Semiconductor device
United States Patent D822627

Nasu, Kentaro (Kyoto, JP)
Nishida, Kenji (Kyoto, JP)
Application Number:
Publication Date:
Filing Date:
ROHM CO., LTD. (Kyoto-shi, Kyoto, JP)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
D13/182, 257/678, 257/684, 257/690, 257/691, 361/679.01, 361/713, 361/728, 361/736, 361/760, 361/761, 361/772, 361/775, 361/783, 361/820, 174/250, 174/253, 438/15, 438/25, 438/26, 438/51, 438/55, 438/63, 438/64, 438/106
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US Patent References:
D810036Semiconductor moduleFebruary, 2018SawayanagiD13/182
D810706Semiconductor moduleFebruary, 2018SoyanoD13/182
D805485Semiconductor deviceDecember, 2017KawaseD13/182
D803171Array of triangular semiconductor diesNovember, 2017SharmaD13/182
D798832Power semiconductor deviceOctober, 2017HayashidaD13/182
D799439Power converting semiconductor moduleOctober, 2017HayashiguchiD13/182
D774479Semiconductor moduleDecember, 2016SoyanoD13/182
D772184Semiconductor moduleNovember, 2016SoyanoD13/182
D768115ModuleOctober, 2016KazanchianD13/182
D767516Semiconductor deviceSeptember, 2016YoneyamaD13/182
D762597Power semiconductor moduleAugust, 2016BertalanD13/182
D762185Power semiconductor moduleJuly, 2016MuehlensiepD13/182
D756317Layout for contact pads and connection bridges of a transponder chip moduleMay, 2016FinnD13/182
D751999Array of triangular semiconductor diceMarch, 2016SharmaD13/182
D752000Semiconductor deviceMarch, 2016VinciarelliD13/182
D739363Array of triangular semiconductor diesSeptember, 2015SharmaD13/182
D721047Semiconductor deviceJanuary, 2015VinciarelliD13/182
D648290Semiconductor deviceNovember, 2011MoriD13/182
D598380Conductive sheetAugust, 2009KurikiD13/133
D476959Semiconductor deviceJuly, 2003YamadaD13/182
D389808Hybrid integrated circuit for electric power controlJanuary, 1998YamadaD13/182
5347160Power semiconductor integrated circuit packageSeptember, 1994Sutrina257/678

Foreign References:
JP1152090September, 2002
Primary Examiner:
Oswecki, Elizabeth J.
Attorney, Agent or Firm:
Hamre, Schumann, Mueller & Larson, P.C.

1. The ornamental design for a semiconductor device, as shown and described.


FIG. 1 is a perspective view of a semiconductor device showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side view thereof; and,

FIG. 7 is a left side view thereof.

The features shown in broken lines in the drawings depict portions of the article that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.