Matches 1 - 50 out of 105 1 2 3 >


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DE102019211058A1 cutter  
A cutting device has a blade changing unit that detaches an old cutting blade from a blade attachment and attaches a new cutting blade to the blade attachment. The blade changing unit has a blade...
DE102018212588A1 Wafer processing method  
A cutting method is provided. The cutting method includes: a holding member arranging step for arranging a dividing band on a back surface of a wafer; a holding step of holding the wafer to a...
DE102010013253B4 Process for structuring CIGS thin-film solar cells  
A method for structuring CIGS thin-film solar cells, in which a plurality of superimposed layers are first formed on a substrate, which are subsequently removed again in sections with a rotating...
DE112009000187B4 Circular grinding apparatus and method for grinding  
A pair of clamps for holding both end faces of the ingot in a vertical direction, rotating means for driving the turning of the ingot about an axis of the center, and a grinding wheel, The...
DE19947015B4 A method for cutting and separating a bent CSP plate with considerable bending into individual small parts  
A method of cutting and separating a bent CSP plate (10) with substantial bending into individual small parts by means of a cutting machine (13) having at least one clamping table (14) for holding...
DE10010865B4 A method for cutting a laminated workpiece  
A method for cutting a laminated workpiece (10) with thin, flat, at different levels of its thickness arranged crosswise strips with a cutting machine (1) comprising at least: a clamping plate (4)...
DE10222851B4 slicer  
Cutting machine, comprising: A housing (2) with an operator panel (28), which is arranged on a front side thereof; and whereina clamping zone (B), which is arranged in a widthwise taken middle, a...
DE10391795B4 A method for machining and dicing of a semiconductor wafer  
A method of processing a semiconductor wafer (2), which circuits (22) in a plurality of regions, which are divided on the front surface by a plurality of streets (21), and a cover layer (23) on...
DE10133448B4 Alignment method and apparatus for aligning a cutting blade in a dicing machine  
Alignment method for aligning a selected path and a cutting blade relative to each other for cutting a workpiece, having a plurality of chip areas, which are defined by a plurality of webs which...
DE102010040535A1 A method for cutting a workpiece  
The present invention relates to a method for cutting a workpiece (10), in particular a silicon workpiece, in which a saw tool (12) along the workpiece (10) is displaced, wherein the sawing tool...
DE102004044946B4 A method for separating a semiconductor wafer  
A method for separating a semiconductor wafer (10), wherein the semiconductor wafer (10), are on the front side thereof formed several delimited by webs semiconductor chip (11) is separated into...
DE112009000187T5 Cylindrical grinding apparatus and method for grinding  
Cylindrical grinding device comprising at least a table on which a cylindrical ingot is placed in a longitudinal direction, a pair of clamps for holding both end faces of the ingot in a vertical...
DE10121502B4 A method for dividing a semiconductor wafer  
A method for dividing a semiconductor wafer (2), of which the surface comprises a plurality of chips (3), which are divided by lines (4) having formed thereon a metal layer (4a) into individual...
DE10043212B4 cutting process  
Cutting method for cutting a workpiece (11) by moving the workpiece (11) relative to a cutting blade or cutting edge (54) having an annular cutting edge or cutting edge (542) and rotates in a...
DE10030183B4 slicer  
Slicer comprising mounting support Kassettenabstützeinrichtungen means and methods of (10) which are arranged in a cassette support portion or -lagerbereich (A), for supporting a holder or...
DE10044463B4 Dicing process  
, Which is mounted Plättchenschneid- or punching process of cutting a semiconductor wafer or chips or -plättchens or disk (11) on a frame (111) via a belt (112) and having a plurality of first...
DE10027086B4 Magnet member cutting method and magnetic element cutter  
Magnet member cutting method, comprising: a first step of preparing a cutting blade (30) having a Base disc (34) made of a hard metal alloy and a cutting edge (36) an abrasive grain (36a) and a...
DE102008026918A1 Cutter with ultrasonic transducers  
A Cutting means comprises a blade holder, the first one Ultrasonic transducer for emitting ultrasonic vibrations to a cutting knife supports. The blade holder has an annular flange on which a...
DE10029239B4 Apparatus for processing magnetic components and device for treating waste liquid  
device (10) for processing a magnetic member (54), comprising: - A processing device for grinding of the magnetic member (54), which grinding device a and a supply means (56) for supplying...
DE10117923B4 Semiconductor wafer cutting machine  
slicer full: a jig for holding a semiconductor wafer, to which cut; a cutter for Cutting the clamping device held on the semiconductor wafer; a first moving means for moving the clamping device...
DE10116791B4 "A process for producing a large number of semiconductor chip S from a semiconductor wafer"  
process to produce a large Number of semiconductor chips from a semiconductor wafer (2) which a big Number of rectangular areas (10), through which streets (8) are defined, which on the front...
DE10019601B4 Layer composite material for sliding elements and for plain bearings, particularly crankshaft bearing, camshaft bearings or connecting rod bearings, comprises primary layer made from copper alloy or aluminum alloy  
A layer composite material comprises a primary layer made of copper alloy or an aluminum alloy, where the primary layer is applied on surface of a sliding element. A sliding layer is directly...
DE10103592B4 Saw for dividing materials into thin slices, in particular for cutting wafers from silicon  
Saw for cutting of materials in thin Discs, particularly for cutting wafers from silicon, with at least one rotary saw tool as a separating member, said saw tool for the Dividing the material into...
DE10136534B4 Wafer Cutting Machine  
Wafer Cutting Machine (1) with two coaxially arranged to each other, rotatable spindles (1, 2) each having at its end a cutting disc (3, 4) wear and relative to a with a wafer (7) equippable work...
DE10234494B4 Apparatus and method for compensating for axial displacements and vibrations to a shaft means of a cutting machine  
device to compensate for axial displacements and vibrations at a Shaft means (10) of a cutting machine, said shaft means (10) at least a spindle (11); a cutting tool (12), which is connected to...
DE10135790B4 Fine grain cemented carbide and its use  
Fine-grained, Chromium-containing cemented carbide consisting of a first Phase based on tungsten carbide (WC), the second by means of a Phase of a metallic binder based on Co or CoNiFe is bound,...
DE10352562A1 Industrial processing device for separating a printed circuit board panel has an electric motor to drive a separating tool  
A separating tool like a cutting-off wheel (COW) (3) separates or cuts a printed circuit board panel into parts. With a thickness less than 0.6 mm, preferably equal to/less than 0.2 mm, the COW...
DE102004044946A1 Verfahren zum Trennen eines Halbleiterwafers  
Um die Streuung winziger dreieckiger Endmaterialfragmente vom Außenumfangsrand eines Halbleiterwafers sowohl in einem Trennschritt als auch in einem Schleifschritt zu verhindern, so daß die...
DE102004038340A1 A method for dividing a plate-like workpiece  
On A method for dividing a plate-like workpiece comprises a layer of a different material is generated from that of a substrate and on the front surface of the substrate is formed along...
DE10391795T5 A method for processing a semiconductor wafer  
process for processing a semiconductor wafer, which circuits in a Plurality of areas comprising, on through a plurality of streets the front surface be divided, and a cover layer on the front...
DE102004003858A1 Processing apparatus, which is equipped with a rotatable or rotating tool  
A machining device comprises a rotatable spindle, which is rotatably mounted, a rotary drive source for rotationally driving the rotatable spindle, a rotary tool, which is mounted on the rotatable...
DE19833052B4 Method and apparatus for endpoint detection during chemical mechanical polishing  
Chemical mechanical polishing device for polishing a surface of a semiconductor wafer (103) comprising: a polishing table (111) for holding a polishing pad (109); a rotatable wafer chuck (101) for...
DE10296522T5 A process for producing a semiconductor chip  
A method for separating a semiconductor wafer into individual chips, each carrying an electric circuit structure, said semiconductor wafer having a plurality of chips are defined by intersecting...
DE10234494A1 Ausgleicheiseinrichtung and method for balancing axial Vorstell- and vibration possibilities in a rotating shaft device with a cutting tool  
The invention relates to an internal active balancing device and a method for compensating for axial displacements and vibrations in a rotating shaft or spindle of a cutting tool, wherein the...
DE10139962C1 A method for cutting wafers from a hard brittle workpiece and wire saw for performing the method  
The invention is a method for cutting wafers from a hard brittle workpiece, which comprises subjecting the workpiece feed motion and pressed against the wires of a wire web of a wire, the wires...
DE10135790A1 Fine grained cemented carbide, process for its preparation and use  
It is proposed a fine-grained, chromium-containing cemented carbide based on WC and a binder based on Co or CoNiFe having at least one additional phase comprising at least one carbide or mixed...
DE10136534A1 Semiconductor wafer cutting machine uses 2 separation discs attached to coaxial spindles displaced axially to provide relative spacing corresponding to width of IC strip  
The wafer cutting machine has a pair of coaxial spindles (1,2), each fitted with a separation disc (3,4) mounted on a hub (5,6) and displaced relative to a work table (8) on which a semiconductor...
DE10222851A1 cutting machine  
A cutting machine has two cutting means or devices. In a front half of a housing, a chucking zone is arranged in a center taken in the width direction. A cassette placement zone is disposed on one...
DE10103592A1 Clamping and moving arrangement for cutters has rotating carrier on which thin linear saw tools are clamped  
The clamping and moving arrangement for cutting expensive material such as semiconductor materials has thin and linear saw tools (1) clamped to a rotating carrier (3), which has collars at its...
DE10055286A1 Monocrystal separating device based on annular sawing has device to supply gas to cutting disk  
The separating device comprises a cutting disk (2) with cutting edge (3), rotating to cut the monocrystal (1). A positioning device positions the monocrystal for cutting. Cutting fluid is also...
DE10052154A1 Method and apparatus for cutting single crystals, adjusting device and test method for determining an orientation of a single crystal for such a method  
The invention relates to a method for cutting single crystals, especially GaAs single crystals. According to the invention, a single crystal (1) to be cut into at least two parts and a cutting...
DE10133448A1 Alignment of cutting blade includes determining angle between tracks from workpiece surface image, determining correction angle per track, setting tracks parallel to x-axis  
The method involves forming an image of the surface of the workpiece to detect alignment points, storing track coordinates, determining the angle between first and second tracks, determining a...
DE10032963A1 Separation of thinner surfaces of semiconductor and ceramic substrates uses saw with electromagnetic forces to control separation thickness  
A method of separating thinner substrate surfaces, especially of semiconductor and ceramics, using an electrically conductive saw element (1) comprises controlling the separation of the saw from...
DE10121502A1 A method for dividing a semiconductor wafer  
A method of sharing or dividing a semiconductor wafer whose surface has a plurality of divided by streets chips into individual chips is characterized in that it comprises a Anzeichnungs- or Ritz...
DE10116791A1 "A process for producing a large number of semiconductor chip S from a semiconductor wafer"  
A method for producing a large number of semiconductor chips from a semiconductor wafer having a large number of rectangular areas or regions which are defined by streets or lines, which are...
DE10117923A1 Semiconductor wafer cutting machine  
A cutting machine comprises a clamping device for holding the semiconductor wafer which is to be cut, a cutting device for cutting the held on the chucking the semiconductor wafer, a first...
DE10019601A1 Production of polycrystalline rod involves depositing silicon on carrier rod, rotating polycrystalline silicon rod about a longitudinal axis and cutting rod through with parting tool  
A polycrystalline rod (1) is made by depositing silicon on a carrier rod to produce a polycrystalline silicon rod molding; rotating the polycrystalline silicon rod about a longitudinal axis; and...
DE10014445A1 Process for separating a semiconductor rod into a number of wafers comprises guiding a fluid on the surface of the rod and later in a cutting gap formed, and removing the dissolved reaction products with the fluid stream  
Process for separating a semiconductor rod into a number of wafers comprises: guiding a fluid which dissolves the semiconductor material in a chemical reaction at a rate of 1-200 m/s using a...
DE10044463A1 Dicing procedure for semiconductor wafer, involves rotating blade to align base with exposure area so as to form orthogonal cutting lines on wafer  
The cutting blade (54) is moved relative to the wafer (11) at regular intervals. The parallel lines (11a) are formed by cutting, along specific direction. The blade is rotated such that base (541)...
DE10040786A1 Rotation balancing mechanism for rotary cutting machine e.g. dicing machine for production of semiconductor chips, uses radial weight balancing screws fitted into threaded bores around cutting tool mounting flange  
The rotation balancing mechanism has at least 2 threaded bores extending in the radial direction provided at equi-spaced points around the periphery of the mounting flange for the cutting tool,...

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