Optical semiconductor element
United States Patent D826184

Nishio, Fumitaka (Hamamatsu, JP)
Kume, Makio (Hamamatsu, JP)
Application Number:
Publication Date:
Filing Date:
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
D13/180, D13/134, D14/371, D9/737, D26/122, D26/120, D26/141, D26/118, D26/1
View Patent Images:
US Patent References:
D805070LED displayDecember, 2017CaiD14/371
D805244Light guideDecember, 2017VasylyevD26/122
D805399PackageDecember, 2017TorchinD9/737
D800678Light emitting diodeOctober, 2017OmoriD13/180
D800679Light emitting diodeOctober, 2017OmoriD13/180
D796456Light emitting diode packageSeptember, 2017LeeD13/180
D794582LED chipAugust, 2017ZhangD13/180
D795492Mold for packaging semiconductor light emitting deviceAugust, 2017KimD26/120
9634209Miniature surface mount deviceApril, 2017Chan
9620693Light emitting device and lighting system having the sameApril, 2017Yoon
D783547LED packageApril, 2017BergmannD13/180
D778849Light emitting diode chipFebruary, 2017MaruyamaD13/180
D773724Cordless LED lampDecember, 2016Shiening WangD26/141
D763206Light emitting diode packageAugust, 2016LinD13/180
D763805Light emitting diode chipAugust, 2016HuangD13/180
D761215Package for light-emitting diodeJuly, 2016ShiD13/180
D758976LED packageJune, 2016ReiherzerD13/180
D757664Light emitting diodeMay, 2016ChuD13/180
D753612Light emitter deviceApril, 2016HussellD13/180
D750578Light emitting diodeMarch, 2016Chu et al.
D742554Lighting unitNovember, 2015KanemaruD26/1
D741821LED componentOctober, 2015SongD13/180
D737784LED componentSeptember, 2015SongD13/180
D738832Light emitting diode (LED) packageSeptember, 2015HussellD13/180
D735683LED packageAugust, 2015ReiherzerD13/180
D731989Light emitting diode chipJune, 2015HuangD13/180
D728480LED lamp holderMay, 2015ChangD13/134
D728493Light-emitting diode lead-frameMay, 2015LinD13/180
D730303LED chipMay, 2015ChouD13/180
D725613LED packageMarch, 2015LowesD13/180
D697876Light emitting diode lead-frameJanuary, 2014HsuD13/180
D693317Light-emitting diodeNovember, 2013KobayashiD13/180
D693781Light-emitting diodeNovember, 2013KobayashiD13/180
D671674LED lampNovember, 2012ChoD26/118
D654032Package of a light emitting diodeFebruary, 2012YuD13/180
D647864Light emitting diode carrierNovember, 2011HuangD13/180
D626922Light-emitting diodeNovember, 2010WadaD13/180
D627314Light-emitting diodeNovember, 2010LaiD13/180
D626097Light-emitting diodeOctober, 2010TakeuchiD13/180
D585850Light-emitting diode (LED)February, 2009WonD13/180
D576115Light-emitting diodeSeptember, 2008ChoiD13/180
D574994Lighting fixtureAugust, 2008BoyerD26/120
D568834Light-emitting diode for illuminating an objectMay, 2008NishidaD13/180
D511328Light-emitting diodeNovember, 2005WangD13/180
D512029Light-emitting diodeNovember, 2005KimD13/180
0750578N/AJanuary, 1904Bostwick et al.

Foreign References:
JP1295912March, 2007
JP1344216November, 2008
JP1563811November, 2016
JP1563910November, 2016
TW122714May, 2008
TW143792November, 2011
TW163532October, 2014
Primary Examiner:
Shields, Rhea
Attorney, Agent or Firm:
HASEGAWA Yoshiki (Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-ku Tokyo 100-0005)

1. The ornamental design for an optical semiconductor element, as shown and described.


1. Optical semiconductor element

1.1 : Top perspective view

1.2 : Bottom perspective view

1.3 : Front

1.4 : Back

1.5 : Top

1.6 : Bottom

1.7 : Left

1.8 : Right

1.9 : Sectional view

1.10 : Sectional view

1.11 : Reference view showing the state in use

The each article has a board part, a transparent sealing resin part and a light-shield sealing resin part; the board part has a circular entrance window in the center; the transparent sealing resin part covers an upper surface of the board part; the light-shield sealing resin part encapsulating a semiconductor light receiving element is positioned underneath the board part; the bottom center of the transparent sealing resin part is protruded and engaged with the circular entrance window part of the board part; the article can be mounted onto a mount board; the parts shown as solid lines are parts for which design registration is sought; the lines consisting of alternating long and short dashes in the drawings only indicate lines dividing our inventive design claimed herein from other parts which are not claimed; the parts for which design registration is sought are a lower part of the transparent sealing resin part including the protruding part, and the board part including the circular entrance window part; the transparent sealing resin part of the article is transparent; reproduction 1.9 is a cross-sectional view through the center of reproduction 1.5, and reproduction 1.10 is a cross-sectional view through the upper semicircular electrode parts of reproduction 1.5.

In the reproductions, the dash-dot-dash broken lines are for the purpose of illustrating the boundaries of the claimed design. The evenly spaced broken lines are for the purpose of illustrating environment only and form no part of the claimed design.