Matches 1 - 50 out of 235 1 2 3 4 5 >


Match Document Document Title
DE102018008920A1 Scheibenförmiges Werkzeug und Verfahren zur Bearbeitung von Werkstücken, Trennvorrichtung sowie Verwendung einer Trenn-, Schleif- und Polierscheibe zum Erzeugen einer Oberflächenstruktur auf einem Werkstück  
Die Erfindung betrifft ein scheibenförmiges Werkzeug, ein Verfahren zur Bearbeitung von Werkstücken, eine Trennvorrichtung und eine Verwendung einer Trenn-, Schleif- und Polierscheibe als Werkzeug...
DE112009001446B4 Process for cutting a workpiece  
Method for cutting a workpiece into wafers by pressing a cylindrical workpiece held with a workpiece holder against a row of wires, which is fastened by one of a plurality of wire guides which can...
DE112012001312B4 Method of resuming the operation of a wire saw and wire saw  
A method of resuming the operation of a wire saw, in which cutting of a workpiece is suspended and then resumed, the operation including the processes: imparting an axial reciprocating motion with...
DE102018004651A1 Ripper  
A ripper for separating portions of predetermined length from a rod-shaped or base-shaped base material has a cutting-disk device with at least one rotary-driven cutting disk. The cutting-off...
DE102013225104B4 Method for separating slices from a workpiece by means of a wire saw  
A method of sawing a plurality of disks from a workpiece by means of a wire saw of a wire saw consisting of many parallel wire sections, the wire gate being clamped by at least two wire guide...
DE112018001068T5 Method of cutting an ingot  
The present invention is a method for cutting an ingot with a wire saw, comprising: forming a wire row through a wire spirally wound between a plurality of wire guides and configured to move in an...
DE102019205492A1 SHAPING PROCESS FOR CUTTING BLADES  
A method of forming a cutting blade includes a modified layer forming step for forming a plurality of modified layers at different heights in a dressing element by irradiating the dressing element...
DE102019202203A1 ADJUSTMENT PROCESS FOR A WATER TEMPERATURE FOR A MACHINING DEVICE  
A water temperature setting method for a machining apparatus for machining a workpiece held by a holding table by rotating at a high speed a spindle with a machining tool attached thereto and...
DE112017005669T5 GRINDING GRINDERS, ASSESSMENT METHOD AND WASHER MANUFACTURING METHOD  
Provided are abrasive grains wherein the quality of a wafer severed by a wire saw can be stabilized, a method of evaluating the abrasive grains, and a wafer manufacturing method comprising dicing...
DE102019201317A1 RINGERED GRINDING STONE AND METHOD OF MANUFACTURING A RINGED GRINDING STONE  
An annular grindstone includes a grindstone portion in which abrasive grains are fixed with a bonding material containing nickel, and has a through hole in its center. The grindstone portion has a...
DE102019101742A1 Metal wire, saw wire, cutting device and method of making the metal wire  
There is provided a tungsten-containing metal wire. The tungsten content of the metal wire is at least 90% by weight. The tensile strength of the metal wire is at least 4000 MPa. The elastic...
DE202019101627U1 Auxiliary device for separating a segment from a rotor and / or stator of a turbomachine, and tool system  
Auxiliary device for separating a segment from a rotor (1) and / or stator of a turbomachine, comprising a first cutting template (20) and a second cutting template (30) and a bearing block (40),...
DE102017122331A1 Grinding and / or cutting tool and method for grinding and / or cutting  
The invention relates to a grinding and / or cutting tool which has at least one surface area for side grinding and a surface area for peripheral grinding and / or cutting. According to the...
DE112008002790B4 Wire sawing  
A wire saw, comprising: a wire (2) wound around a plurality of serrated rollers (3) and moving axially in a reciprocating direction; a nozzle (15) for supplying a slurry to the wire; and a...
DE102018213582A1 Cutting blade and attachment mechanism for a cutting blade  
A cutting blade is attached to a fixed flange having a cylindrical blade attachment section. The cutting blade includes an annular blade main body having an outer periphery serving as a cutting...
DE202018005258U1 Disk-shaped tool for machining workpieces, separating device and use of a separating, grinding and polishing disc for producing a surface structure on a workpiece  
Disk-shaped tool (1), at least for rotating (D) cutting workpieces with axial feed (VR), with 1.1 separating blades (5) in a radially outer peripheral region (3), 1.2 two opposite disc edges (4)...
DE102018209869A1 Ring-shaped whetstone  
An annular grindstone is provided which includes a cutting edge having a plurality of V-shaped slots provided in an outer circumferential portion thereof. Each of the V-shaped slots is defined by...
DE112017001555T5 A method of manufacturing a wire saw apparatus and wire saw apparatus  
The present invention provides a method of manufacturing a wire sawing apparatus comprising a wire feeding reel; a long role; Wire guides; a wire take-up reel; and a tensioner arm controlled to...
DE202018105196U1 separating device  
Separating device with a housing (28), a in the housing (28) mounted, driven disc-shaped separating tool (10) for separating a workpiece (12), wherein on a peripheral side of the separating tool...
DE112016004787T5 Semiconductor wafer processing method  
Disclosed is a semiconductor wafer processing method wherein a thin wafer-like wafer is first prepared by cutting a semiconductor single crystal ingot (cutting step), then forming a planarized cap...
DE102018202621A1 Supply device for a machining fluid  
A processing liquid supply apparatus includes: a reservoir including an additive to be added to a liquid flowing through a passage connected at one end to a liquid supply source and connected to a...
DE102018202403A1 CUTTING BLADES AND CUTTING DEVICE  
Disclosed herein is an electrodeposited cutting blade having a cutting edge incorporating superabrasive grains. The cutting edge further includes filler particles formed from a silicone-based...
DE102017202314A1 Wire saw, wire guide roller, and method of simultaneously separating a plurality of disks from a rod  
The invention relates to a method for simultaneously separating a plurality of disks from a rod by means of a structured saw wire, wherein the patterned saw wire is guided by grooves of two wire...
DE212016000231U1 grinding machine  
Grinding machine (1), comprising: a motor (12), a housing (4, 6) for receiving the motor (12), a spindle (24) protruding from the housing (4, 6) and driven by the motor (12) rotates within the...
DE112016004172T5 Method for cutting a workpiece and wire saw  
which is 1/3 or more and 2/3 or less of a length of from the start of cutting, when the workpiece and the wire field begin to touch each other, until the end of cutting the workpiece fed wire is...
DE112016002951T5 Workpiece holder and method for cutting a workpiece  
and the workpiece holder can adjust inclination in the y-axis direction of the workpiece held by the workpiece plate by inclining the workpiece plate in the y-axis direction and fixing the...
DE202017107617U1 Depth stop for a cutting cutter  
Depth stop (1) for a rotary-driven, removable cutting disc (14) having separating cutter (9), with a central recess (2) as an axle for the drive axis of the cutting cutter (9), and with a stop...
DE112016002902T5 Wire saw apparatus and workpiece cutting method  
The wire saw apparatus includes at least one wire 11 provided tautly so as to be capable of moving in a direction crossing a workpiece W to be cut, a workpiece holder 12 configured to hold the...
DE112016001209T5 Wire sawing  
The present invention provides a wire saw apparatus comprising: a wire string formed of a wire wound around a plurality of wire guides and reciprocating in an axial direction; a nozzle from which...
DE112015005813T5 A method of evaluating abrasive grains and methods for manufacturing a silicon wafer  
An evaluation method of abrasive grains, which is used in an ingot-cutting slurry, comprising: a review solution-preparation step (S1), are dissolved in the abrasive grains comprise polishing...
DE102016102218A1 Ripper  
The invention relates to a cutting machine with a rotating cutting disk to perform separating cuts in a workpiece and a workpiece positioning device for such a tapping machine. The cutting machine...
DE102016226180A1 Wafer processing method  
And measuring the positional relationship between the positions of the cutting groove and a predetermined cutting position. Accordingly, a check of the cutting groove can be performed without...
DE112015001156T5 Process for cutting a workpiece and process liquid  
The present invention is a method for cutting a workpiece comprising: forming a wire row by a wire spirally wound between a plurality of wire guides and running in an axial direction, and pressing...
DE112015002107T5 Wire with fixed abrasive grain, wire saw and method for cutting a workpiece  
The present invention relates to a fixed abrasive wire including a core wire and abrasive grains fixed to a surface of the core wire, an abrasive grain density being 1200 grains / mm2 Or more, the...
DE102016208606A1 Processing system  
There is provided a machining system comprising a machining apparatus having functional units including a holding unit holding a workpiece by a supporting surface, a machining unit which is...
DE102016208188A1 Cutting device  
A cutting apparatus includes: a first pipe for connecting a suction surface to a first suction source; A branched pipe through which the first pipe is branched to an upper outlet for passage to...
DE112014006394T5 Silicon wafer manufacturing process and silicon wafer  
A silicon wafer manufacturing method includes a wire advancing step in which a plurality of main rollers around which a corrugated wire (7) is wound are rotated into a spiral shape so that the...
DE102016204616A1 A method for checking a cutting blade  
A method of testing a cutting blade with a cutting edge, which is made of abrasive grains of selected abrasive grain diameters, which are joined by a binder, formed, comprises a cutting step for...
DE112014005293T5 Silicon carbide ingot and process for producing a silicon carbide substrate  
A silicon carbide ingot (1) comprises an end face (1a) and an end face (1b) opposite the end face (1a). In the silicon ingot (1), the first end surface (1a) and the second end face (1b) facing in...
DE112014005468T5 cutting process  
The present invention is a cutting method of cutting a silicon ingot with a wire saw comprising the displacement of a plurality of wire guides wound wire in a running motion and pressing the...
DE112014005470T5 A method for cutting the workpiece and the workpiece holder  
The present invention is a method for cutting a workpiece, includes the following: measuring a Kristallachsausrichtung while a workpiece with a workpiece holder is held, adjusting the workpiece...
DE102016200971A1 Cutting blade with cutting edge comprising photocatalyst particles  
There is disclosed a cutting blade for cutting a workpiece. The cutting blade comprises a base and a cutting edge, which is attached to a peripheral portion of the base. The cutting edge is formed...
DE112014004799T5 A method for in-slicing of blanks  
The present invention provides a method for in-slicing of blanks ready, wherein a wire, which was used in the previous In slicing a blank, for in-slicing of a following blank during in-slicing of...
DE102015226375A1 processing apparatus  
A processing apparatus includes a chuck for holding a workpiece, a processing unit for processing the held on the chuck a workpiece, a feed unit to the relative feeding of the chuck table and the...
DE112014003483T5 Method for In-slicing ingots and wire saw  
The present invention provides a method for in-slicing an ingot prepared with wire lines are formed using a wire which is spirally wound between several wire guides and moves in the axial...
DE102014017547A1 A process for producing singly or multiply curved contours with a truncated cone or doppelkegelstumpfförmigem tool  
A method of producing singly or multiply curved contours with a rotating rigid blade that umfangsnah at least on one side has a substantially truncated cone-shaped, convex cutting surface, the...
DE202016102268U1 Ripper  
Cutting machine (10) for machining workpieces (80) with a rotating cutting disc (22), comprising a cutting disc (22) and a drive motor for driving the cutting disc (22), a worktable (32) for...
DE202016101763U1 Rotary machine  
Rotary working machine comprising a spindle, which is rotationally driven by a driving source about a central axis; a rotary member which is provided with an opening and is fixed in a state in...
DE10248866B4 Hand tool  
Hand tool, in particular hand-guided angle grinding machine (10), with a an electric motor drive for a tool, in particular for a grinding or cutting disc (14), receiving the motor housing (11) and...
DE112014000276T5 Method for processing of semiconductor wafers  
In a Waferprozessierungsverfahren through which, by use of a flat surface as a reference surface, which by applying a curable material to the whole of a surface of a wafer, which is obtained by...

Matches 1 - 50 out of 235 1 2 3 4 5 >