Title:
Connection module
Document Type and Number:
United States Patent D801277

Inventors:
Druscovich, Fabrizio (Trieste, IT)
Ibba, Emilia Giuseppina (Cagliari, IT)
Vittori, Bruno (Sagrado, IT)
Application Number:
29/541863
Publication Date:
10/31/2017
Filing Date:
10/08/2015
View Patent Images:
Assignee:
Telit Technologies (Cyprus) Limited (Lamaca, CY)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
D13/133, D13/146, D13/147, D13/154, D13/156, D13/184, D13/199, D14/432, D14/433, D14/434, D14/435.1, D14/438
US Patent References:
20170141809EMBEDDED WIRELESS MODEMMay, 2017Larson
D784341Connection moduleApril, 2017KimD14/433
D784342Connection moduleApril, 2017KimD14/433
D753604Connectivity moduleApril, 2016DruscovichD13/147
D737778Connectivity moduleSeptember, 2015DruscovichD13/147
D737779Connecting modulesSeptember, 2015DruscovichD13/147
D733662Connector housing for electrical connectorJuly, 2015Harper, Jr.D13/147
6830462Electrical connector housingDecember, 2004Harper, Jr.439/330
6413110Zero insertion force socketJuly, 2002Keller439/259
Primary Examiner:
Bui, Daniel
Attorney, Agent or Firm:
Pearl Cohen Zedek Latzer Baratz LLP
Claims:
CLAIM

1. The ornamental design for a connection module, as shown and described.

Description:

FIG. 1 is a top, front, left side perspective of a first embodiment of a connection module;

FIG. 2 is a top plan view of the first embodiment;

FIG. 3 is a bottom plan view of the first embodiment;

FIG. 4 is a right side elevation view of the first embodiment;

FIG. 5 is a left side elevation view of the first embodiment;

FIG. 6 is a rear elevation view of the first embodiment;

FIG. 7 is a front elevation view of the first embodiment; and,

FIG. 8 is a bottom, rear, right side perspective of the first embodiment.

The even-broken lines shown in the drawings represent unclaimed environment and form no part of the claimed design.