Title:
Heater
Document Type and Number:
United States Patent D798250

Inventors:
Furutani, Hiroshi (Kanagawa-ken, JP)
Sato, Yuusuke (Tokyo, JP)
Application Number:
29/566273
Publication Date:
09/26/2017
Filing Date:
05/27/2016
View Patent Images:
Assignee:
NuFlare Technology, Inc. (Yokohama-shi, JP)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
D13/182, D9/429, D7/566, D7/570, 118/724, 118/725, 219/390, 219/544, 392/418
US Patent References:
8986456Precursor delivery systemMarch, 2015Fondurulia118/726
8933375Susceptor heater and method of heating a substrateJanuary, 2015Dunn118/724
D615937Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafersMay, 2010SatoD13/182
D616392Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafersMay, 2010SatoD13/182
D616393Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafersMay, 2010SatoD13/182
D614153Reactant source vesselApril, 2010FonduruliaD13/182
7645342Restricted radiated heating assembly for high temperature processingJanuary, 2010Emerson118/725
D604257Heater for semiconductor manufacturingNovember, 2009InatomiD13/182
D601521Heater for manufacturing semiconductorOctober, 2009KomatsuD13/182
D600220Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafersSeptember, 2009SatoD13/179
D600660Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafersSeptember, 2009SatoD13/179
D589471Heater for manufacturing semiconductorMarch, 2009KomatsuD13/182
20050217583Wafer chuck having thermal plate with interleaved heating and cooling elementsOctober, 2005Cole118/724
6616767High temperature ceramic heater assembly with RF capabilitySeptember, 2003Zhao118/725
6529686Heating member for combination heating and chilling apparatus, and methodsMarch, 2003Ramanan118/724
20020190051LOW PROFILE THICK FILM HEATERS IN MULTI-SLOT BAKE CHAMBERDecember, 2002Wang219/390
D428858Quartz fin heat retaining tubeAugust, 2000Ishii118/724
D427570Quartz fin heat retaining tubeJuly, 2000IshiiD13/182
6037574Quartz substrate heaterMarch, 2000Lanham219/390
5911896Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater elementJune, 1999Holden118/725
D405427Heat retaining tube for use in a semiconductor wafer heat processing apparatusFebruary, 1999IshiiD13/182
D405428Heat retaining tube for use in a semiconductor wafer heat processing apparatusFebruary, 1999IshiiD13/182
D404016Heat retaining tube for use in a semiconductor wafer heat processing apparatusJanuary, 1999IshiiD13/182
D404375Heat retaining tube base for use in a semiconductor wafer head processing apparatusJanuary, 1999ShimazuD13/182
5540782Heat treating apparatus having heat transmission-preventing platesJuly, 1996Miyagi118/724
Primary Examiner:
Oswecki, Elizabeth J.
Attorney, Agent or Firm:
Oblon, McClelland, Maier & Neustadt, L.L.P.
Claims:
CLAIM

1. The ornamental design for a heater, as shown and described.

Description:

FIG. 1 is a top plan view of a heater showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a back elevation view thereof;

FIG. 5 is a left side elevation view thereof; and,

FIG. 6 is a right side elevation view thereof.

The broken lines in the drawings illustrate subject matter that forms no part of the claimed design.