Title:
METHOD OF ACTIVATING SURFACES FOR ELECTROLESS PLATING
Kind Code:
B1
Abstract:
Abstract of EP0043485
1. Process for activating metallic and non-metallic surfaces for the purpose of currentless metal deposition, characterized in that a) the surface to be metallized is wetted with an organometallic compound from the series comprising butadiene palladium dichloride, diacetonitrile palladium dichloride, diacetonitrile platinum dichloride and dibenzonitrile palladium dichloride, which compound is stable towards air and moisture and is dispersed in an organic solvent, b) the organic solvent is removed and c) the organometallic compound adhering to the surface to be metallized is reduced.
1. Process for activating metallic and non-metallic surfaces for the purpose of currentless metal deposition, characterized in that a) the surface to be metallized is wetted with an organometallic compound from the series comprising butadiene palladium dichloride, diacetonitrile palladium dichloride, diacetonitrile platinum dichloride and dibenzonitrile palladium dichloride, which compound is stable towards air and moisture and is dispersed in an organic solvent, b) the organic solvent is removed and c) the organometallic compound adhering to the surface to be metallized is reduced.
Inventors:
Giesecke, Dr. Henning
Wolf, Dr. Gerhard Dieter
Ebneth, Dr. Harold
Wolf, Dr. Gerhard Dieter
Ebneth, Dr. Harold
Application Number:
EP19810104782
Publication Date:
05/15/1985
Filing Date:
06/22/1981
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Export Citation:
Assignee:
BAYER AG
International Classes:
C23C18/18; C23C18/18; C23C18/20; C23C18/30; (IPC1-7): C23C18/18; C23C18/28
European Classes:
C23C18/30