Triangular semiconductor die
United States Patent D763806

Sharma, Rajat (Fremont, CA, US)
Felker, Andrew (Fremont, CA, US)
Application Number:
Publication Date:
Filing Date:
SORAA, INC. (Fremont, CA, US)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
D13/110, D13/182, 257/668, 257/678, 257/690, 361/679.01, 361/713, 361/728, 361/736, 361/760, 361/761, 361/775, 361/820, 324/71.5, 324/252, 174/250, 174/253, 438/64, 438/65, 438/66
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Primary Examiner:
Oswecki, Elizabeth J.
Attorney, Agent or Firm:
Saul Ewing LLP

1. The ornamental design for triangular semiconductor die, as shown and described.


FIG. 1 is a perspective view of a triangular semiconductor die showing our new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a side elevation view thereof;

FIG. 6 is another side elevation view thereof;

FIG. 7 is another side elevation view thereof; and,

FIG. 8 is another side elevation view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.