Title:
Enclosure for electronic device
United States Patent D798813
Inventors:
Marinelli, Matt Anthony (Lawrence Park, PA, US)
Krivonak, Andrew Louis (Erie, PA, US)
Murphy, Mark Allen (Erie, PA, US)
Application Number:
29/582988
Publication Date:
10/03/2017
Filing Date:
11/01/2016
Assignee:
General Electric Company (Schenectady, NY, US)
Primary Class:
Other Classes:
D13/184
International Classes:
(IPC1-7): 1303
Field of Search:
D13/110, D13/123, D13/124, D13/158, D13/162, D13/184
View Patent Images:
US Patent References:
D773394Enclosure for electronic deviceDecember, 2016MarinelliD13/110
9485884Set top box having snap-in heat sink and smart card reader with a hold down for retaining the heat sinkNovember, 2016Bose
9462731Cover structure for electronic circuit moduleOctober, 2016Onishi
D742340Enclosure for electronic deviceNovember, 2015KrivonakD13/184
20130322040ELECTRONIC CIRCUIT MODULEDecember, 2013Watanabe361/760
20110186983PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAMEAugust, 2011Hasegawa257/698
7764513High frequency tuner moduleJuly, 2010Miyamoto174/350
D556686Power module for power inverterDecember, 2007MatsuoD13/110
7050305Automotive control module housingMay, 2006Thorum165/185
20050269590Semiconductor deviceDecember, 2005Kohjiro257/99
D503149Power converterMarch, 2005TeramaeD13/110
D469059Power converterJanuary, 2003AndoD13/110
20020167828Leadframe-based module DC bus design to reduce module inductanceNovember, 2002Parkhill363/144
D466076Power converterNovember, 2002NagashimaD13/110
D464618Power converterOctober, 2002AndoD13/110
20020118521Compact, high efficiency, high isolation power amplifierAugust, 2002Kooker361/753
6222741Mounting arrangement for microwave power amplifierApril, 2001Drennen361/706
5566055Shieled enclosure for electronicsOctober, 1996Salvi, Jr.174/358
5550713Electromagnetic shielding assembly for printed circuit boardAugust, 1996Pressler174/371
5373104Control module with integral fastening/locking assemblyDecember, 1994Brauer174/562
5325072High-frequency power amplifier device and high-frequency module including the sameJune, 1994Kohjiro257/728
Primary Examiner:
Sikder, Selina
Attorney, Agent or Firm:
Global Patent Operation
Kramer, John A.
Claims:
CLAIM

1. The ornamental design for an enclosure for electronic device, as shown and described.

Description:

FIG. 1 is a perspective top view of an enclosure for electronic device depicting our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is an end view thereof;

FIG. 5 is an opposite end view thereof

FIG. 6 is a side view thereof;

FIG. 7 is an opposite side view thereof; and,

FIG. 8 is a perspective bottom view thereof.

The broken line portion of the drawings is included to show unclaimed subject matter only and forms no part of the claimed design.