Title:
Contact wafer
United States Patent D823814


Inventors:
Buck, Jonathan E. (New Albany, IN, US)
Mongold, John A. (New Albany, IN, US)
Application Number:
29/611655
Publication Date:
07/24/2018
Filing Date:
07/24/2017
Assignee:
Samtec, Inc. (New Albany, IN, US)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
D13/123, D13/133, D13/146, D13/147, D13/154, D13/184, D13/199
View Patent Images:
US Patent References:
20180097326DIRECT-ATTACH CONNECTORApril, 2018Guetig
D768089Terminal of electric connectorOctober, 2016LiuD13/154
20140273651COUPLING TERMINAL STRUCTURE AND ELECTRICAL CONNECTOR USING THE SAMESeptember, 2014Pao439/660
20080280491Grounding Terminal for Electrical ConnectorNovember, 2008Chen439/607.05
7404740Female connectorJuly, 2008Chen439/352



Other References:
Buck et al., “Contact Wafer”, U.S. Appl. No. 29/647,260, filed May 11, 2018.
Primary Examiner:
Bui, Daniel
Attorney, Agent or Firm:
Keating & Bennett, LLP
Claims:
CLAIM

1. The ornamental design for contact wafer, as shown and described.

Description:

FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;

FIG. 2 is a top, back, and left side perspective view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a front elevation view thereof;

FIG. 6 is a back elevation view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.