Title:
4040-28J matrix leadframe
United States Patent D588557


Inventors:
Harnden, James (Hollister, CA, US)
Chia, Anthony (Singapore, SG)
Yang, Hongbo (Shanghai, CN)
Hui, Teng (Shanghai, CN)
Application Number:
29/292225
Publication Date:
03/17/2009
Filing Date:
10/02/2007
Assignee:
GEM Services, Inc. (Santa Clara, CA, US)
Primary Class:
International Classes:
(IPC1-7): 1303
Field of Search:
174/52.2, 174/524, 206/728, 29/622, 206/713, 257/669, 206/714, 333/185, 257/668, 257/667, 206/715, D13/182, 428/573, 206/716, 29/827, 257/666, 206/727
View Patent Images:
US Patent References:
D513608Portion of a matrix for surface mount package leadframeJanuary, 2006Harnden et al.D13/182
D505121Portion of a matrix for surface mount package leadframeMay, 2005Harnden et al.D13/182
D505122Portion of a matrix for surface mount package leadframeMay, 2005Harnden et al.D13/182
6885086Reduced copper lead frame for saw-singulated chip packageApril, 2005Fogelson et al.257/666
D494939Portion of a matrix for surface mount package leadframeAugust, 2004Harnden et al.D13/182
D491900Portion of a matrix for surface mount package leadframeJune, 2004Harnden et al.D13/182
D492266Portion of a matrix for surface mount package leadframeJune, 2004Harnden et al.D13/182
D488136Portion of a matrix for surface mount package leadframeApril, 2004Harnden et al.D13/182
D487431Portion of a matrix for surface mount package leadframeMarch, 2004Harnden et al.D13/182
D487432Portion of a matrix for surface mount package leadframeMarch, 2004Harnden et al.D13/182
D486802Portion of a matrix for surface mount package leadframeFebruary, 2004Harnden et al.D13/182
D484858Portion of a matrix for surface mount package leadframeJanuary, 2004Harnden et al.D13/182
D484859Portion of a matrix for surface mount package leadframeJanuary, 2004Harnden et al.D13/182
D485243Portion of a matrix for surface mount package leadframeJanuary, 2004Harnden et al.D13/182
D485244Portion of a matrix for surface mount package leadframeJanuary, 2004Harnden et al.D13/182
D485808Portion of a matrix for surface mount package leadframeJanuary, 2004Harnden et al.D13/182
D483336Portion of a matrix for surface mount package leadframeDecember, 2003Harnden et al.D13/182
D483337Portion of a matrix for surface mount package leadframeDecember, 2003Harnden et al.D13/182
D484103Portion of a matrix for surface mount package leadframeDecember, 2003Harnden et al.D13/182
D484104Portion of a matrix for surface mount package leadframeDecember, 2003Harnden et al.D13/182
6566740Lead frame for a semiconductor device and method of manufacturing a semiconductor deviceMay, 2003Yasunaga et al.257/670
5486722Lead frame having small pitch between outer leadsJanuary, 1996Sato et al.257/666
4870474Lead frameSeptember, 1989Karashima257/669
4846700Lead frame for semi-conductor deviceJuly, 1989Dennis439/68
D298231Lead frame for a semiconductor element or the likeOctober, 1988Kudoh et al.D13/182



Primary Examiner:
Sikder, Selina
Attorney, Agent or Firm:
Townsend and Townsend and Crew LLP
Claims:
CLAIM

1. The ornamental design for 4040-28J matrix leadframe, as shown and described.

Description:

FIG. 1 is a top plan view of a portion of a matrix incorporating a plurality of 4040-28J matrix leadframe showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the 4040-28J matrix leadframe shown in FIG. 1 for ease of illustration; and,

FIG. 3 is a perspective view of FIG. 1.