Title:
Cooling device for an electronic component heat sink
Document Type and Number:
United States Patent D798831

Inventors:
Anzai, Eiji (Shizuoka, JP)
Nakamura, Takumi (Shizuoka, JP)
Application Number:
29/566047
Publication Date:
10/03/2017
Filing Date:
05/26/2016
View Patent Images:
Assignee:
NIPPON LIGHT METAL COMPANY, LTD. (Tokyo, JP)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
D13/179, D13/122, D13/182, D23/415, D23/330
US Patent References:
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Primary Examiner:
Rivard, Jennifer
Assistant Examiner:
Rivas, April
Attorney, Agent or Firm:
Oliff PLC
Claims:
CLAIM

1. The ornamental design for a cooling device for an electronic component heat sink, as shown and described.

Description:

FIG. 1 is a front, bottom, left-side perspective view of a cooling device for an electronic component heat sink showing our new design, the front, top, left-side being a mirror image thereof;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right-side elevational view thereof;

FIG. 5 is a left-side elevational view thereof;

FIG. 6 is an enlarged view of an area shown in a dashed line box labeled “6” in FIG. 2; and,

FIG. 7 is an enlarged view of an area shown in a dashed line box labeled “7” in FIG. 3.

The dashed line boxes identify areas that are enlarged, and form no part of the claimed design.