Title:
Printed circuit board of solid-state memory
United States Patent D798251
Inventors:
Li, Tseng-ho (New Taipei, TW)
Lin, Chi-yu (New Taipei, TW)
Application Number:
29/583515
Publication Date:
09/26/2017
Filing Date:
11/07/2016
Assignee:
Transcend Information, Inc. (Taipei, TW)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
D13/182, 361/748, 361/752, 361/760, 361/761, 361/807, 361/749, 361/764, 361/736, 361/720, 361/722, 361/750, 361/762, 361/763, 361/751, 174/250, 174/253, 174/255, 174/68.1, 174/256, 174/257, 363/144, 363/147, 700/22, 318/567, 318/568.1
View Patent Images:
US Patent References:
D787456Substrate for an electronic circuitMay, 2017MatsumotoD13/182
D787457Substrate for an electronic circuitMay, 2017MatsumotoD13/182
D778850Substrate for an electronic circuitFebruary, 2017MatsumotoD13/182
D778851Substrate for an electronic circuitFebruary, 2017MatsumotoD13/182
D778852Substrate for an electronic circuitFebruary, 2017MatsumotoD13/182
D764424Substrate for an electronic circuitAugust, 2016MatsumotoD13/182
D757666Flexible printed circuitMay, 2016YokooD13/182
D753073Printed circuit boardApril, 2016SponringD13/182
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D427159Semiconductor elementJune, 2000ObaD13/182
Primary Examiner:
Oswecki, Elizabeth J.
Attorney, Agent or Firm:
CKC & Partners Co., Ltd.
Claims:
CLAIM

1. The ornamental design for a printed circuit board of solid-state memory, as shown and described.

Description:

FIG. 1 is a top, front, right perspective view of a printed circuit board of solid-state memory showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines represent portions of the structure that form no part of the claim.