Title:
Heat sink assembly
United States Patent D825498


Inventors:
Allin, Boyd Drew (Seattle, WA, US)
Stellman, Jeffrey Taylor (Seattle, WA, US)
Application Number:
29/610923
Publication Date:
08/14/2018
Filing Date:
07/17/2017
Assignee:
Oculus VR, LLC (Menlo Park, CA, US)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
D13/179, D13/122, D13/182
View Patent Images:
US Patent References:
D785578Substrate supporting arm for semiconductor manufacturing apparatusMay, 2017KimD13/182
20160131442HEAT SINK AND MOUNTING BRACKET ARRANGEMENTMay, 2016Huang165/76
20150330716BASE PLATE FIXING STRUCTURE FOR A HEAT DISSIPATING MODULENovember, 2015Chen165/104.26
20150192369VARIABLE THICKNESS HEAT PIPEJuly, 2015Rivera165/104.19
20140290908HEAT DISSIPATION MODULEOctober, 2014Wang165/80.2
20140182818HEAT SINKJuly, 2014Wang165/104.21
D708592Thermal deviceJuly, 2014AndreD13/179
20140102670HEAT DISSIPATING APPARATUSApril, 2014Tu165/104.26
20130077251HEAT SINK MOUNTING DEVICEMarch, 2013Yang361/709
20130077242FAN STRUCTURE AND ELECTRONIC DEVICE APPLIED WITH THE SAMEMarch, 2013Hsiao361/695
20130070419ELECTRONIC DEVICE WITH HEAT DISSIPATING MODULEMarch, 2013Yang361/700
20130070418HEAT DISSIPATION MODULEMarch, 2013Lee361/700
20110186269THERMAL MODULEAugust, 2011Yang165/104.26
7965512Heat-dissipation module and electronic device using the sameJune, 2011Huang165/104.33
D609198Back plate for a heat sinkFebruary, 2010HsuD13/179
7589972Electrical connector with clip mechanismSeptember, 2009Ma165/104.26
20080105410HEAT DISSIPATION APPARATUSMay, 2008Hwang165/104.33



Other References:
eBay, “New Genuine Toshiba CPU Heatsink C670 C675 C675D Series”, first sold on Jul. 1, 2017. (https://www.ebay.com/itm/H000026370-13N0-Y3A0W02-NEW-GENUINE-TOSHIBA-CPU-HEATSINK-C670-C675-C675D-SERIES/142315100462).
eBay, “HP EliteBook 11.6″ 2170p Genuine Laptop CPU Cooling Heatsink 693307-001 GLP*”, Accessed Jun. 4, 2018. (https://www.ebay.com/itm/HP-EliteBook-11-6-2170p-Genuine-Laptop-CPU-Cooling-Heatsink-693307-001-GLP/282691921487).
Primary Examiner:
Rivard, Jennifer
Assistant Examiner:
Rivas, April
Attorney, Agent or Firm:
Fenwick & West LLP
Claims:
CLAIM

1. The ornamental design for a heat sink assembly, as shown and described.

Description:

FIG. 1 is a perspective view of a heat sink assembly, showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.