Title:
Optical semiconductor element
United States Patent D825500


Inventors:
Nishio, Fumitaka (Hamamatsu, JP)
Kume, Makio (Hamamatsu, JP)
Application Number:
35/502666
Publication Date:
08/14/2018
Filing Date:
09/21/2016
Assignee:
HAMAMATSU PHOTONICS K.K. (Shizuoka, JP)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
D13/180, D13/134, D13/182, D13/158, D14/371, D9/737, D16/134, D26/122, D26/118, D26/138, 257/692, 257/676, 257/89, 257/666, 257/98, 257/99
View Patent Images:
US Patent References:
D809467SwitchFebruary, 2018AmanoD13/158
D810354Light assemblyFebruary, 2018FarnsworthD26/122
D806659Solder padJanuary, 2018ParekhD13/182
D805244Light guideDecember, 2017VasylyevD26/122
D805399PackageDecember, 2017TorchinD9/737
D803470Light protectorNovember, 2017Austin, IIID26/118
9698319LED package with lead terminals having protrusions of differing widths and method for fabricating the sameJuly, 2017Lee
D761215Package for light-emitting diodeJuly, 2016ShiD13/180
D759603Chamber of charged particle beam drawing apparatusJune, 2016SaitoD13/182
D741821LED componentOctober, 2015SongD13/180
D737784LED componentSeptember, 2015SongD13/180
D738834Driver circuit integrated LED moduleSeptember, 2015XieD13/182
D729858LensMay, 2015ImaiD16/134
D727273Light emitting diodeApril, 2015OkaD13/180
D722298Chamber of charged particle beam drawing apparatusFebruary, 2015SaitoD13/182
D721339Light emitter deviceJanuary, 2015HussellD13/180
8866182LED package module structureOctober, 2014Wang257/99
D713595Light fixtureSeptember, 2014LechtenbergD26/118
D713804Light emitting diode (LED) package with multiple anodes and cathodesSeptember, 2014BrittD13/180
D709042Light emitting diode packageJuly, 2014CaiD13/180
D707877Tall mount screenJune, 2014TurnerD26/118
8669572Power lamp packageMarch, 2014Leung257/98
D693517Light moduleNovember, 2013DavisD26/138
8368112Aligned multiple emitter packageFebruary, 2013Chan257/666
D674361LED packageJanuary, 2013LinD13/180
D665367Package carrierAugust, 2012YingD13/180
D650407Optical lensDecember, 2011ChangD16/135
8049230Apparatus and system for miniature surface mount devicesNovember, 2011Chan257/89
D646643Light emitting diodeOctober, 2011WuD13/180
D645419Light emitting diodeSeptember, 2011KuwaharadaD13/180
D638572LED lensMay, 2011LeeD26/113
D629368Light emitting diodeDecember, 2010ChouD13/180
D629561LED lamp moduleDecember, 2010KimD26/138
D626922Light-emitting diodeNovember, 2010WadaD13/180
D626097Light-emitting diodeOctober, 2010TakeuchiD13/180
D621798Light-emitting diode substrateAugust, 2010LuD13/180
7675145Apparatus, system and method for use in mounting electronic elementsMarch, 2010Wong257/676
7635915Apparatus and method for use in mounting electronic elementsDecember, 2009Xie257/692
D592160Light emitting diode (LED)May, 2009KangD13/180
D573114Light-emitting diodeJuly, 2008MinD13/180
D520965Light emitting diode for illuminating an objectMay, 2006OmataD13/180



Foreign References:
JP1295912March, 2007
JP1344216November, 2008
Primary Examiner:
Shields, Rhea
Attorney, Agent or Firm:
HASEGAWA Yoshiki (Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-ku Tokyo 100-0005)
Claims:
CLAIM

1. The ornamental design for an optical semiconductor element, as shown and described.

Description:

1. Optical semiconductor element

1.1 : Top perspective view

1.2 : Bottom perspective view

1.3 : Front

1.4 : Back

1.5 : Top

1.6 : Bottom

1.7 : Left

1.8 : Right

1.9 : Sectional view

1.10 : Sectional view

1.11 : Reference view showing the state in use

This article has a board part, a transparent sealing resin part and a light-shield sealing resin part; the board part has a circular entrance window in the center; the transparent sealing resin part covers an upper surface of the board part; the light-shield sealing resin part encapsulating a semiconductor light receiving element is positioned underneath the board part; the bottom center of the transparent sealing resin part is protruded and engaged with the circular entrance window of the board part; the article can be mounted onto a mount board; the parts shown as solid lines are parts for which design registration is sought; the lines consisting of alternating long and short dashes in the drawings only indicate lines dividing our inventive design claimed herein from other parts which are not claimed; the parts for which design registration is sought are lower parts of the side surfaces of the transparent sealing resin part including the protruding part, and the board part including the circular entrance window part; the transparent sealing resin part of the article is transparent; reproduction 1.9 is a cross-sectional view through the center of reproduction 1.5, and reproduction 1.10 is a cross-sectional view through the upper rectangular electrode parts of reproduction 1.5. In the drawings, the dash-dot-dot-dash broken lines are for the purpose of illustrating the boundaries of the claimed design. The evenly spaced broken lines are for the purpose of illustrating environment only and form no part of the claimed design.