Heat sink
United States Patent D827589

Bando, Seiji (Hyogo, JP)
Moriyama, Hirotake (Hyogo, JP)
Application Number:
Publication Date:
Filing Date:
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
D13/179, 438/122
View Patent Images:
US Patent References:
D804434Electronic component heatsink assemblyDecember, 2017LuD13/179
D805042Combined heat exchanger base and embedded heat pipesDecember, 2017HuangD13/179
D798831Cooling device for an electronic component heat sinkOctober, 2017AnzaiD13/179
D800677Heat sinkOctober, 2017OndaD13/179
D793350Heat sinkAugust, 2017KenchappaD13/179
D793400Heat sink for memory moduleAugust, 2017LinD13/179
D786202Heat sink for a light-emitting diodeMay, 2017HodrinskyD13/179
D786807Heat sinkMay, 2017MurphyD13/179
D787455Loudspeaker heat sinkMay, 2017PlinerD13/179
D762181High bay LED deviceJuly, 2016LinD13/179
D755740Heat sinkMay, 2016ChenD13/179
D747278Heat sinkJanuary, 2016MurphyD13/179
D726131Heat sink for light-emitting diodes (LED)April, 2015ZhaiD13/179
D726132Heat sink for light-emitting diodes (LED)April, 2015ZhaiD13/179
D717745Heat sinkNovember, 2014SchubertD13/179
D715749High performance high power tower heat sinkOctober, 2014MiraD13/179
D698740Heat sinkFebruary, 2014SchubertD13/179
D672728Heat sinkDecember, 2012LinD13/179
D673124Heat sinkDecember, 2012LinD13/179
D661259Heat sinkJune, 2012LayevskyD13/179
D645829Heat sinkSeptember, 2011YuD13/179
D626094Heat sink unit for use with a removable LED light moduleOctober, 2010AlexanderD13/179
D604255Heat sinkNovember, 2009KingD13/179
D601515Heat sinkOctober, 2009Meyer, IVD13/179
D570302Axial-flow mini heat sink moduleJune, 2008HorngD13/179
7144762Semiconductor device with pins and method of assembling the semiconductor deviceDecember, 2006So438/122
D509483Heat sinkSeptember, 2005WatanabeD13/179
D442566Heat sinkMay, 2001ChouD13/179
D275749Slip-on heat sink for long integrated-circuit modulesOctober, 1984McCarthyD13/179

Foreign References:
JP0641440December, 1984
JP2011054689March, 2011PAPER SHEET RADIATOR
Other References:
Communication dated Mar. 17, 2017, dispatched from the Intellectual Property Office of Taiwan in counterpart application No. 105305943.
Primary Examiner:
Shields, Rhea
Attorney, Agent or Firm:
Sughrue Mion, PLLC

1. The ornamental design for a heat sink, as shown and described.


1., 3.-4. Heat sink

1.1 : Front

1.2 : Back

1.3 : Top

1.4 : Bottom

1.5 : Left

1.6 : Right

1.7 : Top perspective view

1.8 : Bottom perspective view

1.9 : Cross-sectional

3.1 : Front

3.2 : Back

3.3 : Top

3.4 : Bottom

3.5 : Left

3.6 : Right

3.7 : Top perspective view

3.8 : Bottom perspective view

3.9 : Cross-sectional

4.1 : Front

4.2 : Back

4.3 : Top

4.4 : Bottom

4.5 : Left

4.6 : Right

4.7 : Top perspective view

4.8 : Bottom perspective view

4.9 : Cross-sectional

The articles are heat sink for heat release and cooling of electric and electronic equipment, such as television integrated circuits and lighting apparatus; reproduction No. 1.9 is a cross-sectional view sectioned vertically at the center of the right view No. 1.6; reproduction No. 3.9 is a cross-sectional view sectioned vertically at the center of the right view No. 3.6; reproduction No. 4.9 is a cross-sectional view sectioned vertically at the center of the right view No. 4.6.