022794B4 High-strength copper alloy sheet with excellent oxide film adhesion  
A high strength copper alloy sheet having excellent oxide film adhesion, the copper alloy sheet comprising Fe: 0.02 to 0.5% and P: 0.01 to 0.25%, in mass%, the balance being copper and unavoidable...
DE102012204967B4 Copper-based sliding material  
Copper-based sliding material, which comprises a steel backing layer (1) and a Cu-based alloy layer (2), the Cu-based alloy layer (2) consists of, as percent by mass, 6 to 12% Sn, 11 to 30% Bi, 0,...
DE112014006907T5 Copper containing conductive pastes and electrodes made therefrom  
Disclosed are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural...
DE112015003851T5 Copper alloy strips for use in an LED ladder frame  
This Cu-Fe-based copper alloy sheet comprises specific amounts of Fe, P, Zn and Sn, the remainder comprising substantially Cu and unavoidable impurities, the surface roughness in the direction...
DE112015003683T5 Copper alloy wire, copper alloy wire, covered electrical wire and clamped electrical wire  
A copper alloy wire may be used as a conductor. The copper alloy wire is formed of a copper alloy comprising: not less than 0.4 mass% and not more than 1.5 mass% Fe, not less than 0.1 mass%, and...
DE112015003625T5 Bearings for internal combustion engines and internal combustion engines, process and process for the production thereof  
The invention relates to a bearing (5) for internal combustion engines, which is provided with an iron - containing base material (10), on which a first layer (1) and a surface layer (2) of...
DE202016007550U1 Galvanized copper alloys with high strength and conductivity  
A binary Cu alloy containing Cu and X wherein X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag and P wherein the binary copper alloy has an ultimate tensile strength of at least...
DE102016114549A1 ABRASION-RESISTANT COPPER-BASED ALLOY, PLATFORM LAYER, AND VALVE SYSTEM AND ELEMENT FOR AN INTERNAL COMBUSTION ENGINE  
An abrasion-resistant copper-based alloy includes at least one selected from the group consisting of molybdenum, tungsten and vanadium, and niobium carbide; Chromium in an amount of less than 1.0%...
DE102015214314A1 Verfahren und Vorrichtung zur Ermittlung von Schadstoffen  
Die Erfindung betrifft ein Verfahren zur Ermittlung von Schadstoffen (S), wobei eine Messvorrichtung (1), umfassend zumindest eine elektrisch leitfähige Metall- oder Metalllegierungsschicht (4),...
DE112015001806T5 Elemental wire of copper alloy, copper wire braided wire and electrical wire for vehicles  
Elemental wire 1 made of a copper alloy has a chemical composition comprising: a total of at least 0.45 mass% and at most 2.0 mass% of at least one additive element selected from the group...
DE112015001296T5 High-strength, homogeneous copper-nickel-tin alloy and manufacturing processes  
A method for producing a high strength homogeneous copper-nickel-tin alloy with high strength comprises preparing a molten mixture of copper, nickel and tin; The pressurized casting of the molten...
DE112015001012T5 Twisted wire of copper alloy, manufacturing methods thereof and electrical lead for an automobile  
A casting material is formed, the casting material having a composition of chemical constituents containing at least one additive element selected from the group consisting of Fe, Ti, Sn, Ag, Mg,...
DE10117447B4 A die-cut copper alloy sheet and a process for producing the same  
A copper alloy sheet having excellent dieability comprising 0.2 to 0.3% by weight of Cr, 0.1 to 0.5% by weight of Sn, 0.1 to 0.5% by weight of Zn, and 0.005 to 0.1 By weight of Si, the remainder...
DE112014005905T5 Copper alloy wire, Kupferlegierungslitze, electric cables, electric cable provided with clamp and method for manufacturing copper alloy wire  
Provided with: a copper alloy wire having excellent electrical conductivity, high strength and excellent elongation; a Kupferlegierungslitze containing the copper alloy wire; an electric cable,...
DE102015001293A1 Connecting element, in particular screw or nut  
The invention relates to a connecting element (4, 5), in particular a screw (4) or a nut (5), for mechanical connection of building components (1, 2), wherein the connecting element (4, 5) at...
DE112015000124T5 Manufacturing method of a cylindrical sputtering target material  
A manufacturing method for a cylindrical sputtering target material formed of copper or a copper alloy is indicated, the method comprising: a continuous casting step of casting a cylindrical ingot...
DE102014018061A1 A metallic composite material and manufacturing method  
The invention relates to a metallic composite material, consisting of a precipitation hardening copper alloy with a copper content of at least 95 wt .-% as the matrix and in the matrix embedded...
DE112015000125T5 Cylindrical sputtering target material  
Indicated is a cylindrical sputtering target material formed of copper or a copper alloy, wherein an average value of the special grain boundary length ratios LσN/ LNMeasured with respect to the...
DE102014217570A1 Slide bearings or part thereof, of the same process for the preparation and use of a CuCrZr alloy as a sliding bearing material  
The present application relates to a sliding bearing or a part thereof and a method for producing the same, characterized in that the sliding bearing at least partly consists of a CuCrZr alloy, as...
DE102014010711A1 A method of operating a heat treatment plant for copper alloy ribbons  
The invention relates to a method for operating a heat treatment plant for copper alloy ribbons, wherein said band material is transported into and through at least a heating zone and heated in...
DE102014010235A1 Use of a composite material for the manufacture of electrode caps and the electrode cap  
The invention relates to the use of a composite material for the production of electrode caps 1, produced by plastic deformation and / or machining of the composite material, which is provided in...
DE112013006671T5 Copper alloy wire, copper alloy Litzendrat, sheathed electric wire and provided with end pieces electrical wire  
An object of the present invention is to provide an ultrafine copper alloy wire having high strength and conductivity, which also has superior elongation, of a copper alloy stranded wire, a...
DE102014207332A1 Lead Free CuFe2P bearing material with chip breaker  
The present invention relates to a bearing material with a matrix material composed of 2.1-2.6 wt .-% iron, 0.05 to 0.2 wt .-% zinc, 0.015 to 0.15 wt .-% phosphorus ≤ 0.03 wt .-% lead, ≤ 0.2 wt...
DE102014019153A1 Copper alloy for electric and electronic parts  
A Cu-Cr-Ti-Si alloy for electric and electronic parts comprising Cr: 0.15-0.4 mass%, Ti: 0.005-0.15 mass% and Si: 0.01-0.05 mass -%, with the balance consisting of Cu and unavoidable impurities,...
DE202015102846U1 Boron-oxygen-containing one-way wire-cut wire  
Boron-oxygen-containing disposable cutting wire, characterized by a core material and a surface layer of material which encases the core material outwardly, wherein the alloy of the core material...
DE102013225939A1 A process for producing a composite component  
The invention relates to a method for producing a composite component as well as a composite component, said composite component is formed from a metal matrix composite of carbon fibers and a...
DE102013014501A1 copper alloy  
The present invention relates to a copper alloy, with shares in weight% of Iron (Fe)0.02 to 4.00,Phosphorus (P)0.01-0.50,and at least one element from the following group Sulfur (S)0.10 to...
DE102013014528A1 alloy  
The present invention relates to novel solder alloys containing copper, silver, zinc, manganese and tin.
DE102013208497A1 Copper alloy, use of a copper alloy bearing having a copper alloy and process for producing a bearing from a copper alloy  
The invention relates to a copper alloy comprising hard particles and solid lubricants. Further, use of these copper alloy for a bearing and a bearing is described with this copper alloy. Next,...
DE102013007274A1 Copper alloy for asynchronous  
The invention relates to a copper alloy having the following composition in weight%: 0.05 to 0.5%, of at least three elements from the group, consisting of Ag, Zn, Ni, Sn and Al, the remainder...
DE102014001928A1 Copper alloy strips for a leadframe of a LED  
There is a lead frame, which is made of a copper alloy strip, Cu-Fe base, provided to improve the heat dissipation in the LED package. A reflective Ag-plating film which is formed on the lead...

Matches 1 - 50 out of 179 1 2 3 4 >